sony_MZ-R500+R500PC_service_manual 维修电路图.pdf

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1、1 MZ-R500/R500PC SERVICE MANUAL Model Name Using Similar MechanismNEW Mechanism TypeMT-MZR500-172 Optical Pick-up NameLCX-4R System Audio playing system MiniDisc digital audio system Laser diode properties Material: GaAlAs Wavelength: = 790 nm Emission duration: continuous Laser output: less than 44

2、.6 W (This output is the value measured at a distance of 200 mm from the lens surface on the optical pick-up block with 7 mm aperture.) Recording and playback time When using MDW-80 Maximum 160 min. in monaural Maximum 320 min. in stereo Revolutions 350 rpm to 2,800 rpm (CLV) Error correction ACIRC

3、(Advanced Cross Interleave Reed Solomon Code) Sampling frequency 44.1 kHz Sampling rate converter Input: 32 kHz/44.1 kHz/48 kHz Coding ATRAC (Adaptive TRansform Acoustic Coding) ATRAC3-LP2 ATRAC3-LP4 SPECIFICATIONS Modulation system EFM (Eight to Fourteen Modulation) Number of channels 2 stereo chan

4、nels 1 monaural channel Frequency response 20 to 20,000 Hz 3 dB Wow and Flutter Below measurable limit Inputs Line in: stereo mini-jack, minimum input level 49 mV Optical (Digital) in: optical (digital) mini- jack Outputs i: stereo mini-jack, maximum output level 5 mW + 5 mW, load impedance 16 ohm G

5、eneral Power requirements Sony AC Power adaptor connected at the DC IN 3 V jack (AEP, Chinese and Argentine models only): 230 V AC, 50/60 Hz (AEP model) 220 V AC, 50 Hz (Chinese model) 220 V AC, 50 Hz (Argentine model) One LR6 (size AA) alkaline dry battery (not supplied) Continued on next page US M

6、odel Canadian Model MZ-R500/R500PC AEP Model UK Model E Model Chinese Model MZ-R500 US and foreign patents licensed from Dolby Laboratories Licensing Corporation. Ver 1.0 2001. 01 PORTABLE MINIDISC RECORDER Ver 1.0 2001. 06 Sony Corporation Personal Audio Company Shinagawa Tec Service Manual Product

7、ion Group 9-873-177-01 2001F0400-1 2001. 6 Photo: MZ-R500 This service manual contains the information on the MZ-R500 (9-873-054-11). 收音机爱好者资料库 Ra d i o Fa n s .CN 2 Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270C during repairing. Do not touch the soldering i

8、ron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be damaged by heat. CAU

9、TION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Battery operation time Battery life1)(Unit: approx.hours) (EIAJ2) LR6 (SG) alkaline dry battery3)NormalLP2LP4 Recording4)7.51013.5 Playback364248 1)The batte

10、ry life may be shorter due to operating conditions, the temperature of the location, and varieties of batteries. 2)Measured in accordance with the EIAJ (Electronic Industries Association of Japan) standard. 3)When using a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan). 4)To prevent

11、 interrupted recording due to drained battery, use new battery for recording operations. Dimensions Approx. 83.0 27.8 75.8 mm (w/h/d) (3 3/8 1 1/8 3 in.) without projections. Mass Approx. 113 g (4.0 oz) the recorder only Supplied accessories AC power adaptor (AEP, Chinese and Argentine models only)

12、(1) Headphones/earphones (1) Optical cable (AEP, Chinese and Argentine models only) (1) Design and specifications are subject to change without notice. SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRI

13、TICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. MZ-R500/R500PC ATTENTION AU COMPOSANT AYANT RAPPORT LA SCURIT! LES COMPOSANTS IDENTIFIS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHMATIQUES ET LA LISTE

14、 DES PICES SONT CRITIQUES POUR LA SCURIT DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PICES SONY DONT LES NUMROS SONT DONNS DANS CE MANUEL OU DANS LES SUPPLMENTS PUBLIS PAR SONY. 收音机爱好者资料库 Ra d i o Fa n s .CN 3 1.SERVICING NOTE. 4 2.GENERAL Looking at the Controls . 5 Record an MD. 5 P

15、laying an MD right away . 6 3.DISASSEMBLY 3-1. Case (Lower) Assy . 7 3-2. Case (Upper) Assy . 7 3-3. LCD Module . 8 3-4. Main Board . 8 3-5. MD Mechanism Deck . 9 3-6. Service Assy, OP . 9 3-7. Holder Assy.10 3-8. Motor Flexible Board . 10 3-9. Motor, DC (M602) . 11 3-10. “Motor, DC (M601)”, “Motor,

16、 DC (M603)” . 11 4.TEST MODE 4-1. Outline.12 4-2. Setting Method of Test Mode. 12 4-3. Operation in Setting the Test Mode.12 4-4. Releasing the Test Mode .12 4-5. Configuration of Test Mode . 13 4-6. Manual Mode . 13 4-7. Overall Adjustment Mode . 14 4-8. Self-Diagnosis Result Display Mode . 14 4-9.

17、 Reset the Error Display Code. 15 4-10. Sound Skip Check Result Display Mode . 16 4-11. Key Check Mode.16 TABLE OF CONTENTS 5.ELECTRICAL ADJUSTMENTS 5-1. Outline.18 5-2. Precautions for Adjustment .18 5-3. Adjustment Sequence . 18 5-4. NV Reset .18 5-5. Power Supply Manual Adjustment. 19 5-6. Temper

18、ature Correction. 20 5-7. Laser Power Check .20 5-8. Overall Adjustment Mode . 21 5-9. Resume Clear . 23 5-10. Patch Data Rewriting when Nonvolatile Memory was Replaced.23 6.DIAGRAMS 6-1. IC Pin Function Description . 30 6-2. Block Diagram Servo Section . 36 6-3. Block Diagram Audio Section . 37 6-4

19、. Block Diagram System Control/Power Section .38 6-5. Printed Wiring Board Main Section . 40 6-6. Schematic Diagram Main Section (1/3) .42 6-7. Schematic Diagram Main Section (2/3) .43 6-8. Schematic Diagram Main Section (3/3) .44 7.EXPLODED VIEWS 7-1. Case (Lower) Section. 49 7-2. Case (Upper) Sect

20、ion . 50 7-3. Chassis Section . 51 7-4. MD Mechanism Deck Section .52 8.ELECTRICAL PARTS LIST.53 MZ-R500/R500PC 收音机爱好者资料库 Ra d i o Fa n s .CN 4 MZ-R500/R500PC SECTION 1 SERVICING NOTE NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer ele

21、ctro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible

22、board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (LCX-4R) The laser diode in

23、the optical pick-up block may suffer electro- static break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform mea- sures against electrostatic break-down sufficiently before the op- eration. The flexible board is easily damaged and should be

24、handled with care. OPTICAL PICK-UP FLEXIBLE BOARD In performing the repair with the power supplied to the set, removing the MAIN board causes the set to be disabled. In such a case, fix a convex part of the open/close detect switch (S806 on MAIN board) with a tape in advance. Handle the FLEXIBLE boa

25、rd (overwrite head) with care, as it has been soldered directly to the MAIN board. In repairing the component side of MAIN board, connect the FLEXIBLE board (overwrite head) and the MAIN board with the lead wires in advance. (See page 8) Replacement of CDX2671-204GA (IC801) used in this set requires

26、 a special tool. On the set having the microcomputer version 1.000, some adjusted values were set in the manual mode at the shipment, but these data will be cleared when the NV is reset. Therefore, on the set having the microcomputer version 1.000, change the adjusted values following the Change of

27、Adjusted Values immediately after the NV was reset. (See page 18) If the nonvolatile memory was replaced on the set, the modified program data must be written to the nonvolatile memory. In such a case, write the modified data that meets the microcomputer version following the patch data rewriting pr

28、ocedure at the replacement of nonvolatile memory. (See page 23) laser-tap S806 MAIN board FLEXIBLE board (Over write head) Tape panel assy, upper 5 MZ-R500/R500PC SECTION 2 GENERAL This section is extracted from instruction manual. 6 MZ-R500/R500PC 7 MZ-R500/R500PC Note : This set can be disassemble

29、 according to the following sequence. SECTION 3 DISASSEMBLY 3-1. CASE (LOWER) ASSY 3-2. CASE (UPPER) ASSY Note : Follow the disassembly procedure in the numerical order given. SetCase (Lower) AssyCase (Upper) AssyLCD Module Main BoardMD Mechanism Deck Service Assy, OP Motor Flexible Board Holder Ass

30、y Motor, DC (M602) Motor, DC (M601), Motor, DC (M603) 2screw (1.7), MI 1screw (1.7), MI 3screws (1.7), MI knob (hold) 6case(lower) assy 4claw 5 1screws (1.7), MI 3case (upper) assy 2CN801 4spring (pop-L), torsion spring (pop-L), torsion chassis assy 8 MZ-R500/R500PC 3-3. LCD MODULE 3-4. MAIN BOARD 1

31、screws (1.7x3), tapping 4LCD module case (upper) assy 2screws (1.7x3), tapping 3 3screws (M1.4x2), toothed lock 4screws (M1.4x2), toothed lock 6 2Remove the solders 9Remove the solder qaRemove the solder 0terminal (+), battery qsterminal (-), battery 1CN701 8MAIN board 7CN501 5screw (M1.4x2), toothe

32、d lock 9 MZ-R500/R500PC 3-5. MD MECHANISM DECK 3-6. SERVICE ASSY, OP 1screws (1.7), MI 2chassis assy, set boss 3MD mechanism deck 4rack spring (S) 6spring, thrust detent 3precision pan screw (M1.4) 5precision pan screw (M1.4) 1washer (0.8 - 2.5) 2gear (SA) 8Pull off the lead screw. 7 B A 9Opening th

33、e over write head toward the direction A, remove the OP Service assy toward the direction B. Note: Do not open the entire assy forcibly, when opening the over write head. over write head section 10 MZ-R500/R500PC 3-7. HOLDER ASSY 3-8. MOTOR FLEXIBLE BOARD 4Remove the holder assy to direction of the

34、arrow B. 1Open the holder assy. A 2 B 3boss 2Remove two solders of DC motor (over write head up/down) (M603). 1Remove four solders of DC motor (sled) (M602). 3Remove four solders of DC motor (spindle) (M601). 5motor flexible board 4adhesive sheet Note: Align a circular hole in the stripping paper wi

35、th a circular hole in the DC motor (sled), when mounting the motor flexible board. 11 MZ-R500/R500PC 3-9. MOTOR, DC (M602) 3-10. “MOTOR, DC (M601)”, “MOTOR, DC (M603)” 4two precision pan screws (M1.4) 5DC motor (sled) (M602) 1Remove four solders of motor flexible board. 2washer (0.8 - 2.5) 3gear (SA

36、) 1Remove six solders of motor flexible board. 4three precision pan screws (M1.4) qsDC motor (over write head up/down) (M603) 6two precision pan screws (M1.4) qachassis assy, gear 0screw (M1.2 1.5) 9gear (HA) 8gear (HB) 7washer (0.8 - 2.5) 2washer (0.8 - 2.5) 3gear (HC) 5DC motor (spindle) (M601) DC

37、 motor (over write head up/down) (M603) gear chassis assy gear (HA) 2.65 mm Note: Press-fit the gear (HA) up to the position of the DC motor (over write head up/down) (M603) as shown below. 12 MZ-R500/R500PC 2 In the normal mode, turn on the HOLD switch. While press- ing the VOL - key press the foll

38、owing order: tt.t.tt .t t.tXtX SECTION 4 TEST MODE 4-3. Operation in Setting the Test Mode When the test mode becomes active, first the display check mode is selected. Other mode can be selected from the display check mode. When the test mode is set, the LCD repeats the following dis- play. When the

39、Xkey is pressed and hold down, the display at that time is held so that display can be checked. Caution: On the set having the microcomputer version 1.000, some adjusted values were set in the manual mode at the shipment, but these data will be cleared when the NV is reset. Therefore, on the set hav

40、ing the micro- computer version 1.000, change the adjusted values following the Change of Adjusted Values immediately after the NV was reset (see page 18). 4-4. Releasing the Test Mode For test mode set with the method 1: Turn off the power and open the solder bridge on TAP801 (TEST) on the MAIN boa

41、rd. Note: Remove the solders completely. Remaining could be shorted with the chassis, etc. For test mode set with the method 2: Turn off the power. Note: If electrical adjustment (see page 18) has not been finished completely, always start in the test mode. (The set cannot start in normal mode) 4-1. Outline This set provides the Overall adjustment mode that allows CD and MO discs to be automatically adjusted when in the test mode. In this overall adjustment mode, the disc is discriminate between CD and MO, and each