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1、MDCT-1000 US ModelSERVICE MANUAL MD CONFER-TRANSCRIBER Sony Corporation Personal Audio Company Shinagawa Tec Service Manual Production Group 9-873-186-02 2001G1600-1 2001.7 SPECIFICATIONS Ver 1.1 2001. 07 US and foreign patents licensed from Dolby Laboratories Licensing Corporation Model Name Using
2、Similar MechanismMDCC-2000 MD Mechanism TypeCCMD-2000 Optical Pick-up Mechanism TypeKMS-250A Laser diode properties Material: GaAlAs Wavelength: 780 nm Emission duration: Continuous Laser output: Less than 44.6 W (This output is the value measured at a distance of about 200 mm from the lens surface
3、on the optical pick-up block with 7 mm aperture.) Revolutions 400 rpm to 1,800 rpm (CLV) Error correction Advanced Cross Interleave Reed Solomon Code (ACIRC) Sampling frequency 44.1 kHz Coding ATRAC 3 (Adaptive TRansform Acoustic Coding 3) Modulation system EFM (Eight to Fourteen Modulation) Number
4、of channels 2 or 4 monaural channels Frequency response 5010,000 Hz Speaker Approx. 5.0 cm (2 inches) dia. Power output 600 mW (at 10% distortion) Output EAR (minijack) for 8300 earphones Other connector CONTROL UNIT connector Power requirements 12 V DC DC IN 12V jack accepts the supplied AC power a
5、daptor for use on 120 V AC, 60 Hz Dimensions Approx. 320 x 280 x 118 mm (w/h/d) (1258 x 1118 x 434 inches) including projecting parts and controls Mass Approx. 3.7 kg (8 lb 3 oz) Accessories supplied AC power adaptor (1) AC power cord (1) Design and specifications are subject to change without notic
6、e. 收音机爱好者资料库 Ra d i o Fa n s .CN 2 MDCT-1000 1. GENERAL 4 2. DISASSEMBLY 2-1.Cabinet(Upper) Section 6 2-2.Switch Section 7 2-3.LCD Section 7 2-4.MD Section 8 2-5.Volume Section 8 2-6.Main Board 9 2-7.Door 10 2-8.MD Board 10 2-9.Base Unit Section 11 2-10. BUM-F1 Board 11 2-11. REC/PB Head Assy (HR901
7、) Section 12 2-12. Holder Assy, Cartridge Section 12 2-13. Holder Assy, Cartridge Installation 13 2-14. Optical Pick-Up (KMS-250A) Section 13 3. TEST MODE 14 4. ELECTRICAL ADJUSTMENTS 26 5. DIAGRAMS 5-1.Circuit Boards Location 27 5-2.Block Diagrams 28 MD Section 28 I/O Section 29 FIFO Section 30 CPU
8、 Section 31 LCD Section 32 5-3.Printed Wiring Board MD Section 33 5-4.Schematic Diagram MD Section (1/4) 34 5-5.Schematic Diagram MD Section (2/4) 35 5-6.Schematic Diagram MD Section (3/4) 36 5-7.Schematic Diagram MD Section (4/4) 37 5-8.Schematic Diagram BUM Section 38 5-9.Printed Wiring Board BUM
9、Section 39 TABLE OF CONTENTS 5-10. Schematic Diagram Main Section (1/11) 40 5-11. Schematic Diagram Main Section (2/11) 41 5-12. Schematic Diagram Main Section (3/11) 42 5-13. Schematic Diagram Main Section (4/11) 43 5-14. Schematic Diagram Main Section (5/11) 44 5-15. Schematic Diagram Main Section
10、 (6/11) 45 5-16. Schematic Diagram Main Section (7/11) 46 5-17. Schematic Diagram Main Section (8/11) 47 5-18. Schematic Diagram Main Section (9/11) 48 5-19. Schematic Diagram Main Section (10/11) 49 5-20. Schematic Diagram Main Section (11/11) 50 5-21. Printed Wiring Board Main Section 51 Main Sect
11、ion (1/4) 52 Main Section (2/4) 53 Main Section (3/4) 54 Main Section (4/4) 55 5-22. Schematic Diagram Audio Section 56 5-23. Printed Wiring Board Audio Section 57 5-24. Schematic Diagram Level Meter Section 58 5-25. Printed Wiring Board Level Meter Section 59 5-26. Schematic Diagram LCD Section 60
12、5-27. Printed Wiring Board LCD Section 61 5-28. Schematic Diagram Switch Section 62 5-29. Printed Wiring Board Switch Section 63 5-30. Schematic Diagram Foot Switch Section 64 5-31. Printed Wiring Board Foot Switch Section 65 5-32. IC Pin Function Description 66 5-37. IC Block Diagrams 69 6. EXPLODE
13、D VIEWS 6-1.Cabinet Section 76 6-2.Key Section 77 6-3.LCD Section 78 6-4.MD Mechanism Section (CCMD-2000) 79 7. ELECTRICAL PARTS LIST 80 SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OP
14、ERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270C during repairing. Do not touch the soldering iron on the same conductor of
15、the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be dam- aged by heat. CAUTION Use of controls or adj
16、ustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated
17、by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASE
18、R DIODE EMISSION CHECK Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight. 收音机爱好者资料库 Ra d i o Fa n s .CN 3 MDCT-1000 Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) in
19、dicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. Unleaded solder melts at a temperature about 40C higher than ordinary solder. Or
20、dinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be c
21、areful! Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary sold
22、er. 收音机爱好者资料库 Ra d i o Fa n s .CN 4 MDCT-1000 SECTION 1 GENERALThis section is extracted from instruction manual. Location and Function of Controls For details, refer to the pages indicated in ( ). 1 LCD display 2 3 Built-in speaker MONITOR VOL control 4 LCD CONTRAST control Adjusts the contrast of
23、the display. 5 MONITOR select buttons (ALL/1/2/3/4) (8) 6 STANDBY switch 7 MD insertion slot 8 Z EJECT button 9 FUNCTION button q; DISP MODE button (10) qa Arrow buttons qs ENTER button qd Jog dial qf x STOP button qg m REW/BS button qh u PLAY/PAUSE button qj M FF/FS button Left side Rear qk CONTROL
24、 UNIT connector (11) ql EAR jack (8) w; DC IN 12V jack (7) 5 MDCT-1000 1 Status display (17) Indicates the disc inserted in or the status of deck as follows: BLANK: a blank disc NO DISC: no disc PB ONLY: a commercially available recorded disc (for playback only) PROTECTED: a protected disc RECORDED:
25、 a recorded disc 2 3 TIME display Indicates the recorded time at the current location for each index item. (copied) display Indicates that a disc digitally copied on MDCC- 2000 is inserted. 4 INDEX counter Lights up when a disc is inserted. Blinks during an index search. (9) 5 END display This shows
26、 the end of the disc. 6 Disc status display Indicates the status of the disc with pictures. 7 Message display Indicates various data by characters and various error messages. (17) 8 Disc position display Indicates the current playback location on the disc by a white box. Already recorded parts are i
27、ndicated in black. The further it is to the right, the closer the disc is to the end. Depending on the condition of the disc, the black part might not reach the far right even if the disc is full. Display Window (Information screen) 1 2 3 4 5 6 7 8 6 MDCT-1000 SECTION 2 DISASSEMBLY The equipment can
28、 be removed using the following procedure. Disassemble the unit in the order as shown below. Note : Follow the disassembly procedure in the numerical order given. 2-1. CABINET(UPPER) SECTION 4Connector (CN9102) 3Four claws Cabinet (upper) assy 1Two screws (+PSW4 16) 2Three screws (+PSW4 16) SetCabin
29、et (upper) sectionSwitch sectionLCD sectionMD section DoorMD board Base unit sectionBUM-F1 boardREC/PB head assy (HR901) section Holder assy, cartridge section Holder assy, cartridge installationOptical pick-up (KMS-250A) section Main board Volume section 7 MDCT-1000 2-2. SWITCH SECTION 2-3. LCD SEC
30、TION 1Cable, flexible flat (90mm) 7SWITCH board 3Key switch block assy 2Seven screws (+PS 3 6) 4Eight screws (STEP M2) 5Seven screws (STEP M2) 6Five screws (+PSW 3 6) 3Cable, flexible flat (70mm) 1Four screws (+PS 2 8) 9Three screws (+PS 3 6) 0Four screws (+PSW 3 6) qsConnector (CN4001) qdConnector
31、(CN4002) qaLCD bracket 5Holder (LCD) 4Claws qf LCD board 8Light unit, back 6LCD 7 2Plate (LCD), transparent 8 MDCT-1000 2-4. MD SECTION 2-5. VOLUME SECTION 1Cable, flexible flat (295mm) 4MD mechanism 5Connector(CN9101) 6Two screws (+PSW 3 8) 3Three screws (+PS 3 6) 2Screw (+PS 3 6) 7AUDIO I/O board
32、1Connector(CN6002) qsConnector (CN8001) 2Connector (CN9202) qdConnector (CN9001) 8VOLUME board 5Knob(VOL) 6Two nuts 4Level meter bracket qaLEVEL METER board FOOT SWITCH boardqh qfTwo screws (+PSW 3 6) qgScrews (+PSW 3 8) 3Three screws (+PS 3 6) 9Two screws (+PS 3 6) 0Screw (+PSW 3 6) 7Spacer 9 MDCT-
33、1000 2-6. MAIN BOARD Cabinet (lower) 4Cable, flexible flat (295mm) 3Connector(CN111) 1 2 5Four screws (+PSW 3 6) 6MAIN board 10 MDCT-1000 2-7. DOOR 2-8. MD BOARD 3Door spring, door return 1 Release the hook. 2 Release the boss. 1Flexible wire (18 core, CN5) 2Flexible board (CN3) 3Flexible board (CN1
34、) 5Two screws (M 2 3) 4Two screws (M 2 3) 6MD board 11 MDCT-1000 2-9. BASE UNIT SECTION 2-10. BUM-F1 BOARD 1Screw (toothed lock M 2 3.5) 3Two screws (step) 4Two screws (step) 5Base unit 2Lug, 2 4Two screws (precision +M 1.7 2.2) 5Claw 6Claw 7BUM-F1 board 1Plam flexible board (CN303) 2Flexible board
35、(CN304) 3Flexible board (CN302) 12 MDCT-1000 2-11. REC/PB HEAD ASSY (HR901) SECTION 2-12. HOLDER ASSY, CARTRIDGE SECTION 6Two screws (M 1.7 2.8) 7Removed hook 8REC/PB head assy (HR901) 1Screw (toothed lock M 2 3.5) 4Screw (toothed lock M 1.4) 5Guide, screw 3Motor, DC geared (M903) 2Lug, 2 Boss Boss
36、Boss Boss A B C 1 Push it in the direction of the arrows A and B with fingers. 2While releasing the four bosses, remove the cartridge holder assembly in the direction of the arrow C. 13 MDCT-1000 2-13. HOLDER ASSY, CARTRIDGE INSTALLATION 2-14. OPTICAL PICK-UP (KMS-250A) SECTION APosition APosition A
37、Position When installing the cartridge holder, coat the portion A shown in the illustration with grease (EM-30L). 1Two screws (Precision, +P 1.7 2.2) 5Two screws (M 1.7 4.5) 6Two washers 7Optical pick-up (KMS-250A) 3Two screws (Precision, +P 1.7 2.2) 4Spring, guide shaft retainer 2Motor, stepping (M
38、902) 14 MDCT-1000 SECTION 3 TEST MODE NOTE This machine does not have either DECK B nor the recording function. 3-1. Description 3-1-1. How to Enter the Test Mode Pressing the G G ENTER g g g g g ENTER G G ENTER F buttons. 3-1-2. How to Exit the Test Mode While pressing the G button, rotate the JOG
39、dial and set “k_test_h” to “0”. 3-1-3. How to Cancel the ENTER key The numeric keys that have been input up to the moment can be canceled at the following so that the machine does not enter the test mode unless otherwise needed. 1.When the interval of pressing the previous numeric key and the next k
40、ey exceeds one second or more. 2.When the deck select key is pressed. 3.When the k_mode changes. 4.When the selected deck has changed. 5.When the test mode is set. 3-1-4. How to Select the Test Item The test item can be selected by “k_test_h” and “k_test_l”. 1. Displaying the selected item The selec
41、ted item is displayed on LCD as follows. 2.How to select the test item using the JOG dial 1.While pressing G button, rotate the JOG dial. “k_test_h” changes. When “k_test_h” changes, “k_test_l” is set to “0”. Select the desired test category using “k_test_h”. 2.While pressing g button, rotate the JO
42、G dial. “k_test_l” changes. Select the desired test item using “k_test_l”. 3.Sets the selected test item either by pressing g button after selecting “k_test_l” or by pressing the ENTER button. 3.How to select the test item with the use of the PC remote command The desired test item can be selected b
43、y sending the remote command of rewriting “k_test_h” and “k_test_l” from the PC to the machine. When the “k_test_h/l” change command is sent from a PC to the machine while the “k_test_h/l” change inhit bit is being set, the machine returns NAK and the machine does not chanage “k_test_h/l”. 3-1-5. Te
44、st Display 3-1-6. Communication with Mechanism Deck Communication with the mechanism deck is performed using programs such as “Hyper terminal” or the like that have been started up on a PC. Refer to 3-3-3. “Selecting the Terminal”. (Communication control with the log system or trace monitor is not p
45、ossible.) 3-1-7. Circuit Block 3-2. Audio Firmware Test: AUDIO SF data storage method in the DRAM. Test program is stored as shown below. (Operations start in the order starting from channel 1, channel 2, channel 3, and up to channel 4 under the ordinary operation conditions but the test mode starts
46、 from channel 1, channel 3, channel 2, and channel 4 in this order.) LCD: Types, conditions and others of the test are displayed on the LCD during each test. Channel selector and channel selector LED: Select the channel selector by manual operation. Voice mirror: Change the input level by manual ope
47、ration. Perform the following tests after the machine is set in the “STOP” mode. 02-00 /* AUDIO-F TEST MENU */ 02-00 AUDIO-F MENU 01 - 00(Top menu) 00 - 00EXIT(Exit) 01 - 00THIS MENU(Top menu) 02 - 00AUDIO(Audio firmware test) 03 - 00MECH(Mechanism test) 04 - 00DISPLAY(Display system test) 05 - 00KE
48、Y(Key test) 06 - 00COMMUNICATION(Communication test) 07 - 00AUDIO HW(Audio hardware test) 08 - 00DIGITAL HW(Digital hardware test) 09 - 00NVRAM(NVRAM test) General purpose port KEY CPU NVRAM ROM CODECAD/DA SRAMDRAM CLOCK FIFO86551809 DECK A LCD CPU bus FIF012CXD1858 1.2ch FIF034CXD1858 3.4ch 1chSF 0
49、123 3ch2ch4ch Value of “k_test_h” (Displayed in hexadecimal number) Value of “k_test_l” (Displayed in hexadecimal number) 05 - 01 /* KEY INCREMENT TEST */ 15 MDCT-1000 3-2-1. Audio Recording and Playback Test without Disc The audio signal (up to the full memory capacity of the DRAM at a maximum) is recorded in the ATRAC data recording area in the DRAM