Yamaha-A5000-sam-sm(1) 维修电路原理图.pdf

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1、HAMAMATSU,JAPAN1.57K-859 I Printed in Japan2000.01 CONTENTSSPECIFICATIONS .3PANEL LAYOUT .4CIRCUIT BOARD LAYOUT .5BLOCK DIAGRAM .6DISASSEMBLY PROCEDURE .7LSI PIN DESCRIPTION .10IC BLOCK DIAGRAM .16 TEST PROGRAM .19ERROR MASSAGE .31MIDI DATA FORMAT .32MIDI IMPLEMENTATION CHART.43PARTS LISTOVERALL CIR

2、CUIT DIAGRAMCIRCUIT BOARDSSERVICE MANUALSY 011491A5000 19991210-229000A4000 19991210-149000PROFESSIONAL SAMPLERRadioFans.CN 收音机爱 好者资料库A5000/A4000IMPORTANT NOTICEThis manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has beenassumed that basic service

3、 procedures inherent to the industry, and more specifically Yamaha Products, arealready known and understood by the users, and have therefore not been restated.WARNING:Failure to follow appropriate service and safety procedures when servicing this product mayresult in personal injury, destruction of

4、 expensive components and failure of the product to perform as specified. For these reasons, we advise all Yamaha product owners that all servicerequired should be performed by an authorized Yamaha Retailer or the appointed servicerepre sentative.IMPORTANT:This presentation or sale of this manual to

5、 any individual or firm does not constitute authoriza-tion, certification, recognition of any applicable technical capabilities, or establish a principal-agent relationship of any form.The data provided is believed to be accurate and applicable to the unit(s) indicated on the cover. The researchengi

6、neering, and service departments of Yamaha are continually striving to improve Yamaha products. Modifica-tions are, therefor, inevitable and changes in specification sre subject to change without notice or obligation toretrofit. Should any discrepancy appear to exist, please contact the distributors

7、 Service Division.WARNING:Static discharges can destroy expensive components. Discharge any static electricity yourbody may have accumulated by grounding yourself to the ground buss in the unit (heavy gaugeblack wires connect to this buss).IMPORTANT:Turn the unit OFF during disassembly and parts rep

8、lacement. Recheck all work before youapply power to the unit.WARNING: CHEMICAL CONTENT NOTICE!The solder used in the production of this product contains LEAD. In addition, other electrical / electronic and / orplastic (where applicable) components may also contain traces of chemicals found by the Ca

9、lifornia Health andWelfare Agency (and possibly other entities) to cause cancer and / or birth defects or other reproductive harm.DO NOT PLACE SOLDER, ELECTRICAL / ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANYREASON WHAT SO EVER!Avoid prolonged, unprotected contact between solder and your s

10、kin! When soldering, do not inhale solder fumes orexpose eyes to solder / flux vapor!If you come in contact with solder or components located inside the enclosure of this product, wash your handsbefore handling food.WARNINGComponents having special characteristics are marked and must be replaced wit

11、h parts having specification equal to thoseoriginally installed.RadioFans.CN 收音机爱 好者资料库A5000/A40003 SPECIFICATIONTone generation methodAWM2 tone generatorMaximum Polyphony126 notes (64 notes on the A4000), 32 multi-timbre parts (16 parts on the A4000)A/D conversion20 bit 64-times oversamplingD/A con

12、version24 bit 8-times oversamplingDigital I/O (only when AIEB1 I/O expansion board is installed)Input/outputDIGITAL connectorsS/P-DIF (coaxial)OPTICAL connectorsS/P-DIF (optical)Input frequency48 kHz, 44.1 kHz, 32 kHzOutput frequency44.1 kHzSampling frequencyAnalog input44.1, 22.05, 11.025 kHz, 5.51

13、25 kHz (mono and stereo)Digital input (only when AIEB1 I/O expansion board is installed)48 kHz, 44.1 kHz, 32 kHz external synchronized recording(stereo only)1/2, 1/4 and 1/8 undersampling is supportedInternal sample memory capacityStandard4 Mbytes (installed on-board)Maximum128 Mbytes(When four 32 M

14、byte 72 pin SIMM modules are installed. The on-board 4 Mbytes are unused only if memory has been expanded to themaximum.)Sampling timeMaximum sample length32 Mbytes monaural64 Mbytes stereoMaximum sampling time (mono or stereo)6 minutes 20 seconds (44.1 kHz)12 minutes 40 seconds (22.05 kHz)25 minute

15、s 21 seconds (11.025 kHz)50 minutes 43 seconds (5.5125 kHz)Effects6 effect blocks (3 on the A4000)Total equalizer (4 bands)Sample equalizerProgram128 programSequencerReal-time recording and playbackFront panelPOWER switchINPUT L,R jacks (phone x 2)REC VOLUME (L& R shared)MASTER VOLUME (L&R shared, S

16、TEREO OUT & PHONES shared)PHONES OUTPUT jackKnobs (1 - 5)Mode buttons (PLAY, EDIT, REC, DISK, UTILITY)Function buttons (six buttons)COMMAND/EXIT buttonASSIGNABLE buttonAUDITION buttonLCD (320 x 80 dot, LED backlight)LCD contrast control3.5 2HD/2DD dual mode floppy disk driveRear panelSTEREO OUT L/MO

17、NO, R (phone jack x 2)ASSIGNABLE OUT L, R(phone jack x 2)MIDI IN-A/B, OUT, THRU-A/B (IN, OUT, THRU on the A4000)SCSI (half-pitch, 50-pin)Expansion board slotPower supply connector (AC inlet)FanDimensionsTwo-space rackmount unitW 480 mm x D 461 mm x H 90 mm (18-7/8” x 18-1/8” x 3-9/16”)Weight8.0 kg (

18、17l bs 10 oz)Included itemsPower cablex 1CD-ROM set(See the separate “Guide for the Accompanying Disks” booklet)FDx 4Power Cable for Internal Hard Disk (long)x 1Power Cable for ZIP Drive (short)x 1SCSI Cable for Internal Hard Diskx 1IDE Cable for Internal Hard Diskx 1Owners manualx 1Options (made by

19、 Yamaha)AIEB1: I/O expansion boardInternal expansion devices (made by other manufacturers)Expansion memory(use a pair of identical-size 72pin SIMM modules of the following types)Access time70 ns or lessBit Widthx 32 (no parity) or x 36 bit (parity)Fast Page or EDO, JEDEC standard.Capacity4 megabyte/

20、8 megabyte/16 megabyte/32 megabyteInternal hard disk drive (3.5 inch) performance requirementsInterface50-pin SCSI or 40-pin IDEPower supply+5 Vmaximum 840 mA+12 Vmaximum 2400 mAInternal ZIP DriveInterface40-pin IDE (ATAPI)Power supply+5 V0.8 AA5000/A40004 PANEL LAYOUT Front Panel Rear Panel 1AC inl

21、et 2Midi In-A, In-B, Out, Thru-A, Thru-B (A5000)connectors / Midi In, Out, Thru (A4000) connectors 3Assignable Out L, R jacks 4Stereo Out L/Mono, R jacks 5SCSI connector 6Optical In, Out connectors 7Digital In, Out connectors 8Assignable Out jacks 1-6 1Master Vol Master Volume 2Rec Vol Recording Vol

22、ume 3Phones jack 4Input L, Input R jacks 5LCD Contrast 6Display 7Knobs 1-5 8Mode buttons 9Function buttons F1-F6 10Command Exit button 11Assignable button 12Audition button 13Floppy Disk Drive 14Power switchA5000/A40005 CIRCUIT BOARD LAYOUTA5000/A40006 BLOCK DIAGRAM28CA1-8815099A5000/A400071.Top Cov

23、er1-1Remove the sixteen (16) screws marked 510 and slide the Top Cover to the back side. The top cover can be thenremoved. DISASSEMBLY PROCEDURE2.Circuit Boards and UnitAfter removing the top cover, remove the following screws. Each circuit board can then be removed.Note:*1 Before removing the DM, r

24、emove the HDD Assy.*2 Two for A4000.*3 Before removing the FDD Assy and the PS cover Assy, remove the Push Rod.*4 Before removing the PS and Fan Assy, remove the PS cover Assy.(Fig.1)Circuit Boards and UnitRef.No.ScrewQtyHDD BracketDM*1FDD Bracket*3PS Cover AssyPS*4Fan Assy*4220120130140150190901003

25、05060L40L50Bind Head Tapping Screw-B 3.0X6 MFZN2Y(EP600130) (fig.2)Bind Head Tapping Screw-B 3.0X6 MFZN2Y(EP600130) (fig.3)Bonding Head Screw-B 3.0X10 MFZN2BL(VQ049800)(fig.3)Bind Head Tapping Screw-P 3.0X8 MFZN2BL(EP630220) (fig.3)Pan Head Screw 2.5X6 SUS(VV342700)(fig.3)Bind Head Tapping Screw-B 3

26、.0X6 MFZN2Y(EP600130) (fig.2)Bonding Head Screw-B 3.0X10 MFZN2BL(VQ049800)(fig.2)Bind Head Tapping Screw-B 4.0X8 MFZN2BL(EG340190) (fig.2)Bind Head Tapping Screw-B 3.0X6 MFZN2Y(EP600130) (fig.3)Bind Head Tapping Screw-P 3.0X8 MFZN2BL(EP630220) (fig.2)Bind Head Tapping Screw-B 4.0X8 MFZN2BL(EG340190)

27、 (fig.3)Flat Head Screw 3.0X25 MFN133(V4814400) (fig.3)Hexagonal Nut 3.0 MFZN2Y(VA211900) (fig.3)41324(2)*2243272144A5000/A400083.Front Panel3-1Remove the knob marked 440, 450, 460.3-2Remove the three (3) screws marked 410. And remove the Front Panel from the Lower Case Assembly.(Fig.2)(Fig.3)(Fig.4

28、)A5000/A400094.Circuit Boards and UnitAfter removing the front panel, remove the following screws. Each circuit board can then be removed.(Fig.5)(Fig.5)Ref.No.ScrewQtyJKREVRPNALCDS230L170-L170S140S70S110Hexagonal Nut 14X2 M12(ES200210)Bind Head Tapping-B 3.0X6 MFZN2Y(EP600130)WasherNutBind Head Tapp

29、ing-B 3.0X6 MFZN2Y(EP600130)Bind Head Tapping-B 3.0X6 MFZN2Y(EP600130)Cup Tapping Screw-B 3.0X6 MFZN2Y(V2644100)Bind Head Tapping-B 3.0X6 MFZN2Y(EP600130)32552444Circuit Boards and UnitA5000/A400010 LSI PIN DESCRIPTION(IC507)TC203C760HF-002 (XS725A00) SWP30B (AWM Tone Generator coped with MEG) Stand

30、ard Wave ProcessorPINNO.NAMEI/OFUNCTIONPINNO.NAMEI/OFUNCTION1Vss(Ground)121VSS-(Ground)2CA0I122HMD0I/O3CA1I123HMD1I/O4CA2I124HMD2I/O5CA3I125HMD3I/O6CA4I126HMD4I/O7CA5IAddress bus of internal register127HMD5I/O8CA6I128HMD6I/OWave memory data bus (Upper 16 bits)9CA7I129HMD7I/O10CA8I130HMD8I/O11CA9I131

31、HMD9I/O12CA10I132HMD10I/O13CA11I133HMD11I/O14VSS-(Ground)134HMD12I/O15CD0I/O135HMD13I/O16CD1I/O136HMD14I/O17CD2I/O137HMD15I/O18CD3I/O138VSS-(Ground)19CD4I/O139HMA0O20CD5I/O140HMA1O21CD6I/O141HMA2O22CD7I/O142HMA3O23CD8I/OData bus of internal register143HMA4O24CD9I/O144HMA5O25CD10I/O145HMA6O26CD11I/O1

32、46HMA7O27CD12I/O147HMA8O28CD13I/O148HMA9O29CD14I/O149HMA10O30VDD-(Power supply)150VDD-(Power supply)31VSS-(Ground)151VSS-(Ground)32CD15I/O152HMA11O33CSNIChip select153HMA12OWave memory address bus34WRNIWrite strobe154HMA13O35RDNIRead strobe155HMA14O36VDD-(Power supply)156HMA15O37SYSH0O157HMA16O38SYS

33、H1O158HMA17O39SYSH2O159HMA18O40SYSH3ONSYS/LNSYS upper 16 bits output160HMA19O41SYSH4O161HMA20O42SYSH5O162HMA21O43SYSH6O163HMA22O44SYSH7O164HMA23O45KONO0O165HMA24O46KONO1OKey on data166VSS-(Ground)47KONO2O167MRASNORAS when DRAM(s) is connected to wave memory48KONO3O168MCASNOCAS when DRAM(s) is connec

34、ted to wave memory49VSS-(Ground)169MOENOWave memory output enable50SYSL0I/O170MWENOWave memory write enable51SYSL1I/O171VSS-(Ground)52SYSL2I/O172LMD0I/O53SYSL3I/ONSYS input/LNSYS output lower 8 bits173LMD1I/O54SYSL4I/O174LMD2I/O55SYSL5I/O175LMD3I/O56SYSL6I/O176LMD4I/O57SYSL7I/O177LMD5I/O58KONI0I178L

35、MD6I/O59KONI1IKey on data input179LMD7I/OWave memory data bus (Lower 16 bits)60VDD-(Power supply)180VDD-(Power supply)61VSS-(Ground)181VSS-(Ground)62KONI2I182LMD8I/O63KONI3I183LMD9I/O64DAC0ODAC output184LMD10I/O65DAC1O185LMD11I/O66WCLKODAC0/DAC1 word clock186LMD12I/O67MELO0O187LMD13I/O68MELO1O188LMD

36、14I/O69MELO2O189LMD15I/O70MELO3OMEL wave data output190VSS-(Ground)71MELO4O191LMA0O72MELO5O192LMA1O73MELO6O193LMA2O74MELO7O194LMA3O75VDD-(Power supply)195LMA4O76ADLROADC word clock196LMA5O77MELI0I197LMA6O78MELI1I198LMA7O79MELI2I199LMA8O80MELI3IMEL wave data input200LMA9O81MELI4I201LMA10O82MELI5I202L

37、MA11O83MELI6I203VSS-(Ground)84MELI7I204LMA12O85VSS-(Ground)205LMA13OWave memory address bus (Lower data memory)86RCASNODRAM column address strobe (RAS signal)206LMA14O87RA8O207LMA15O88RA7O208LMA16O89RA6O209LMA17O90VDD-(Power supply)210VDD-(Power supply)91VSS-(Ground)211VSS-(Ground)92RA5ODRAM address

38、 bus212LMA18O93RA4O213LMA19O94RA3O214LMA20O95RA2O215LMA21O96RA1O216LMA22O97RA0O217LMA23O98RRASNODRAM row address strobe (RAS signal)218LMA24O99RWENODARM write enable219VSS-(Ground)100VSS-(Ground)220SYOOSync. signal for master clock101RD7I/O221SYODOSync. signal for HCLK/QCLK102RD6I/O222QCLKO1/12 mast

39、er clock (64Fs)103RD5I/O223HCLKO1/6 master clock (128Fs)104RD4I/O224CK256O1/3 master clock (256Fs)105RD3I/O225SYSCLKO1/2 master clock (384Fs)106RD2I/O226VDD-(Power supply)107RD1I/O227SYIISync. clock108RD0I/O228MCLKIIMaster clock input109VSS-(Ground)229MCLKOOMaster clock output110RD17I/O230VDD-(Power

40、 supply)111RD16I/ODRAM data bus231XINICrystal osc. input112RD15I/O232XOUTOCrystal osc. output113RD14I/O233VSS-(Ground)114RD13I/O234ICNIInitial clear115RD12I/O235CHIP2I2 chips mode enable116RD11I/O236SLAVEIMaster/Slave select when 2 chips mode117RD10I/O237TESTONI118RD9I/O238ACINITest pin119RD8I/O239D

41、CTESTI120VDD-(Power supply)240VDD-(Power supply)A5000/A400011D65611GB-039-3B (XS323A00) ENI PIN NO. NAME I/O FUNCTION PIN NO. NAME I/O FUNCTION 1 CLRN I Clear Status 23 P3 I/O 2 E1A I Rotary Encoder 1 Input A 24 P4 I/O 3 E1B I Rotary Encoder 1 Input B 25 P5 I/O 4 E2A I Rotary Encoder 2 Input A 26 P6

42、 I/O I/O Port 5 E2B I Rotary Encoder 2 Input B 27 P7 I/O 6 E3A I Rotary Encoder 3 Input A 28 D0 I/O 7 E3B I Rotary Encoder 3 Input B 29 D1 I/O 8 E4A I Rotary Encoder 4 Input A 30 GND - Ground 9 E4B I Rotary Encoder 4 Input B 31 D2 I/O 10 E5A I Rotary Encoder 5 Input A 32 D3 I/O CPU Data Bus 11 E5B I

43、 Rotary Encoder 5 Input B 33 D4 I/O 12 E6A I Rotary Encoder 6 Input A 34 GND - Ground 13 E6B I Rotary Encoder 6 Input B 35 D5 I/O 14 E7A I Rotary Encoder 7 Input A 36 D6 I/O CPU Data Bus 15 E7B I Rotary Encoder 7 Input B 37 D7 I/O 16 VDD - Power Supply 38 GND - Ground 17 GND - Ground 39 VDD - Power

44、Supply 18 E8A I Rotary Encoder 8 Input A 40 A0 I Address Bus 19 E8B I Rotary Encoder 8 Input B 41 A1 I Address Bus 20 P0 I/O 42 WRN I Write Enable 21 P1 I/O I/O Port 43 RDN I Read Enable 22 P2 I/O 44 CSN I Chip Select D65621GF-028-3B9 (XS370A00) SMI PIN NO. NAME I/O FUNCTION PIN NO. NAME I/O FUNCTIO

45、N 1 LMA24 I 41 VDD - Power Supply 2 LMA23 I 42 L1RAS2 O RAS2 for LoMem SIMM 1 3 LMA22 I 43 L1RAS3 O RAS3 for LoMem SIMM 1 4 LMA21 I Low Memory Address 44 GND - Ground 5 LMA20 I 45 HDRAS0 O RAS for HiMem DRAM 0 6 LMA19 I 46 HDRAS1 O RAS for HiMem DRAM 1 7 LMA18 I 47 GND - Ground 8 HMA24 I 48 VDD - Po

46、wer Supply 9 HMA23 I High Memory Address 49 LDRAS0 O RAS for LoMem DRAM 0 10 HMA22 I 50 LDRAS1 O RAS for LoMem DRAM 1 11 HMA21 I 51 LMA1 I Low Memory Address 12 GND - Ground 52 LMA0 I 13 HMA20 I 53 GND - No.53 14 HMA19 I High Memory Address 54 LMA1X O Low Memory Address Exchanged 15 HMA18 I 55 LMA0X

47、 O 16 RASN I Row Address Strobe 56 GND - Ground 17 H0RAS0 O RAS0 for HiMem SIMM 0 57 VDD - Power Supply 18 H0RAS1 O RAS1 for HiMem SIMM 0 58 HMA1 I High Memory Address 19 GND - Ground 59 HMA0 I 20 H0RAS2 O RAS2 for HiMem SIMM 0 60 HMA1X O High Memory Address Exchanged 21 H0RAS3 O RAS3 for HiMem SIMM

48、 0 61 HMA0X O 22 GND - Ground 62 D0 I Data Input 23 VDD - Power Supply 63 D1 I 24 L0RAS0 O RAS0 for LoMem SIMM 0 64 GND - Ground 25 L0RAS1 O RAS1 for LoMem SIMM 0 65 D2 I 26 GND - Ground 66 D3 I Data Input 27 L0RAS2 O RAS2 for LoMem SIMM 0 67 D4 I 28 L0RAS3 O RAS3 for LoMem SIMM 0 68 D5 I 29 GND - G

49、round 69 A2 I Address 30 VDD - Power Supply 70 WRN I Write 31 H1RAS0 O RAS0 for HiMem SIMM 1 71 GND - Ground 32 H1RAS1 O RAS1 for HiMem SIMM 1 72 VDD - Power Supply 33 GND - Ground 73 CSN I Chip Select 34 VDD - Power Supply 74 A0 I Address 35 H1RAS2 O RAS2 for HiMem SIMM 1 75 A1 I 36 H1RAS3 O RAS3 f

50、or HiMem SIMM 1 76 MCLK I Clock (37MHz) 37 GND - Ground 77 SYI I Sync Clock (48kHz) 38 L1RAS0 O RAS0 for LoMem SIMM 1 78 HBANK O HiMem Bank Select 01/23 39 L1RAS1 O RAS1 for LoMem SIMM 1 79 LBANK O LoMem Bank Select 01/23 40 GND - Ground 80 REFRN O Refresh Timing (IC11)(IC516)A5000/A400012D65636GF-1