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1、CDR-HD1500 CDR-HD1500販売地域搭載、搭載。 修理依頼受際、HDD保証客様伝。There are two types of CDR-HD1500; one equippedwith a hard disc drive and the other without itdepending on market areas.When accepting a repair order from the user, be sureto inform him/her that the data in HDD cannot beguaranteed. 2005 All rights rese
2、rved. 05.04100951P.O.Box 1, Hamamatsu, JapanI CONTENTSTO SERVICE PERSONNEL . 24PREVENTION OF ELECTROSTATIC DISCHARGE . 4FRONT PANEL . 5REAR PANELS . 56REMOTE CONTROL PANEL . 6SPECIFICATIONS. 67INTERNAL VIEW . 7DISASSEMBLY PROCEDURES / 分解手順. 815SERVICE CHECK PROCEDURES /手順 . 1619INSPECTIONS / 検査. 202
3、5UPDATING FIRMWARE /更新 . 2627FORMATTING THE HDD / HDD . 27ENTERING ID TO MAIN P.C.B. /PCBID書込 . 2829DISPLAY DATA . 3031IC DATA . 3239BLOCK DIAGRAM. 40PRINTED CIRCUIT BOARD . 4144SCHEMATIC DIAGRAM . 4550PARTS LIST. 5160REMOTE CONTROL. 61Parts List for Carbon Resistors . 61SERVICE MANUALHDD/CD RECORDE
4、RCDR-HD1500IMPORTANT NOTICEThis manual has been provided for the use of authorized YAMAHA Retailers and their service personnel.It has been assumed that basic service procedures inherent to the industry, and more specifically YAMAHA Products, are alreadyknown and understood by the users, and have th
5、erefore not been restated.WARNING:Failure to follow appropriate service and safety procedures when servicing this product may result in personalinjury, destruction of expensive components, and failure of the product to perform as specified. For these reasons,we advise all YAMAHA product owners that
6、any service required should be performed by an authorizedYAMAHA Retailer or the appointed service representative.IMPORTANT:The presentation or sale of this manual to any individual or firm does not constitute authorization, certification orrecognition of any applicable technical capabilities, or est
7、ablish a principle-agent relationship of any form.The data provided is believed to be accurate and applicable to the unit(s) indicated on the cover. The research, engineering, andservice departments of YAMAHA are continually striving to improve YAMAHA products. Modifications are, therefore, inevitab
8、leand specifications are subject to change without notice or obligation to retrofit. Should any discrepancy appear to exist, pleasecontact the distributors Service Division.WARNING:Static discharges can destroy expensive components. Discharge any static electricity your body may haveaccumulated by g
9、rounding yourself to the ground buss in the unit (heavy gauge black wires connect to this buss).IMPORTANT:Turn the unit OFF during disassembly and part replacement. Recheck all work before you apply power to the unit.RadioFans.CN 收音机爱 好者资料库CDR-HD15002CDR-HD1500WALLOUTLETEQUIPMENTUNDER TESTAC LEAKAGE
10、TESTER OREQUIVALENTINSULATINGTABLEI TO SERVICE PERSONNEL1. Critical Components InformationComponents having special characteristics are marked sand must be replaced with parts having specifications equalto those originally installed.2. Leakage Current Measurement (For 120V Models Only)When service h
11、as been completed, it is imperative to verifythat all exposed conductive surfaces are properly insulatedfrom supply circuits.GMeter impedance should be equivalent to 1500 ohmsshunted by 0.15F.GLeakage current must not exceed 0.5mA.GBe sure to test for leakage with the AC plug in both polarities.本機搭載
12、基板付使用下記通。The P.C.B.s installed in this unit are soldered using thefollowing solder.About Lead Free Solder / 無鉛Side ASide BSMT REFLOW ProcessMI FLOW ProcessSolder DipSide A / A面Side B / B面MAIN P.C.B.Lead Solder / 鉛入Lead Free Solder / 無鉛OPERATION P.C.B.Lead Free Solder / 無鉛OSD P.C.B.Lead Free Solder /
13、 無鉛WCLK P.C.B.Lead Free Solder / 無鉛無鉛種類、修理時下記無鉛使用推奨。Sn+Ag+Cu (錫+銀+銅)Sn+Cu (錫+銅)Sn+Zn+Bi (錫+亜鉛+)注意: 無鉛融点温度通常鉛入比3040程度高、合使用。 鉛入使得場合、交換部品端子部周辺部無鉛取除、無鉛鉛入十分溶状態付。Among some types of lead free solder currently available,it is recommended to use one of the following types for therepair work. Sn + Ag + Cu (t
14、in + silver + copper) Sn + Cu (tin + copper) Sn + Zn + Bi (tin + zinc + bismuth)Caution:1. As the melting point temperature of the lead free solderis about 30C to 40C (50F to 70F) higher than that ofthe lead solder, be sure to use a soldering iron suitableto each solder.2. If lead solder must be use
15、d, be sure to remove lead freesolder from each terminal section of the parts to bereplaced and from the area around it completely beforesoldering, or make sure that the lead free solder andlead solder melt together fully.THE COMPACT DISC RECORDER SHOULD NOT BEADJUSTED OR REPAIRED BY ANYONE EXCEPT PR
16、OPERLYQUALIFIED SERVICE PERSONNEL.WARNING: CHEMICAL CONTENT NOTICE!The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and /or plastic(where applicable) components may also contain traces of chemicals found by the California Health and Welfare Ag
17、ency(and possibly other entities) to cause cancer and/or birth defects or other reproductive harm.DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REA-SON WHATSOEVER!Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale
18、 solder fumes or exposeeyes to solder/flux vapor!If you come in contact with solder or components located inside the enclosure of this product, wash your hands beforehandling food.RadioFans.CN 收音机爱 好者资料库CDR-HD15003CDR-HD1500CAUTIONUse of controls or adjustments or performance of procedures otherthan
19、 those specified herein may result in hazardous radiationexposure.PROTECTION OF EYES FROM LASER BEAM DURING SERVICINGThis set employs a laser. Therefore, be sure to carefullyfollow the instructions below when servicing.1. Laser Diode Properties Material: GaAlAs Wavelength: 780 to 787 nmPulse duratio
20、ns and max. output at the objective lens of the laserpickup unit DC erase mode: Max. 12 mW (Continuous) Write mode: Max. 70 mW (Max. Cycle 98 ns, Min. Cycle 27 ns at Max. Speed)2. When checking the laser diode emission, keep your eyes more than30 cm away from the objective lens.WARNING: Laser Safety
21、This product contains a laser beam component. This component may emit invisible, as well as visible radiation, which maycause eye damage. To protect your eyes and skin from laser radiation, the following precautions must be used duringservicing of the unit.1) When testing and/or repairing any compon
22、ent within the product, keep your eyes and skin more than 30 cm away fromthe laser pick-up unit at all times. Do not stare at the laser beam at any time.2) Do not attempt to readjust, disassemble or repair the laser pick-up, unless noted elsewhere in this manual.3) CAUTION: Use of controls, adjustme
23、nts or performance of procedures other than those specified herein may result inhazardous radiation exposure.Laser Emitting conditions:1. This device is a Class IIIb laser device.Class IIIb meansWith the protective case removed, exposure to the light output from the laser, either directly or reflect
24、ed by a mirror, cancause harm to the eyes, but there is no danger to the eyes from exposure to dispersed reflected laser light. (Generally 0.5W or less)2. Always wear eyeglasses designed for protection against laser light.3. Always wear gloves.4. Have no reflective objects anywhere near this device.
25、5. Figure A shows from where in this device the laser is emitted.6. When switching on the power to the device for the first time, always measure the laser power with a laser power meterand check that the power is no greater than the number of Watts in the specifications.7. Never look directly at the
26、 laser light while the laser is emitting light.8. Do not allow the laser light to shine directly on your skin while the laser is emitting light.CLASS 1 LASER PRODUCTLASER KLASSE 1 PRODUKTLUOKAN 1 LASERLAITEKLASS 1 LASER APPARTPRODUIT LASER DE CLASSE 1LINE IN LINE OUTINOUTDIGITALRECCOAXIALOPTICALCOAX
27、IALOPTICALRS232CVIDEOVIDEOOUTS VIDEOANALOGPLAYRLRL43CLASS 1 LASER PRODUCTLASER KLASSE 1 PRODUKTLUOKAN 1 LASERLAITEKLASS 1 LASER APPARTPRODUIT LASER DE CLASSE 1LINE IN LINE OUTINOUTDIGITALRECCOAXIALOPTICALCOAXIALOPTICALRS232CVIDEOVIDEOOUTS VIDEOANALOGPLAYRLRL43CLASS 1 LASER PRODUCTLASER KLASSE 1 PROD
28、UKTLUOKAN 1 LASERLAITEKLASS 1 LASER APPARTPRODUIT LASER DE CLASSE 1B, G modelsU model? ? ?Fig. ACDR-HD15004CDR-HD1500I PREVENTION OF ELECTROSTATIC DISCHARGESome semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are calledElectrostatically Sensi
29、tive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors andsemiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused byelectro static discharge (ESD).1. Immediately before handl
30、ing any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body bytouching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should beremoved for potential shock reasons prior to applying power to the u
31、nit under test.2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, toprevent electrostatic charge buildup or exposure of the assembly.3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.4. Use onl
32、y an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can generateelectrical charge sufficient to damage ES devices.5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.6. Do not r
33、emove a replacement ES device from its protective package until immediately before you are ready to install it. (Mostreplacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparableconductive material).7. Immediately before removing the pro
34、tective material from the leads of a replacement ES device, touch the protective material to thechassis or circuit assembly into which the device will be installed.CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.8. Minimize bodily motions when
35、 handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushingtogether of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage anES device).Grounding for electrostatic breakdown prevention1. Hum
36、an body grounding:Use an anti static wrist strap to discharge the static electricityfrom your body.2. Work table grounding:Put a grounded conductive material (sheet) or iron sheet onthe area where the optical pickup is placed.Caution:The static electricity of your clothes will not be groundedthrough
37、 the wrist strap. So take care not to let your clothestouch the optical pickup.1MConductive material(sheet) or steel sheetAnti-static wrist strapVARO!:AVATTAESSA JA SUOJALUKITUSOHITETTAESSA OLET ALTTIINAN K Y M T T M L L E L A S E R -STEILYLLE. L KATSO STEESEEN.VARNING!: OSYNLIG LASERSTRLNING NRDENN
38、A DEL R PPNAD OCH SPRRENR URKOPPLAD. BETRAKTA EJSTRLEN.CDR-HD15005CDR-HD1500I FRONT PANELCDR-HD1500I REAR PANELSCDR-HD1500 (U model)CDR-HD1500 (A model)CDR-HD1500 (B, G models)CDR-HD15006CDR-HD1500I REMOTE CONTROL PANELCDR-HD1500 (J model)I SPECIFICATIONS / 参考仕様AUDIO PERFORMANCE / 性能Output Level / 出
39、力 (1kHz 0dB) . 2 0.5 VrmsFrequency Characteristics / 周波数特性 (EIAJ)5Hz to 20kHz. 0.5 dBPlayback Signal to Noise Ratio / 再生SN比 (EIAJ).105 dB or morePlayback Dynamic Range / 再生 (EIAJ).99 dB or morePlayback THD + Noise / 再生歪率+雑音 (EIAJ).0.004 % or lessRecording Signal to Noise Ratio / 録音SN比 (EIAJ).92 dB o
40、r moreRecording Dynamic Range / 録音 (EIAJ).92 dB or moreRecording THD + Noise / 録音歪率+雑音 (EIAJ).0.006 % or lessINPUT/OUTPUT / 入出力仕様Line Output / 出力Output Level. 2 VrmsOutput Resistance . 990 ohmsLine Input / 入力Input Sensitivity. 500 mVrmsInput Impedance . 24 k-ohms (REC LEVEL Max.)Digital Output / 出力C
41、oaxial Output Level . 0.5 Vp-p (75 ohms)Optical Output Level . -20 dBmSampling Frequency . 44.1 kHzDigital Input / 入力Coaxial Input Level . 0.5 Vp-p (75 ohms)Optical Input Level . -20 dBmInput Gain (with Digital Volume) . 12 dBInput Gain (without Digital Volume). 0 dBSampling Frequency Tolerance.32 k
42、Hz, 44.1 kHz, 48 kHz and 96 kHzHeadphone Output / 出力 (Phones Level Max)Output Level (-20 dB, 150 ohms load) . 330 mVrmsGENERAL / 一般仕様Model / . HDD / CD recorderApplication Discs / 対応 . CDs, CD-Rs for AUDIO, CD-RWs for AUDIOHDD Capacity / HDD容量. No HDD (Support BigDrive over137GB, up to 400GB)Power S
43、upply / 電源電圧U model .AC 120 V 60 HzA model .AC 240 V 50 HzB, G models .AC 230 V 50 HzJ model . AC 100 V 50/60 HzPower Consumption / 消費電力U, A, B, G models . 37 WJ model . 32 WStandby Power Consumption / 待機時消費電力 . 0 WOperating Temperature / 動作温度 . + 5 C + 35 CMax. Dimensions / 最大寸法 (W x H x D). 435 x
44、115.5 x 414.5 mm (17-1/8 x 4-1/2 x 16-5/16)(include legs, terminals and knobs)Weight / 質量CDR-HD1500 without HDD . 8.2 kg (18 lbs. 1 oz.)Panel Color / 色Gold Color . J modelBlack Color . U, A, B, G modelsTitanium Color.B, G modelsAccessories / 付属品Remote Control x 1, Optical Cable x 1, Audio Pin Cable
45、x 2,Video Pin Cable x 1, Power Cable x 1 (U, J models), Batteries(Manganese Dry) x 2* Specifications are subject to change without notice due to productimprovements. 参考仕様外観予告変更。U . U.S.A. modelA . Australian modelB . British modelG . European modelJ. Japanese modelCDR-HD15007CDR-HD1500435 (17-1/8)10
46、0(3-15/16)15.5(5/8)115.5(4-1/2)11.5(7/16)8.3(5/16)394.7 (15-1/2)414.5 (16-5/16)Unit : mm (inch)単位: mm () DIMENSIONSI INTERNAL VIEW123 45690BCA87OSD (2) P.C.B. (U, J models)OPERATION (6) P.C.B.OPERATION (7) P.C.B.OSD (1) P.C.B.MAIN P.C.B.HDD UNITOPERATION (1) P.C.B.WCLK P.C.B.OPERATION (2) P.C.B.CD-R
47、/RW DRIVEOPERATION (3) P.C.B.OPERATION (4) P.C.B.OPERATION (5) P.C.B.1234567890ABCCDR-HD15008CDR-HD1500(Remove parts in the order as numbered.)CD-R/RW Drive ReplacementThe CD-R/RW drive must be replaced as a unit. Noneof its components can be supplied separately.After replacing the CD-R/RW drive, be
48、 sure to updatethe CD-R/RW drive firmware to the latest version.I DISASSEMBLY PROCEDURES / 分解手順1. Removal of Top Covera. Turn off the power and disconnect the power plug fromthe AC power outlet.b. Remove 4 screws (1) and 3 screws (2). (Fig. 1)c. Remove the top cover rearward while lifting it up. (Fi
49、g.1)(番号順部品取外。)CD-R/RW交換 CD-R/RW、交換。小部品部品供給。 CD-R/RW交換、CD-R/RW最新版更新。1. 取外a. 電源切、AC電源電源抜。b. 14本、23本外。 (Fig. 1)c. 持上後方外。 (Fig.1)Fig. 1112? ?CDR-HD15009CDR-HD15002. Removal of Sub Chassis Unit, Tray Guide Unitand HDD Tray Unita. Loosen 2 screws (3) and open the HDD slot door. (Fig.2)b. Remove 2 screws (
50、4). (Fig. 3)2. 、HDD取外a. 32本、HDD開。(Fig. 2)b. 42本外。 (Fig. 3)3HDD Slot DoorHDDFig. 24Fig. 3c. Remove 2 screws (5) . (Fig. 4)d. Remove CB702. (Fig. 4)e. Disconnect the IDE cable from the CDR unit. (Fig. 4)f. Lift the sub chassis unit, tray guide unit and HDD trayunit and disconnect the IDE cable connect