sony_MZ-R700G750_service_manual 维修电路图.pdf

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1、1 MZ-G750/R700 SERVICE MANUAL FM/AM PORTABLE MINIDISC RECORDER Model Name Using Similar MechanismNEW Mechanism TypeMT-MZR700-172 Optical Pick-up NameLCX-4R (Photo: MZ-G750) MD recorder Audio playing system MiniDisc digital audio system Laser diode properties Material: GaAlAs MQW Wavelength: = 790 nm

2、 Emission duration: continuous Laser output: less than 44.6 W (This output is the value measured at a distance of 200 mm from the lens surface on the optical pick-up block with 7 mm aperture.) Recording and playback time When using MDW-80 Maximum 160 min. in monaural Maximum 320 min. in stereo Revol

3、utions 350 rpm to 2,800 rpm (CLV) Error correction ACIRC (Advanced Cross Interleave Reed Solomon Code) Sampling frequency 44.1 kHz Sampling rate converter Input: 32 kHz/44.1 kHz/48 kHz Coding ATRAC (Adaptive TRansform Acoustic Coding) ATRAC3-LP2 ATRAC3-LP4 SPECIFICATIONS Modulation system EFM (Eight

4、 to Fourteen Modulation) Number of channels 2 stereo channels 1 monaural channel Frequency response 20 to 20,000 Hz 3 dB Wow and Flutter Below measurable limit Inputs Microphone: stereo mini-jack, minimum input level 0.25 mV Line in: stereo mini-jack, minimum input level 49 mV Optical (Digital) in:

5、optical (digital) mini- jack Outputs i: stereo mini-jack, maximum output level 5 mW + 5 mW, load impedance 16 ohm Radio (MZ-G750) Frequency range AM: 530-1,710 kHz (US,Canada, and Central and South America models) 531-1,602 kHz (Other models) FM: 87.5-108.0 MHz General Power requirements Sony AC Pow

6、er Adaptor (supplied) connected at the DC IN 3 V jack: 120 V AC, 60 Hz (U.S.A.,Canadian and Taiwan model) 230 V AC, 50/60 Hz (AEP model) 240 V AC, 50 Hz (Australian model) 220 V AC, 50 Hz (Chinese model) 230-240 V AC, 50 Hz (UK and Hong Kong model) 220 V AC, 50 Hz (Argentina model) 110/220 V AC, 60

7、Hz (Korean model) 100-240 V AC, 50/60 Hz (Other models) Nickel cadmium rechargeable battery NC-WMAA (supplied) LR6 (size AA) alkaline battery (not supplied) Continued on next page US Model Canadian Model AEP Model UK Model E Model Australian Model Tourist Model Chinese Model US and foreign patents l

8、icensed from Dolby Laboratories Licensing Corporation. Ver 1.0 2001. 01 MZ-G750 PORTABLE MINIDISC RECORDER MZ-R700 Ver 1.1 2001. 02 Sony Corporation Audio Entertainment Group General Engineering Dept. 9-873-045-12 2001B0400-1 2001. 2 收音机爱好者资料库 Ra d i o Fa n s .CN 2 Flexible Circuit Board Repairing K

9、eep the temperature of the soldering iron around 270C during repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement Never reuse a disconn

10、ected chip component. Notice that the minus side of a tantalum capacitor may be damaged by heat. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Battery operation time Battery life1) (MZ-G750) When reco

11、rding2)(Unit: approx.hours) (EIAJ3) BatteriesStereoLP2LP4 NC-WMAA Nickel Cadmium467.5 rechargeable battery4) LR6 (SG) Sony alkaline dry96)136)166) battery5) 1)The battery life may be shorter due to operating conditions and the temperature of the location. 2)When you record, use a fully charged recha

12、rgeable battery. 3)Measured in accordance with the EIAJ (Electronic Industries Association of Japan) standard. 4)When using a 100% fully charged rechargeable battery. 5)When using a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan). 6)Recording time may differ according to the alkalin

13、e batteries. When playing(Unit: approx.hours) (EIAJ1) BatteriesStereoLP2LP4 NC-WMAA Nickel Cadmium11.51416 rechargeable battery2) LR6 (SG) Sony alkaline dry364248 battery3) 1)Measured in accordance with the EIAJ (Electronic Industries Association of Japan) standard. 2)When using a 100% fully charged

14、 rechargeable battery. 3)When using a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan). When using the radio(EIAJ1) BatteriesApprox. hours NC-WMAA Nickel Cadmium rechargeable9.5 battery2) LR6 (SG) Sony alkaline dry battery3)28.5 1) Measured in accordance with the EIAJ (Electronic Ind

15、ustries Association of Japan) standard. 2)When using a 100% fully charged rechargeable battery. 3)When using a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan). Battery life1) (MZ-R700)(Unit: approx.hours) (EIAJ2) BatteriesStereoLP2LP4 NC-WMAA Nickel CadmiumRecording467.5 rechargeabl

16、e battery3)Playback1314.518 LR6 (SG) Sony alkaline dryRecording91316 battery4)Playback404653 1)The battery life may be shorter due to operating conditions and the temperature of the location. 2)Measured in accordance with the EIAJ (Electronic Industries Association of Japan) standard. 3)When using a

17、 100% fully charged rechargeable battery. 4)When using a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan). Dimensions Approx. 81 28.1 74.4 mm (w/h/d) (3 1/4 1 1/8 3 in.) without projections. Mass Approx. 118 g (4.2 oz) the recorder only (MZ-G750) Approx. 116 g (4.1 oz) the recorder o

18、nly (MZ-R700) Supplied accessories AC power adaptor (1) Headphones/earphones with a remote control (1) Optical cable (1) NC-WMAA nickel cadmium rechargeable battery (1) Rechargeable battery carrying case (1) Carrying pouch/carrying case with a belt clip (except U.S.A model) (1) Design and specificat

19、ions are subject to change without notice. SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS

20、MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. MZ-G750/R700 ATTENTION AU COMPOSANT AYANT RAPPORT LA SCURIT! LES COMPOSANTS IDENTIFIS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHMATIQUES ET LA LISTE DES PICES SONT CRITIQUES POUR LA SCURIT DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PICES SONY

21、DONT LES NUMROS SONT DONNS DANS CE MANUEL OU DANS LES SUPPLMENTS PUBLIS PAR SONY. 收音机爱好者资料库 Ra d i o Fa n s .CN 3 1.SERVICING NOTE. 4 2.GENERAL Looking at the Controls (MZ-G750). 5 Looking at the Controls (MZ-R700). 6 3.DISASSEMBLY 3-1. Panel Assy, Lower. 7 3-2. Panel Assy, Upper . 7 3-3. LCD Module

22、 . 8 3-4. Main Board . 8 3-5. MD Mechanism Deck . 9 3-6. Service Assy, OP . 9 3-7. Holder Assy.10 3-8. Motor Flexible Board . 10 3-9. Motor, DC (M602) . 11 3-10. “Motor, DC (M601)”, “Motor, DC (M603)” . 11 4.TEST MODE 4-1. Outline.12 4-2. Setting Method of Test Mode. 12 4-3. Operation in Setting the

23、 Test Mode.12 4-4. Releasing the Test Mode .12 4-5. Configuration of Test Mode . 13 4-6. Manual Mode . 13 4-7. Overall Adjustment Mode . 14 4-8. Self-Diagnosis Result Display Mode . 14 4-9. Result the Error Display Code . 15 4-10. Sound Skip Check Result Display Mode . 16 4-11. Key Check Mode.16 TAB

24、LE OF CONTENTS 5.ELECTRICAL ADJUSTMENTS 5-1. Outline.18 5-2. Precautions for Adjustment .18 5-3. Adjustment Sequence . 18 5-4. NV Reset .18 5-5. Power Supply Manual Adjustment. 19 5-6. Temperature Correction. 20 5-7. Laser Power Check .20 5-8. Overall Adjustment Mode . 21 5-9. Resume Clear . 23 5-10

25、. Patch Data Rewriting when Nonvolatile Memory was Replaced.23 6.DIAGRAMS 6-1. IC Pin Function Description . 29 6-2. Block Diagram Servo Section . 35 6-3. Block Diagram Audio Section . 36 6-4. Block Diagram System Control/Power Section .37 6-5. Printed Wiring Board Main Section . 38 6-6. Schematic D

26、iagram Main Section (1/3) .41 6-7. Schematic Diagram Main Section (2/3) .42 6-8. Schematic Diagram Main Section (3/3) .43 7.EXPLODED VIEWS 7-1. Panel Section. 47 7-2. Chassis Section . 48 7-3. MD Mechanism Deck Section .49 8.ELECTRICAL PARTS LIST.50 MZ-G750/R700 收音机爱好者资料库 Ra d i o Fa n s .CN 4 MZ-G7

27、50/R700 SECTION 1 SERVICING NOTE NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During re

28、pair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right above

29、when checking it for adjustment. It is feared that you will lose your sight. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (LCX-4R) The laser diode in the optical pick-up block may suffer electro- static break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible boa

30、rd. Also perform mea- sures against electrostatic break-down sufficiently before the op- eration. The flexible board is easily damaged and should be handled with care. OPTICAL PICK-UP FLEXIBLE BOARD In performing the repair with the power supplied to the set, removing the MAIN board causes the set t

31、o be disabled. In such a case, fix a convex part of the open/close detect switch (S806 on MAIN board) with a tape in advance. Handle the FLEXIBLE board (overwrite head) with care, as it has been soldered directly to the MAIN board. In repairing the component side of MAIN board, connect the FLEXIBLE

32、board (overwrite head) and the MAIN board with the lead wires in advance. (See page 8) Replacement of CDX2671-204GA (IC801) used in this set requires a special tool. On the set having the microcomputer version 1.000, some adjusted values were set in the manual mode at the shipment, but these data wi

33、ll be cleared when the NV is reset. Therefore, on the set having the microcomputer version 1.000, change the adjusted values following the Change of Adjusted Values immediately after the NV was reset. (See page 18) If the nonvolatile memory was replaced on the set, the modified program data must be

34、written to the nonvolatile memory. In such a case, write the modified data that meets the microcomputer version following the patch data rewriting procedure at the replacement of nonvolatile memory. (See page 23) laser-tap S806 MAIN board FLEXIBLE board (Over write head) Tape panel assy, upper 5 MZ-

35、G750/R700 SECTION 2 GENERAL This section is extracted from instruction manual. (MZ-G750) 6 MZ-G750/R700 (MZ-R700) 7 MZ-G750/R700 SetPanel Assy,LowerPanel Assy, UpperLCD Module Main BoardMD Mechanism Deck Service Assy, OP Motor Flexible Board Holder Assy Motor, DC (M602) Motor, DC (M601), Motor, DC (

36、M603) Note : This set can be disassemble according to the following sequence. SECTION 3 DISASSEMBLY 3-1. PANEL ASSY, LOWER 3-2. PANEL ASSY, UPPER Note : Follow the disassembly procedure in the numerical order given. 1screws (1.4x2.0), MI 2screws (1.4x2.0), MI 3panel assy, upper 4CN801 2screws (1.4x2

37、.0), MI 3screws (1.4x2.0), MI 6Panel Assy , Lower 4claw 1 5 8 MZ-G750/R700 3-3. LCD MODULE 3-4. MAIN BOARD 1screws (1.7x2.5) 4LCD module claws panel assy, upper 2screws (1.7x2.5) 3 3screws (M1.4x2) 6Remove the solders 7 9Remove the solder q;case assy, battery qsspring, battery coil qdMAIN board qaRe

38、move the solder 4screws (M1.7x3) 5screws (M1.4x2) 1CN502 2arm 8CN501 9 MZ-G750/R700 3-5. MD MECHANISM DECK 3-6. SERVICE ASSY, OP 1screws (1.4x1.6), MI 2chassis assy, set 3MD mechanism deck boss boss 4spring(s), pack 6spring, thrust detent 3screw(M1.4), precision pan 5screw(M1.4), precision pan 1wash

39、er (0.8 - 2.5) 2gear (SA) 8Pull off the lead screw. 7 B A 9Opening the over write head toward the direction A, remove the OP Service assy toward the direction B. Note: Do not open the entire assy forcibly, when opening the over write head. over write head section 10 MZ-G750/R700 3-7. HOLDER ASSY 2Re

40、move two solders of DC motor (over write head up/down) (M603). 1Remove four solders of DC motor (sled) (M602). 3Remove four solders of DC motor (spindle) (M601). DC motor (sled) circular hole 5motor flexible board 4adhesive sheet Note: Align a circular hole in the stripping paper with a circular hol

41、e in the DC motor (sled), when mounting the motor flexible board. 3-8. MOTOR FLEXIBLE BOARD 4Remove the holder assy to direction of the arrow B. 1Open the holder assy. A 2 B 3boss 11 MZ-G750/R700 4two screws(M1.4), precision pan 5moter, DC (sled) (M602) 3Remove four solders of motor flexible board.

42、1washer (0.8 - 2.5) 2gear (SA) 1Remove six solders of motor flexible board. 4three screws(M1.4), precision pan qsmoter, DC (over write head up/down) (M603) 6two screws(M1.4), precision pan qachassis assy, gear 0screw (M1.2 1.5) 9gear (HA) 8gear (HB) 7washer (0.8 - 2.5) 2washer (0.8 - 2.5) 3gear (HC) 5moter, DC (spindle) (M601) DC motor (over write head up/down) (M603