Philips-HTS-3220-Service-Manual(1) 电路图 维修手册.pdf

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1、Published by KC-LQ 1010 AVM Printed in he Netherlands HTS3220/12/98 Subject to modifi cation EN 3139 785 35250 Home Theater System CLASS 1 LASER PRODUCT Contents PageContents Page Copyright 2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands. All rights reserved. No part of this public

2、ation may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips. Version 1.0 1 Technical Specification and Connection Facilities 2 Laser Beam Safety Precautions.2-1 3 Importa

3、nt Safety Precautions . 3-1 to 3-2 4 Safety Check After Servicing . 4-1 7 Standard Notes For Servicing . .6-1 8 Special Information BGA IC when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4.Releas

4、e the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) CAUTION: 1.The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. 2.Do not supply hot air to the chip parts around the flat pack-IC for over 6

5、 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2) Fig. S-1-1 3.The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC whe

6、n removing it. With Soldering Iron: 1.Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) 2.Lift each lead of the flat pack-IC upward one by one, using a sharp

7、pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4) 3.Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat

8、 pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4.Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) With Iron Wire: 1.Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat

9、 pack-IC, you can remove it easily. (Fig. S-1-3) 2.Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. 3.While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as s

10、hown in Fig. S-1-5. 4.Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 5.Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6

11、) Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. Hot-air Flat Pack-IC Desoldering Machine CBA Flat Pack-IC Tweezers Masking

12、 Tape Fig. S-1-2 Flat Pack-IC Desoldering Braid Soldering Iron Fig. S-1-3 Fine Tip Soldering Iron Sharp Pin Fig. S-1-4 To Solid Mounting Point Soldering Iron Iron Wire or Hot Air Blower Fig. S-1-5 Fine Tip Soldering Iron CBA Flat Pack-IC Tweezers Fig. S-1-6 7-2 7-3 2. Installation 1.Using desolderin

13、g braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily. 2.The “” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then preso

14、lder the four corners of the flat pack-IC. (See Fig. S-1-8.) 3.Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges. Instructions for Handling Semi- Special Information BGA IC press up or down to fine tune a radio frequency. f INFO Displays information about what is

15、 playing. gPlayback buttons Control playback. hTREBLE /BASS Changes treble or bass. Use with +/- . iNumeric buttons Selects an item to play. jAUDIO SYNC Selects an audio language or channel. Press and hold to synchronize audio with video. Use with +/-. kSOUND MODE Selects a sound mode. lREPEAT / PRO

16、GRAM Selects a repeat or shuffle mode. In radio mode, programs radio stations. mZOOM Zooms into a video scene or picture. nHDMI / ANGLE Selects video resolution of HDMI output from the home theater. Press and hold to select options for different camera angles. oSUBTITLE Selects subtitle language for

17、 video. Direction of Use 8-3 srot cennoc kcaB a TO SUBWOOFER Connects to the supplied subwoofer. b SPEAKERS . srekaeps de i l ppus eh t ot st cennoC c FM ANTENNA Connects the FM antenna for radio reception. d AUX IN eht no tuptuo o i dua go l ana eh t ot st cennoC TV or an analog device. e NI LAIXAO

18、C Connects to the coaxial audio output on the TV or a digital device. f VIDEO OUT Connects to the composite video input on the TV. g HDMI OUT .VT eht no tupn i IMDH eh t ot st cennoC srot cennoc re foowbuS a AC MAINS . y l ppus rewop eh t ot st cennoC b TO MAIN UNIT eh t ot t cennoC TO SUBWOOFER con

19、nector on the main unit. emoh ruoy t cennoC theater re taeht emoh ruoy t cennoc uoy sp l eh no i t ces s i hT to a TV and other devices. The basic connections of the home theater with its accessories are provided in the Quick Start. For a comprehensive interactive guide, see www.connectivityguide. .

20、 etoN mot tob r o kcab eht ta eta l p epyt eh t ot ref eR of the product for identi cation and supply ratings. Before you make or change any connections, ensure that all devices are disconnected from the power outlet. srot cennoC srot cennoc ed i S a ( USB ) BSU a mor f tupn i erut c i p ro oed i v

21、,o i duA storage device. b MP3 LINK Audio input from an MP3 player. c Dock for iPod Connects to a Philips Dock for iPod/iPhone. (Sold separately) Direction of Use 8-4 Option 3: Connect to the TV through composite video (CVBS) Note The composite video cable or connector might be labeled AV IN,VIDEO I

22、N,COMPOSITE or BASEBAND . Connect audio from TV or other devices Use your home theater to play audio from the TV or other devices such as a cable box. Tip Press AUDIO SOURCE repeatedly to select the audio output of your connection. Option 1: Connect audio through analog audio cables (Cable not suppl

23、ied) TV TV Connect to the TV Connect your home theater directly to a TV through one of the following connectors (from highest to basic quality video): a HDMI b Scart c Composite video Option 1: Connect to the TV through HDMI Note If the HDTV has a DVI connector, connect using an HDMI/DVI adapter. If

24、 the TV supports EasyLink HDMI CEC, control the home theater and TV with one remote control (see Use Philips EasyLink on page 13 ). (Cable not supplied) Option 2: Connect to the TV through Scart Use the supplied scart adapter. TV TV Direction of Use 8-5 Option 2: Connect audio through coaxial cable

25、Note The digital coaxial cable or connector might be labeled COAXIAL/DIGITAL OUT or SPDIF OUT. (Cable not supplied) Connect a Philips Dock for iPod/iPhone (Philips Dock for iPod/iPhone not supplied) TV DOCK for iPod 9-1 Cabinet Disassembly Instructions 1. Disassembly Flowchart This flowchart indicat

26、es the disassembly steps to gain access to item(s) to be serviced. When reassembling, follow the steps in reverse order. Bend, route, and dress the cables as they were originally. 2. Disassembly Method Note: (1) Identification (location) No. of parts in the figures (2) Name of the part (3) Figure Nu

27、mber for reference (4) Identification of parts to be removed, unhooked, unlocked, released, unplugged, unclamped, or desoldered. Axx = Screw, CNxx/Jxx/CONxx = Connector D3.5X12BA is specification of screw. * = Unhook, Unlock, Release, Unplug, or Desolder e.g. 7(A01) = seven Screws ID/ Loc. No. Part

28、Removal Fig. No. Remove/*Unhook/ Unlock/Release/ Unplug/Desolder Note 3 DVD Loader Driver, VFD Display Board, DVD Loader Driver, VFD Display Board 4USB Board, Ipod Docking Board USB Board, Ipod Docking Board 5 DVD Door DVD Door 2 Decoder Board, AMP Board Decoder Board, AMP Board 1 Back Cabinet 1 2 3

29、 4 5 Back Cabinet 4(A05) D3x12BA, 2(A06) D3x8BA 7(A09) D3x8PA, 4(A07) D3x8FA 5(A08) D3x10BA 4(A09) D3x8PA, 12(A02) D2.6x5FT 8(A03) D3x5PT 4(A10) D2.6x8PWT, 4(A09) D3x8PA, D1 D2 D3 D4 D5 Fig. D1 Fig. D2 A05 A06 A12 A09 A09 A08 A07 A08 9-2 Fig. D3 Fig. D4 Fig. D5 Cabinet Disassembly Instructions A10 A

30、09 A09 A02 A02 A03 A03 10-1 Troubleshooting FLOW CHART NO.1 The power cannot be turned on. Check the Power Switching Adaptor if it has DC 27V output . Check the 1st pin which location is U1 if it has DC 27V input Check the 2en pin which location is U1 if it has DC 5V output Try to replace a new AMP

31、Power Board Yes Check the Inductor which location is L1 if it has DC 5V Yes Yes No Replace the D11 256fsor 384fs VDDX12vddcocrystal oscillator and PLL supply voltage XTALIN13apiocrystal oscillator input XTALOUT14apiocrystal oscillator output VSSX15vsscocrystal oscillator and PLL ground RESET16ipthdt

32、5vreset input MODE017apiomode selection input 0 for static mode or microcontroller mode (grounded for I2C-bus) MODE118bpts5tht5vmode selection input 1 for static mode or AO address input and output for microcontroller mode MODE219bpts5tht5vmode selection input 2 for static mode or U_RDY output for m

33、icrocontroller mode SEL_STATIC20apioselection input for static mode, I2C-bus mode or L3-bus mode SLICER_SEL021bpts5tht5vSPDIF slicer selection input 0 for static mode and USER bit output for microcontroller mode SLICER_SEL122bpts5tht5vSPDIF slicer selection input 1 for static mode and AC3 preamble d

34、etect output for microcontroller mode SPDIF023apioSPDIF input 0 SPDIF124apioSPDIF input 1 SPDIF225apioSPDIF input 2 SPDIF326apioSPDIF input 3 VDDI27vddidigital core supply voltage VSSIS28vssisdigital core ground MP029apiomulti-purpose pin 0: frequency select for static mode, not used for microcontro

35、ller mode MP130iptht5vmulti-purpose pin 1: SFOR1 for static mode, SCL for I2C-bus mode and L3CLOCK for L3-bus mode MP231iic400kt5vmulti-purpose pin 2: SFOR0 for static mode, SDA for I2C-bus mode and L3DATA for L3-bus mode VADCP32vddcopositive ADC reference voltage VADCN33vssconegative ADC reference

36、voltage VINL34apioADC left channel input VSSA235vsscoADC ground VINR36apioADC right channel input VDDA237vddcoADC supply voltage VREF38apioreference voltage for ADC and DAC VDDA139vddcoDAC supply voltage VOUTL40apioDAC left channel output VSSA141vsscoDAC ground VOUTR42apioDAC right channel output RT

37、CB43ipthdt5vtest control input MUTE44iipthdt5vDAC mute input SYMBOLPINPAD(1)DESCRIPTION Main Unit - Decoder Board Layout Diagram 18-918-9 Subwoofer - AMP/Power Board Circuit Diagram 19-119-1 Subwoofer - AMP/Power Board Circuit Diagram 19-219-2 IC5 TDA8920CJ 19-319-3 IC5: TDA8920 IC Specification Blo

38、ck Diagram OUT1 VSSP1 VDDP2 DRIVER HIGH MBL461 OUT2 BOOT2 TDA8920TH BOOT1 DRIVER LOW RELEASE1 SWITCH1 ENABLE1 CONTROL AND HANDSHAKE PWM MODULATOR MANAGEROSCILLATOR TEMPERATURE SENSOR CURRENT PROTECTION STABI MODE INPUT STAGE mute 9 8 IN1 IN1+ 22 21 2017 16 15 VSSP2VSSP1 DRIVER HIGH DRIVER LOW RELEAS

39、E2 SWITCH2 ENABLE2 CONTROL AND HANDSHAKE PWM MODULATOR 11 SGND1 7 OSC 2 SGND2 6 MODE INPUT STAGE mute 5 4 IN2 IN2+ 1924 VSSD HW 1 VSSA2 12 VSSA1 3 VDDA2 10 VDDA1 23431181 VDDP2 PROTSTABI VDDP1 SYMBOLPINDESCRIPTION VSSA21negative analog supply voltage for channel 2 SGND22signal ground channel 2 VDDA2

40、3positive analog supply voltage for channel 2 IN24negative audio input for channel 2 IN2+5positive audio input for channel 2 MODE6mode select input (standby/mute/operating) OSC7oscillator frequency adjustment or tracking input IN1+8positive audio input for channel 1 IN19negative audio input for chan

41、nel 1 VDDA110positive analog supply voltage for channel 1 SGND111signal ground for channel 1 VSSA112negative analog supply voltage for channel 1 PROT13time constant capacitor for protection delay VDDP114positive power supply for channel 1 BOOT115bootstrap capacitor for channel 1 OUT116PWM output fro

42、m channel 1 VSSP117negative power supply voltage for channel 1 STABI18decoupling internal stabilizer for logic supply HW19handle wafer; must be connected to pin 24 VSSP220negative power supply voltage for channel 2 OUT221PWM output from channel 2 BOOT222bootstrap capacitor for channel 2 VDDP223posit

43、ive power supply voltage for channel 2 VSSD24negative digital supply voltage MBL462 HW PROT BOOT1 VDDP1 VSSP1 OUT1 BOOT2 VSSP2 OUT2 VSSD VDDP2 STABI MODE VSSA1 VDDA1 SGND1 IN1+ IN1 VDDA2 IN2+ IN2 VSSA2 SGND2 OSC TDA8920TH 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 Fig.2 Pin confi

44、guration. (1) Pin 19 should be connected to pin 24 in the application. Pining Subwoofer - AMP Power Board Layout Diagram 19-419-4 Main Unit - Exploded View 20-120-1 Subwoofer - Exploded View 20-220-2 SUB016 For/98version Packing Exploded View 20-320-3 SPKL SPKR ACC12-A ACC12-C ACC15 ACC8,ACC9, ACC10,ACC11 SUB001 ACC12-D ACC12-B ACC1 ACC5 ACC2,ACC3,ACC4 ACC15 Main Unit ACC16 ACC12-E ACC13 ACC14 ACC12-F ACC12-G Revision List Revision List Version 1.0 * Initial Release 21-1