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1、DVD Recorder when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) Caution: 1. The Flat Pack-IC shape may differ by models. Use
2、an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. 2. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts fro
3、m damage. (Fig. S-1-2) Top View OutIn Bottom View Input 5 10 Pin 1 Pin 1 FFC Cable Connector CBA * Be careful to avoid a short circuit. Fig. S-1-1 1-3-2E6STA 3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the I
4、C when removing it. With Soldering Iron: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2) Lift each lead of the flat pack-IC upward one by one, using
5、 a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4) (3) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center
6、of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) Fig. S-1-2 Hot-air Flat Pack-IC Desoldering Machine CBA Flat Pack-IC Tweezers Masking Tape Fig. S-1-3 Flat Pack-IC Desoldering Braid Soldering Iro
7、n Fig. S-1-4 Fine Tip Soldering Iron Sharp Pin 1-3-3E6STA With Iron Wire: (1)Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2)Affix the wire to a workbenc
8、h or solid mounting point, as shown in Fig. S-1-5. (3)While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5. (4)Bottom of the flat pack-IC is fixed with glue to the CB
9、A; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (5)Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure that the
10、 flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. 2. Installation (1) Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replace
11、ment flat pack-IC more easily. (2) The “I” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.) (3) Solder all pins of the flat pack-IC. Be sure
12、 that none of the pins have solder bridges. Fig. S-1-5 To Solid Mounting Point Soldering Iron Iron Wire or Hot Air Blower Fig. S-1-6 Fine Tip Soldering Iron CBA Flat Pack-IC Tweezers Fig. S-1-7 Example : Pin 1 of the Flat Pack-IC is indicated by a mark. Fig. S-1-8 Presolder CBA Flat Pack-IC 1-3-4E6S
13、TA Instructions for Handling Semi-conductors Electrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electro- static charge during unpacking or repair work. 1. Ground for Human Body Be sure to wear a grounding band (1M) that is prop- erly grounded to remove a
14、ny static electricity that may be charged on the body. 2. Ground for Workbench (1)Be sure to place a conductive sheet or copper plate with proper grounding (1M) on the workbench or other surface, where the semi-conductors are to be placed. Because the static electricity charge on clothing will not e
15、scape through the body ground- ing band, be careful to avoid contacting semi-con- ductors with your clothing. CBA Grounding Band Conductive Sheet or Copper Plate 1M 1M CBA 1-4-1E9480FIS FUNCTION INDICATOR SYMBOLS Note: If a mechanical malfunction occurs, the power is turned off. When the power comes
16、 on again after that by pressing STANDBY-ON button, an error message is displayed on the TV screen for 5 seconds. TV screen When reel or capstan mechanism is not functioning correctly When tape loading mechanism is not functioning cor- rectly When cassette loading mechanism is not functioning correc
17、tly When the drum is not working properly P-ON+5V Power safety detection Led ModeIndicator Active When reel or capstan mechanism is not functioning correctly “A R” is displayed on a TV screen. (Refer to Fig. 1.) When tape loading mechanism is not functioning correctly “A T” is displayed on a TV scre
18、en. (Refer to Fig. 2.) When cassette loading mechanism is not functioning correctly “A C” is displayed on a TV screen. (Refer to Fig. 3.) When the drum is not working properly “A D” is displayed on a TV screen. (Refer to Fig. 4.) P-ON+5V Power safety detection “A P” is displayed on a TV screen. (Ref
19、er to Fig. 5.) A R Fig. 1 A T Fig. 2 A C Fig. 3 A D Fig. 4 A P Fig. 5 1-4-2E9480FIS Note: If an error occurs, a message with the error number appears on the screen. DescriptionError No.Error Description Sends the device id and the module ids and revisions of the Domino IC to the stdout port. 010000G
20、etting the information succeeded. Generates a test-image of a selected video standard on selected video output on the digital board. When no input is given, the default values will be used. Use nucleus DS_ANAB_VideoRouting to route the video signal on the analogue board output. 010100Generating the
21、test image succeeded. 010101Failed to set up DENC. 010102Invalid user input. 010103Test image not supported. Switches the test-image off.010200Stopping the test image generation succeeded. Generate an audio sine signal on the audio output of the digital board. 010300The sine signal was successfully
22、generated. 010301Generating the sine test audio failed. Stop generating the audio sine signal. 010400Switching off the audio sine signal succeeded. 010401Failed to stop sine test audio. Generate an audio sine signal on the audio output of the digital board for 4 seconds. 010500The sine signal burst
23、was successfully generated. 010501Generating the sine burst failed. 010502Failed to stop the sine burst. Mute the audio outputs of the digital board.010600Muting the audio succeeded. De-mute the audio outputs of the digital board.010700De-muting the audio succeeded. Check the connection to the DV-LE
24、D on the digital board by switching it on. 010800Switching the DV-LED on succeeded. Switch off the DV-LED on the digital board.010900Switching the DV-LED off succeeded Peek a value on a specified address. 011200Peeking on the specified address succeeded. 011201No address input. 011202Invalid address
25、. Poke a value on a specified address. 011300Poking the specified address succeeded. 011301No address input. 011302Invalid address/data. Check the communication between the IIC controller of the Chrysalis and the EEPROM. 030000Something is properly read so the communication is OK. 030004The communic
26、ation with the NVRAM failed. 030005The IIC bus initialisation failed. Check whether the EEPROM can be written to and read from. 030100The write-read test succeeded. 030101The IIC bus initialisation failed. 030102The communication with the NVRAM failed. 030103The read back value is different from the
27、 written value. Make the EEPROM empty, containing all zeroes. 030200The clearing of the NVRAM succeeded. 030201There was an IIC error. 030202Clearing the NVRAM failed. Modifies one or more locations in NVRAM and updates the checksum of the section modified. 030300Modifying the NVRAM contents succeed
28、ed. 030301Unable to initialise NVM. 030302Modifying the NVRAM contents failed. 030303Length out of range. 030304Unable to decode length. 030305Offset out of range. 030306unable to decode offset. 030307Unknown location specified. 030308No location is specified. 030309Number of values incorrect. 03031
29、0Error creating checksum. 030311Invalid data. X X Y Y Z Z Error code Nucleus nmber Nucleus group nmber 1-4-3E9480FIS Read out one or more locations in the NVRAM. 030400Value read. 030401Unable to initialise NVM. 030402Reading the NVRAM contents failed. 030403Length out of range. 030404Unable to deco
30、de length. 030405Offset out of range. 030406Unable to decode offset. 030407Unknown location specified. 030408No location is specified. Write to a specific memory address. 040200Writing to the SDRAM succeeded. 040201No address input. 040202No data input. 040203Address is not dividable by 4. 040204Inv
31、alid data. 040205Address out of range. 040206Invalid address. Read from a specific memory address. 040300Reading from the SDRAM succeeded. 040301No address input. 040302Address is not dividable by 4. 040303Address out of range. 040304Invalid address. Get the device (revision) type information of the
32、 FLASH IC. (manufacturer and device ID) 050000Getting the information from the FLASH succeeded. Check whether the FLASH can be written to and read from. 050100The FLASH write-read test succeeded. 050101Wrong BALO signature. 050102Wrong CONS signature. 050103Invalid CONS base. 050104Invalid CONS end
33、address. 050105All bits in the TEST region are filled with 0. 050106The WriteRead test failed. 050107The Write Failed. Read from a specific memory address. 050200Reading the FLASH succeeded. 050201No address input. 050202Invalid address. 050203Address is out of range. 050204Address is not dividable
34、by 2. Check the checksum of the application partitions by recalculating and comparing partition checksums. 050300The checksum is valid, the test succeeded. 050301Wrong BSTB signature. 050302Wrong BSTB checksum. 050303Wrong BALO signature. 050304Wrong BALO checksum. 050305Wrong CONS signature. 050306
35、Wrong CONS checksum. 050307Invalid BALO end address. 050308Invalid CONS base. 050309Invalid CONS end address. Calculate the checksum over all memory addresses. Used to check entire FLASH contents. 050400Calculating the checksum over all addresses succeeded. Calculate a checksum over a selected numbe
36、r of address locations. 050500Calculating the checksum over selected addresses succeeded. Get the device (revision) type information of the VIP IC. 060000Getting the information from the VIP succeeded. 060001The IIC bus initialisation failed. 060002The communication with the VIP failed. Check the co
37、mmunication between the IIC controller of the Domino and the VIP IC. 060100Communicating with the VIP succeeded. 060001The IIC bus initialisation failed. 060002The communication with the VIP failed. Switch the clock output on. 060200Switching the clock output on succeeded. 060201Switching the clock
38、output on failed. DescriptionError No.Error Description 1-4-4E9480FIS Switch the clock output off. 060300Switching the clock output off succeeded. 060301Switching the clock output off failed. Select an input video path to be switched to the analogue output of the VIP. 060400Selecting the input of th
39、e VIP succeeded. 060401The user provided wrong input. 060402The VIP was not accessible. 060405This mode not available on SAA7118. Get the device (revision) type information of the 1394 Physical layer IC. 070100Getting the information from the physical layer IC succeeded. 070101Missing PHY clock. 070
40、102Time-out error. 0701031394 chip is not IEEE 1394a-2000 compliant. Check the accessibility of the 1394 Physical layer IC by writing to and reading from a specific address. 070300Communicating with the physical layer IC succeeded. 070301Missing PHY clock. 070302Time-out error. 070303Register write
41、test failed. Route a DV stream containing an audio and video signal through the physical IC to the Domino. This will be loopthrough to the video output of Domino. 070400Routing the signals succeeded. 070405Failed to initialise DENC. Check whether a DV node can be detected by the hardware. 070500The
42、node was detected OK. 070504No node was detected. Check the device type of the DENC in use. 080100Communicating with the progressive scan DENC-IC succeeded. 080101The IIC bus initialisation failed. 080102No valid DENC detected. Check the communication between the IIC controller of the Domino and the
43、 DENC-IC. 080100Communicating with the progressive scan DENC-IC succeeded. 080104Communicating with the DENC failed. 080105The IIC bus initialisation failed. Generate a test image and make it present on the DENC-IC. 080200The generation of the test image succeeded. 080201The IIC bus initialisation f
44、ailed. 080202Unable to initialise the DENC. 080203The generation of the test image failed. Switch off the generated test image. 080300Turning off the test image succeeded. 080301The IIC bus initialisation failed. 080302The test image could not be turned off. Turn on MacroVision. 081000Turning on Mac
45、roVision succeeded. 081001The IIC bus initialisation failed. 081002Unable to access DENC. Turn off MacroVision. 081000Turning off MacroVision succeeded. 081001The IIC bus initialisation failed. 081002Unable to access DENC. Check the communication between the digital board and the recorder drive by i
46、ssuing an Inquiry command over ATAPI bus. 090000Communicating with recorder drive succeeded. 090001Recorder drive init fails. 090002Recorder drive command fails. Reset the basic engine. 090100Resetting the Basic Engine succeeded. 090101Recorder drive init fails. Return the self-test results through
47、the service port.090200Self test succeeded, no errors. Get the version of the basic engine and that of the optical unit. 090300BE version OK. 090301Recorder drive init fails. 090302Recorder drive command fails. Open the tray of the basic engine. 090400The command executed successfully. 090401Recorde
48、r drive init fails. 090402Recorder drive command fails. Close the tray of the basic engine. 090500The command executed successfully. 090501Recorder drive init fails. 090502Recorder drive command fails. DescriptionError No.Error Description 1-4-5E9480FIS Write data to and read data from a DVD+RW disc
49、 through the basic engine for verification of the writing. 090600The command executed successfully. 090601Sanyo drive init fails. 090602Failed to close tray. 090603Failed to get disc type. 090604Not DVD+RW disc. 090605Buffer wait failed. 090606Write command failed. Sensekey = XX,YY,ZZ. 090607Failed to synchronize cache. Sensekey = XX,YY,ZZ. 090608Read command failed. Sensekey = XX,YY,ZZ. 090609Data read back is different from written data. Write data to and read data from a DVD+R disc through the basic engine for verification of the writing. 090700The command executed successfu