JVC-XMPJ1-md-sm 电路图 维修手册.pdf

《JVC-XMPJ1-md-sm 电路图 维修手册.pdf》由会员分享，可在线阅读，更多相关《JVC-XMPJ1-md-sm 电路图 维修手册.pdf（78页珍藏版）》请在收音机爱好者资料库上搜索。

1、SERVICE MANUAL PORTABLE MINIDISC PLAYER No.20738 Jan. 1999 COPYRIGHT 1999 VICTOR COMPANY OF JAPAN, LTD. Printed in Japan 9901 (V ) VICTOR COMPANY OF JAPAN, LIMITED AUDIO DIVISION,10-1,1Chome,Ohwatari-machi,Maebashi-city,371-8543,Japan XM-P55 XM-PJ1 (No.20738) XM-P55 XM-PJ1 XM-P55 XM-PJ1 Contents Saf

2、ety Precautions Instructions (For XM-P55 Manufacturer;Nippon Cotton Swab 2. Confirmation of the service life of laser diode when the service life of the laser diode has been exhausted, the following symptoms will appear. (1) Recording will become impossible. (2) The RF output (EFM output and eye pat

3、tern amplitude) will become lower. (3) The drive current required for light emitting of laser diode will be increased. Confirm the service life according to the following flow chart: Is the drive current of laser diode 45mA or less? Change the pickup Change the pickup NO YES OK. NO YES 4. Semi-solid

4、 state resistors on the APC P.C. board The semi-solid state resistor on the APC P.C.board attached to the pickup is used for adjusting the laser power. Since these resistor should be adjusted in pair according to the characteristics of the optical block, be sure not to touch on the resistors. Since

5、the service life of the laser diode will be exhausted when the laser power is low, it is necessary to change the pickup. Meanwhile, do not pickup. Otherwise, the pickup will be damaged due to over current. 3. Method of measuring the drive current of laser diode When the voltage measured at the both

6、side of carbon resistor R301 on the MD servo P.C. board (VMW2424A) have become 45mV or over, the service life of the laser diode is judged to have been exhausted. Procedures of Changing the MD pickup Change the MD pickup by referring to Removing the MD pickup in the Disassembly Method. Set the picku

7、p to TEST mode according to the procedures described in the Adjustment Method. Adjust the laser power 75. Adjust the disc. Completion of changing the MD pickup. Since this system is designed to perform magnetic recording, the laser power ten times or over of the conventional MD player will be output

8、. Therefore, be sure to perform not only adjustment and operation of this system so carefully as not to directly look at the laser beam or touch on the body. Can the laser power adjust under test mode? Is the power output 750 How to operation Return to feed . Return to feed . Adjust the Pre D have b

9、een become OK Adjust the Mo D have been become OK XM-P55 XM-PJ1 2-24 Command data1 data2 data3 data4 data5 data6 data7 Ope.mode State PLY P REC P EEP R EEP S Self diagnosis Function of MD Power Supply - Use to a battery charger by more than 1.3volt Establishment - Set up the horizontal 1. The method

10、 of changing to the self-diagnosis mode turns off the power supply of the main body first. 2. The power supply of the main body is turned on while pushing PLAYMODE +DISPLAY+A.B.BASS of the remote control unit at the same time. 3. It changes into the self-diagnosis mode, and the self-diagnosis starts

11、. Test s Command for the self-diagnosis mode =00: Wait to Test command =DD: Going to Resumes EEPROM initialize =DE: Going to servos EEPROM initialize =E2: Turn on the leaser of PLAY =D3: Turn up the laser =D4: Turn down the laser =D1: Turn off the laser =D5: Rewind to the FEED =D6: Adjust to the PRE

12、 DISC =D7: Adjust to the MO DISC =92: Break out the trouble The following are displayed and it stops at the NG generation. The KEY input afterwards is disregarded. Disc mark Random RepeatFAV DISPLAY button A.C.BASS (Active Clear Bass) button Play Mode button Indicators on the display of the remote c

13、ontrol VOL JOG MODE A.C.BASS BASS MONO Battery XM-P55 XM-PJ1 2-25 Self-diagnosis Fllow Chart START Recieve time out at 200ms Recievable above it. Recieve time out at 200ms Except to recieve DF:DD. Recieve time out at 200ms Except to recieve DF:00. Recieve time out at 200ms Except to recieve DF:DD. R

14、ecieve time out at 200ms Except to recieve DF:E2. Recieve time out at 200ms Except to recieve DF:D1. Recieve time out at 200ms Except to recieve DF:DD. Recieve time out at 200ms Except to recieve DF:DD. Recieve DF:00 Recieve DF:00 Recieve DF:00 Recieve DF:00 Recieve DF:00 Recieve DF:00 Recieve DF:00

15、 Recieve DF:D1 Recieve DF:00:XX:YY Recieve DF:00:XX:YY Recieve DF:00 Issue to DB Issue to DE Issue to DF Issue to DF Issue to D1 Issue to D4:01 Issue to D3:01 Issue to E2 Issue to DE Issue to DE Issue to DE Initial to resumeInitial to the servo Push to BASS Push to BASS Push to VOL -Push to SHIFT Pu

16、sh to VOL + Push to BASS ProcesserProcesser (Lock to display at 2sec) (Lock to display at 2sec) (Lock to display at 2sec) Turn on the laser by PLAY Rewind to the FEED Except above it Recieve time out at 200ms XM-P55 XM-PJ1 2-26 Rewind to FEED Rewind to FEEDAdjust PRE -D Adjust t MO-D Push to BASSPus

17、h to BASS Push to BASS Recieve time out at 200ms Except to recieve DF:D7 Recieve time out at 200ms Except to recieve DF:D6 Recieve time out at 200ms Except to recieve DF:D5 Recieve time out at 200ms Except to recieve DF:00 Recieve time out at 200ms Except to recieve DF:00 Recieve time out at 200ms E

18、xcept to recieve DF:00 Issue to D5 Issue to DF Issue to DF Issue to DF Issue to D6 Issue to D7 ProcessorProcessorProcessor Receive DF:D5 Receive DF:00 Receive DF:00 Receive DF:00 Receive DF:D6 Receive DF:D7 OKOKOK (Lock to display at 2sec) (Lock to display at 2sec) (Lock to display at 2sec) XM-P55 X

19、M-PJ1 2-27 Block Diagrams RF ICDSP 16M D RAM PICKUP DRIVER DRIVER SLED SPINDLE Audio POWER SUPPLY HP JACK CNT Micro computer ACB BEEP MUTE REMOTE CONTROL Each Block LEVEL DIAGRAM ACB Circuit Headphone AMP Servo FCS, TRK XM-P55 XM-PJ1 2-28 -MEMO- ABCD 1 2 3 4 5 XM-P55 XM-PJ1 2-29 XM-P55 (Except to U.

20、S.A.) BLOCK C BLOCK D BLOCK A BLOCK B Standard Schematic Diagrams ABCD 1 2 3 4 5 XM-P55 XM-PJ1 2-30 Digital signal To BLOCK B To BLOCK C XM-P55 (Except to U.S.A.) BLOCK A ABCD 1 2 3 4 5 XM-P55 XM-PJ1 2-31 Digital signal Analogue signal BLOCK B To BLOCK A To BLOCK D XM-P55 (Except to U.S.A.) ABCD 1 2

21、 3 4 5 XM-P55 XM-PJ1 2-32 To BLOCK D To BLOCK A BLOCK CXM-P55 (Except to U.S.A.) ABCD 1 2 3 4 5 XM-P55 XM-PJ1 2-33 To BLOCK B BLOCK D XM-P55 (Except to U.S.A.) To BLOCK C XM-P55 XM-PJ1 2-34 -MEMO- ABCDEFG 1 2 3 4 5 2-35 XM-P55 XM-PJ1 2-9?2-9?2-9? XM-P55J ONLY HABCDEFG 1 2 3 4 5 2-36 XM-P55 XM-PJ1 2-

22、10?2-10?2-10? D BLOCK B BLOCK A BLOCKC BLOCK XM-PJ1 (Except to U.S.A.) Digital signal BLOCK A To BLOCK B To BLOCK C XM-PJ1(Except to U.S.A.) ABCD 1 2 3 4 5 XM-P55 XM-PJ1 2-37 BLOCK B XM-PJ1(Except to U.S.A.) To BLOCK C To BLOCK A Digital signal Anologue signal ABCD 1 2 3 4 5 XM-P55 XM-PJ1 2-38 To BL

23、OCK A To BLOCK D BLOCK C XM-PJ1(Except to U.S.A.) ABCD 1 2 3 4 5 XM-P55 XM-PJ1 2-39 To BLOCK C To BLOCK B BLOCK D XM-PJ1(Except to U.S.A.) XM-P55 XM-PJ1 2-40 -MEMO- ABCDEFG 1 2 3 4 5 2-41 XM-P55 XM-PJ1 2-9?2-9?2-9? XM-PJ1 J ONLY HABCDEFG 1 2 3 4 5 2-42 XM-P55 XM-PJ1 Main board (Parts side) Block No.

24、 XM-P55 ONLY Printed Circuit Boards 2-10?2-10?2-10? (Solder side) : chip parts ABCD 1 2 3 4 5 XM-P55 XM-PJ1 2-43 Block No. Block No. Headphone Jack Board Switch Board XM-P55 XM-PJ1 2-44 -MEMO- XM-P55 XM-PJ1 3-1 PARTS LIST * All printed circuit boards and its assemblies are not available as service p

25、arts. XM-P55 Area Suffix B E EE EN J UB US UT UX UY U.K. (BU,SL) Continental Europe (BU,SL) Russian Federation (BU,SL) Northern Europe (BU,SL) U.S.A. (SL) Hong kong (BU,GN,SL) Singapore (BU,SL) Taiwan (SL) Saudi Arabia (SL) Argentina (SL) - Contents - Exploded View of General Assembly and Parts List

26、 .3-2 MD Mechanism Assy and Parts List .3-4 Electrical Parts List .3-6 Packing Materials and Accessories Parts List (J) .3-10 Packing Materials and Accessories Parts List (E/EE/EN) .3-12 Packing Materials and Accessories Parts List (B/UB/US/UT/UX/UY) .3-14 ABCD 1 2 3 4 5 XM-P55 XM-PJ1 3-2 Block No 4

27、4 General Exploded View and Parts List (MODEL:XM-P55) XM-P55 XM-PJ1 3-3 ABCD 1 2 3 4 5 XM-P55 XM-PJ1 3-4 MD Mechanism Assy and Parts List Block No. (MODEL:PPM) XM-P55 XM-PJ1 3-5 XM-P55 XM-PJ1 3-6 Electrical Parts List Main board XM-P55 XM-PJ1 3-7 XM-P55 XM-PJ1 3-8 XM-P55 XM-PJ1 3-9 Headphone Jack bo

28、ard Switch board ABCD 1 2 3 4 5 XM-P55 XM-PJ1 3-10 Packing Materials and Accessories Parts List Block No. Block No. J Version Section turn up turn down XM-P55 XM-PJ1 3-11 Packing Parts list Accessories Parts list ABCD 1 2 3 4 5 XM-P55 XM-PJ1 3-12 Packing Materials and Accessories Parts List Block No

29、. Block No. E/EE/EN/ Version Section turn up turn down XM-P55 XM-PJ1 3-13 Packing Parts list Accessories Parts list ABCD 1 2 3 4 5 XM-P55 XM-PJ1 3-14 Packing Materials and Accessories Parts List Block No. Block No. B/UB/US/UT/UX/UY/ Version Section turn up turn down XM-P55 XM-PJ1 3-15 Packing Parts

30、list Accessories Parts list XM-P55 XM-PJ1 3-16 -MEMO- XM-P55 XM-PJ1 4-1 PARTS LIST * All printed circuit boards and its assemblies are not available as service parts. XM-PJ1 B E EE EN J UB US UT UX UY Area Suffix U.K. (BU) Continental Europe (BU) Russian Federation (BU) Northern Europe (BU) U.S.A. (

31、BU) Hong kong (BU,GD) Singapore (BU) Taiwan (BU) Saudi Arabia (BU) Argentina (BU) - Contents - Exploded View of General Assembly and Parts List . 4-2 MD Mechanism Assy and Parts List .4-4 Electrical Parts List .4-5 Packing Materials and Accessories Parts List (J) .4-10 Packing Materials and Accessor

32、ies Parts List (E/EE/EN) . 4-12 Packing Materials and Accessories Parts List (B/UB/US/UT/UX/UY) . 4-14 ABCD 1 2 3 4 5 XM-P55 XM-PJ1 4-2 C991 J991 Block No. General Exploded View and Parts List (MODEL:XM-PJ1) XM-P55 XM-PJ1 4-3 XM-P55 XM-PJ1 4-4 Block No. MD Mechanism Exploded View and Parts List MD M

33、echanism as same as XM-P55. Please refer of the page 3-4 and 3-5. XM-P55 XM-PJ1 4-5 Electrical Parts List Main board XM-P55 XM-PJ1 4-6 XM-P55 XM-PJ1 4-7 XM-P55 XM-PJ1 4-8 XM-P55 XM-PJ1 4-9 Headphone Jack board Switch board ABCD 1 2 3 4 5 XM-P55 XM-PJ1 4-10 Packing Materials and Accessories Parts Lis

34、t Block No. Block No. J Version Section turn up turn down XM-P55 XM-PJ1 4-11 Packing Parts list Accessories Parts list ABCD 1 2 3 4 5 XM-P55 XM-PJ1 4-12 Packing Materials and Accessories Parts List Block No. Block No. E/EE/EN/ Version Section turn up turn down XM-P55 XM-PJ1 4-13 Packing Parts list A

35、ccessories Parts list ABCD 1 2 3 4 5 XM-P55 XM-PJ1 4-14 Packing Materials and Accessories Parts List Block No. Block No. A1A4 B/UB/US/UT/UX/UY/ Version Section turn up turn down 1-24-15 XM-P55 XM-PJ1 XM-P55 XM-PJ1 CAUTION CAUTION Burrs formed during molding may be left over on some parts of the chas

36、sis. Therefore, pay attention to such burrs in the case of preforming repair of this system. Safety Precaution Please use enough caution not to see the beam directly or touch it in case of an adjustment or operation check. Packing Parts List Accessories Parts List SERVICE MANUAL PORTABLE MINIDISC PL

37、AYER No.20738 Jan. 1999 COPYRIGHT 1999 VICTOR COMPANY OF JAPAN, LTD. Printed in Japan 9901 (V ) VICTOR COMPANY OF JAPAN, LIMITED AUDIO DIVISION,10-1,1Chome,Ohwatari-machi,Maebashi-city,371-8543,Japan XM-P55 XM-PJ1 (No.20738) XM-P55 XM-PJ1 XM-P55 XM-PJ1 Contents Safety Precautions Instructions (For X

38、M-P55&PJ1) Description of Major ICs Removal of Main Parts Maintenance of MD Pickup Procedures of Changing the MD Pickup Self-diagnosis Function of MD Block Diagrams Standard Schematic Diagrams (XM-P55) Standard Schematic Diagrams (XM-PJ1) Printed Circuit Boards Parts List (XM-P55) Parts List (XM-PJ1

39、) 1-2 1-316 2-1 2-12 2-23 2-23 2-24 2-27 2-29 2-36 2-42,43 3-115 4-115 B E EE EN J UB US UT UX UY Area Suffix (XM-PJ1 ) U.K. (BU) Continental Europe (BU) Russian Federation (BU) Northern Europe (BU) U.S.A. (BU) Hong kong (BU,GD) Singapore (BU) Taiwan (BU) Saudi Arabia (BU) Argentina (BU) Area Suffix B E EE EN J UB US UT UX UY (XM-P55 ) U.K. (BU,SL) Continental Europe (BU,SL) Russian Federation (BU,SL) Northern Europe (BU,SL) U.S.A. (SL) Hong kong (BU,GN,SL) Singapore (BU,SL) Taiwan (SL) Saudi Arabia (SL) Argentina (SL) OPEN X M - P 5 5 XM-P55 XM-PJ1