Akai-DVP-4785-KDSM-Service-Manual(1) 电路图 维修手册.pdf

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1、SERVICE MANUAL Model: DVP4785KDSM DVD PLAYER www.akai.ru RadioFans.CN 收音机爱 好者资料库 CONTENTS 1. PRECAUTIONS-1 1-1 SAFETY PRECAUTIONS-1 1-2 SERVICING PRECAUTIONS-2 1-2-1 General Serving Precautions -2 1-2-2 Insulation Checking Procedure-3 1-3 ESD PRECAUTIONS-3 2. REFERENCE INFORMATION-4 2-1 COMPONENT DE

2、SCRIPTIONS-4 2-1-1 DVD SANYO HD60 PUH-4 2-1-2 DVD Processor Chip MTK1389-6 2-1-3 20-Pin, 24-Bit, 192kHz D/A with Volume Control (WM8766) -12 2-1-4 Serial EEPROM, 2K (256 x 8) (24C02) or 16 K (2048 x 8) (24C16)-13 2-1-5 8M-BIT 1Mx8/512Kx16 CMOS FLASH MEMORY-14 2-1-6 512K X 16 Bit X 2 Banks Synchronou

3、s DRAM (A43L0616) -17 3. PRODUCT SPECIFICATIONS-20 4. UPGRADING SYSTEM AND CHANGING THE REGION CODE-21 5. OPERATING INSTRUCTION-22 MAINTENANCE Safety First 1-2-1 General Serving Precautions (1) a. Always unplug the instruments AC power cord from the AC power source before (1) removing or reinstallin

4、g any component, circuit board, module or any other instrument assembly. (2) disconnecting any instrument electrical plug or other electrical connection. (3) connecting a test substitute in parallel with an electrolytic capacitor in the instrument. b. Do not defeat any plug/socket B+ voltage interlo

5、cks with which instruments covered by this service manual might be equipped. c. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. d. Always connect a test instruments ground lead to the instrument chassi

6、s ground before connecting the test instrument positive lead. Always remove the test instrument ground lead last. Note: Refer to the Safety Precautions section ground lead last. (2) The service precautions are indicated or printed on the cabinet, chassis or components. When servicing, follow the pri

7、nted or indicated service precautions and service materials. (3) The components used in the unit have a specified flame resistance and dielectric strength. When replacing components, use components which have the same ratings, by () or by () in the circuit diagram are important for safety or for the

8、 characteristics of the unit. Always replace them with the exact replacement components. (4) An insulation tube or tape is sometimes used and some components are raised above the printed wiring board for safety. The internal wiring is sometimes clamped 2 - Cosmic Digital Technology Limited - to prev

9、ent contact with heating components. Install such elements as they were. (5) After servicing, always check that the removed screws, components, and wiring have been installed correctly and that the portion around the serviced part has not been damaged and so on. Further, check the insulation between

10、 the blades of the attachment plus and accessible conductive parts. 1-2-2 Insulation Checking Procedure Disconnect the attachment plug from the AC outlet and turn the power ON. Connect the insulation resistance meter (500V) to the blades of the attachment plug. The insulation resistance between each

11、 blade of the attachment plug and accessible conductive parts (see note) should be more than 1 Megohm. Note: Accessible conductive parts include metal panels, input terminals, earphone jacks, etc. 1-3 ESD Precautions Electrostatically Sensitive Devices (ESD) Some semiconductor (solid static electric

12、ity) devices can be damaged easily by static electricity. Such compo9nents commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques of component

13、 damage caused by static electricity. (1) immediately before handling any semiconductor components or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap dev

14、ice, which should be removed for potential shock reasons prior to applying power to the unit under test. (2) after removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the a

15、ssembly. (3) Use only a grounded-tip soldering iron to solder or unsolder ESD device. (4) Use only an anti-static solder removal devices. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ESD devices. (5) Do not use freon-propelled chemi

16、cals. These can generate electrical charges sufficient to damage ESD devices. (6) Do not remove a replacement ESD device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive

17、foam, aluminum foil or comparable conductive materials). (7) Immediately before removing the protective materials from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied t

18、o the chassis or circuit, and observe all other safety precautions. (8) Minimize bodily motions when handling unpackaged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static elec

19、tricity sufficient to damage an ESD device). 3 - Cosmic Digital Technology Limited - 2. Reference Information 2-1 Component Descriptions 2-1-1 DVD SANYO HD60 PUH Connector Pin Definition I/F Signals I/O Pin # F- 1 F + 2 T + 3 T - 4 C 5 D 6 CD/DVD 7 RF 8 A 9 B 10 F 11 GND-PD 12 VC 13 VCC 14 E 15 NC 1

20、6 VR-CD 17 VR-DVD 18 LD-CD 19 MD 20 HFM 21 NC 22 LD-DVD 23 GND-LD 24 4 4. Block Diagram Disc MT1369 (RF AMP) Laser Driver Equalizer Error Gen MT1369 (Decode/Servo) A TAPI Buffer Manager Demodulator Error Correction PLI Focus 10uf external decoupling 19 NC Do not connect Do not connect 20 NC Do not c

21、onnect Do not connect 21 VOUT1L Analog output DAC channel 1left output 22 VOUT1R Analog output DAC channel 1right output 23 VOUT2L Analog output DAC channel 2 left output 24 VOUT2R Analog output DAC channel 2 right output 25 VOUT3L Analog output DAC channel 3 left output 26 VOUT3R Analog output DAC

22、channel 3 right output 27 AGND Supply Analogue negative supply and substrate connection 28 A VDD Supply Analogue positive reference supply Note: Digital input pins have Schmitt trigger input buffers. 2-1-4 Serial EEPROM, 2K (256 x 8) (24C02) or 16 K (2048 x 8) (24C16) 24C02 is used for DVD player wh

23、ile 24C16 is for DVD receiver. The capacity is the only difference between two kinds of serial EEPROM. Both of them use same package and have same pin configuration. 13 * Features z Low-Voltage and Standard-Voltage Operation -5.0 (V CC = 4.5V to 5.5V) -2.7 (V CC = 2.7V to 5.5V) -2.5 (V CC = 2.5V to

24、5.5V) -1.8 (V CC = 1.8V to 5.5V) z Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K), 1024 x 8 (8K) or 2048 x 8 (16K) z 2-Wire Serial Interface z Schmitt Trigger, Filtered Inputs for Noise Suppression z Bi-directional Data Transfer Protocol z 100 kHz (1.8v, 2.5V, 2.7V) and 400 kHz (5V) C

25、ompatibility z Write Protect Pin for Hardware Data Protection z 8-Byte Page (1K, 2K), 16-Byte Page (4K, 8K, 16K) Write Modes z Partial Page Writes Are Allowed z Self-Timed Write Cycle (10 ms max) z High Reliability - Endurance: 1 Million Write Cycles - Data Retention: 100 Years - ESD Protection: 300

26、0V z Automotive Grade and Extended Temperature Devices Available z 8-Pin and 14-Pin JEDEC SOIC, 8-Pin PDIP, 8-Pin MSOP, and 8-Pin TSSOP Packages * Pin Configurations * Pin Description Pin Name Function A0-A2 Address Inputs SDA Serial Data SCL Serial Clock input WP Write Protect NC No Connect 2-1-5 8

27、M-BIT 1Mx8/512Kx16 CMOS FLASH MEMORY FEATURES 1,048,576 x 8/524,288 x 16 switchable Single power supply operation - 5.0V only operation for read, erase and program operation Fast access time: 70/90/120ns Low power consumption - 50mA maximum active current - 0.2uA typical standby current 14 Command r

28、egister architecture - Byte/word Programming (7us/12us typical) - Sector Erase (Sector structure 16K-Bytex1, 8K-Bytex2, 32K-Bytex1, and 64K-Byte x15) Auto Erase (chip & sector) and Auto Program - Automatically erase any combination of sectors with Erase Suspend capability. - Automatically program an

29、d verify data at specified address Erase suspend/Erase Resume - Suspends sector erase operation to read data from, or program data to, another sector that is not being erased, then resumes the erase. Status Reply - Data polling & Toggle bit for detection of program and erase operation completion. Re

30、ady/Busy pin (RY/BY) - Provides a hardware method of detecting program or erase operation completion. Sector protection - Sector protect/chip unprotect for 5V/12V system. - Hardware method to disable any combination of sectors from program or erase operations - Tempory sector unprotect allows code c

31、hanges in previously locked sectors. 100,000 minimum erase/program cycles Latch-up protected to 100mA from -1V to VCC+1V Boot Code Sector Architecture - T = Top Boot Sector - B = Bottom Boot Sector Low VCC write inhibit is equal to or less than 3.2V Package type: - 44-pin SOP - 48-pin TSOP Compatibi

32、lity with JEDEC standard - Pinout and software compatible with single-power supply Flash 15 16 2-1-6 512K X 16 Bit X 2 Banks Synchronous DRAM (A43L0616) Features ? JEDEC standard 3.3V power supply ? LVTTL compatible with multiplexed address ? Dual banks / Pulse RAS ? MRS cycle with address key progr

33、ams - CAS Latency (2,3) - Burst Length (1,2,4,8 & full page) - Burst Type (Sequential & interleave) ? All inputs are sampled at the positive going edge of the system clock ? Burst Read Single-bit Write operation ? DQM for masking ? Auto & self refresh ? 64ms refresh period (4K cycle) ? 50 Pin TSOP (

34、II) Pin Configuration 17 18 Block Diagram Pin Descriptions Symbol Name Description CLk System Clock Active on the positive going edge to sample all inputs CS Chip Select Disables or Enables device operation by masking or enabling all inputs except CLK, CKE and L(U)DQM Masks system clock to freeze op

35、eration from the next clock cycle. CKE Clock Enable CKE should be enabled at least one clock + tss prior to new command. Disable input buffers for power down in standby. A0A10/AP Address Row/Column addresses are multiplexed on the same pins. Row address: RA0 RA10, Column address: CA0 CA7 BA Bank Sel

36、ect Address Selects bank to be activated during row address latch time. Selects band for read/write during column address latch time. RAS Row address Strobe Latches row addresses on the positive going edge of the CLK with RAS low. Enables row access & precharge. CAS Column Address Strobe Latches col

37、umn addresses on the positive going edge of the CLK with CAS low. Enables column access. WE Write Enable Enables write operation and Row precharge. L(U)DQM Data Input/Output Mask Makes data output Hi-Z, t SHZ after the clock and masks the output. Blocks data input when L(U)DQM active. DW0-15 Data In

38、put/Output Data inputs/outputs are multiplexed on the same pins. 19 Symbol Name Description VDD/VSS Power Supply/Ground Power Supply: +3.3V0.3V/Ground VDDQ/VSSQ Data Output Power/Ground Provide isolated Power/Ground to DQs for improved noise immunity. NC/RFU No Connection 3. Product Specifications P

39、layback System DVD Video Video CD (1.1, 2.0, 3.0) SVCD and CVD CDDA CD-ROM with MP3 data PICTURE CD Television Signal System NTSC/PAL Video Performance Video Out 1 Vpp into 75 ohm S-Video Out Y: 1Vpp into 75 ohm C: 0.286 Vpp into 75 ohm D/A Converter 27MHz/10bit Audio Performance Frequency Response

40、DVD: fs 48/96KHz, 4Hz22/44KHz Video CD: fs 44.1KHz, 4Hz20KHz Audio CD: fs 44.1KHz, 4Hz20KHz Output Level Analog: 2Vrms(1KHZ) Digital: 1.15 Vpp D/A Converter 96KHz/24bit S/N Ratio 90dB Connections Coaxial digital out X1 Audio Analog out for 2-channel X1 S-Video out X1 Power Supply Power Source AC1002

41、55V , 50/60Hz Power Consumption 10mH R4.5E 1 L1 Transformer CO-BYBYDAP118A/B/C KBEC28-21178 1 T1 Carbon Film Resistor 2W 27K +/-5% 1 R7 Carbon Film Resistor 1W 1E +/-5% 1 R6 Carbon Film Resistor 1/4W 10K +/-5% 2 R12,R13 Carbon Film Resistor 1/4W 300E +/-5% 1 R5 Carbon Film Resistor 1/4W 3K +/-5% 1 R

42、11 Carbon Film Resistor 1/4W 470E +/-5% 1 R10 Carbon Film Resistor 1/4W 4.7K +/-5% 1 R9 Carbon Film Resistor 1/4W 5.1K +/-5% 1 R1 Carbon Film Resistor 1/4W 6.8K +/-5% 1 R2 Carbon Film Resistor 1/4W 75K +/-5% 1 R8 Press-sensitive Resistor 07 471 1 RV1 Grounding solder slice D3.2 mm 3 1,2,3 IC TEA1523

43、P 1 U1 IC TL431 TO-92 decal 1 U3 Photo-electric Couple PC817 1 U2 Power Board PCB C0-DPA118 2002-09-09 1 PCB Jumper 10mm 2 J1,J3 Jumper 15mm 1 J4 Jumper 16mm 1 J2 36 10 Components of Control Panel Carbon Film Resistor 1/4W 10E +/-10% 2 R1? R9 Carbon Film Resistor 1/4W 10K +/-10% 7 R2R4? R6R8? R10 Carbon Film Resistor 1/4W 56K +/-10% 1 R5 Ceramic capacitor 50V104 +80/-20% 1 C3 Electrolytic capacitor 16V 47U F 20% 2 C1,C2 Diode 1N4148 Axial 0.4 5 D1,D2,D3,D4,D5 IC 16312 QFP44 (AD16312) 1 U1 VFD SAMSUNG 1 IC1 R/M TD138 1 RMC1 Button 6