Philips-HTS-5131-Service-Manual(1) 电路图 维修手册.pdf

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1、1 - 1 HTS5131/12/98/51/94/78 Copyright 2011 Philips Consumer Electronics B.V. Eindhoven, The Netherlands All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise wi

2、thout the prior permission of Philips. Published by RY_LYF 1201 Service Audio Printed in The Netherlands Subject to modification BD Home Theater System Version 1.5 TABLE OF CONTENTS Location Of PCB Boards. 1-2 Versions Variation . 1-2 Measurement Setup . 1-6 Specifications . 1-3 Service Aids . 1-7 E

3、SD fr Reparaturen sind Original-Ersatzteile zu verwenden. Sicherheitsbauteile sind durch das Symbol ! markiert. I Le norme di sicurezza esigono che lapparecchio venga rimesso nelle condizioni originali e che siano utilizzati i pezzi di ricambio identici a quelli specificati. Componenty di sicurezza

4、sono marcati con ! . GB After servicing and before returning set to customer perform a leakage current measurement test from all exposed metal parts to earth ground to assure no shock hazard exist, The leakage current must not exceed 0.5mA. CLASS 1 LASER PRODUCT 3122 110 03420 GBWarning ! Invisible

5、laser radiation when open. Avoid direct exposure to beam. SVarning ! Osynlig laserstrlning nr apparaten r ppnad och sprren r urkopplad. Betrakta ej strlen. SFVaroitus ! Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina nkymttmlle laseristeilylle. l katso steeseen! GBWARNING All ICs a

6、nd many other semi-conductors are susceptible to electrostatic discharges (ESD). Careless handling during repair can reduce life drastically. When repairing, make sure that you are connected with the same potential as the mass of the set via a wrist wrap with resistance. Keep components and tools al

7、so at this potential. F ATTENTION Tous les IC et beaucoup dautres semi-conducteurs sont sensibles aux dcharges statiques (ESD). Leur longvit pourrait tre considrablement courte par le fait quaucune prcaution nest prise leur manipulation. Lors de rparations, sassurer de bien tre reli au mme potentiel

8、 que la masse de lappareil et enfiler le bracelet serti dune rsistance de scurit. Veiller ce que les composants ainsi que les outils que lon utilise soient galement ce potentiel. ESD DWARNUNG Alle ICs und viele andere Halbleiter sind empfindlich gegenber elektrostatischen Entladungen (ESD). Unsorgfl

9、tige Behandlung im Reparaturfall kan die Lebensdauer drastisch reduzieren. Veranlassen Sie, dass Sie im Reparaturfall ber ein Pulsarmband mit Widerstand verbunden sind mit dem gleichen Potential wie die Masse des Gertes. Bauteile und Hilfsmittel auch auf dieses gleiche Potential halten. DKAdvarse !

10、Usynlig laserstrling ved bning nr sikkerhedsafbrydere er ude af funktion. Undg udsaettelse for strling. F Pour votre scurit, ces documents doivent tre utiliss par des spcialistes agrs, seuls habilits rparer votre appareil en panne. GB ESD PROTECTION EQUIPMENT Complete Kit ESD3 (small tablemat, wrist

11、band, connection box, estention cable and earth cable .4822 310 10671 Wristband tester . 4822 344 13999 1 - 9 Pb(Lead) Free Solder When soldering , be sure to use the pb free solder. INDENTIFICATION: Regardless of special logo (not always indicated) onemusttreatallsetsfrom1 Jan2005onwards,according

12、next rules: Important note: In fact also products of year 2004 must be treatedin this way as long as youavoidmixingsolder- alloys(leaded/ lead-free). Sobest to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have to be respected by the workshop du

13、ring a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste withinworkshopsshouldbeavoidedbecausepaste is not easy to store and to handle.

14、 Use only adequate solder tools applicable for lead- free solder alloy. The solder tool must be able To reach at least a solder-temperature of 400?C, To stabilize theadjustedtemperature atthesolder- tip To exchange solder-tips for different applications. Adjust your solder tool so that a temperature

15、 around 360?C 380?C is reachedandstabilized at thesolder joint.Heating-timeofthesolder-jointshould notexceed 4 sec. Avoid temperatures above 400?C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un- used equipment, or reduce hea

16、t. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoidmixed solderalloy types (leadedand lead-free). Ifonecannot avoidordoes not knowwhetherproduct is lead-free, clean carefully the solder-joint from old solder alloy and re-sold

17、er with new solder alloy (SAC305). Use only original spare-parts listed in the Service- Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: Always use the 12nc-recognizable soldering temperature profile of the specific BGA (

18、for de- solderingalwaysuse thelead-free temperatureprofile, in case of doubt) Lead free BGA-ICs will be delivered in so-called dry- packaging(sealedpack including a silica gelpack) to protect the IC against moisture. After opening, dependent of MSL-level seenonindicator-labelin the bag, the BGA-IC p

19、ossibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end

20、 of the service-period. For repair of such sets nothing changes. On our websitewww.atyourservice.ce.P you find more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets You will find this and more technical information within the “maga

21、zine”, chapter “workshop news”. For additional questions please contact your local repair-helpdesk. 2 - 12 - 1 Software upgrade & Procedure to restore product setting 1) Restore factory setting a) Press “” button on R/C. b) Select , then press “OK” button on R/C. c) Select , then press button on R/C

22、. d) Select ,then press to confi rm. 2) Password change a) Press “” button on R/C. b) Select , then press “OK” button on R/C. c) Select , then press button on R/C. d) Select , then press button on R/C. “0000” is default password supplied. 3) Trade mode a) In open model,press “” button on R/C. b) Pre

23、ss “2” “5” “9” on R/C,VFD will display “TRA ON” or “TRA OFF”. 4) Check software version a) Press “” button on R/C b) Select , then press button on R/C. c) Select ,then press button on R/C. d) TV will show message as follow: Model:HTS5131/12/98/51/94 Versions: System SW:XXX Subsystem SW:XX-XX-XX-XX E

24、thernet MAC:XX:XX:XX:XX:XX:XX Close e) Select on the version display screen and press button to exit . 5) Upgrading new software Method 1: Update software from a USB storage device a) Create a folder named “UPG_ALL” in your USB storage device, and Copy the latest upgrading software into the folder.

25、b) Connect the USB storage device to the home theater. c) Press “” button on R/C, and select . d) Select . e) TV will show message as follow: Now searching for upgrade software! Please wait.! Software updates for this player have been found. Do you want to upgrade? CancelStart f) Select , press butt

26、on on R/C. Software upgrade will take 5 minutes Do not switch off! Package version: 000025.0 Software BE 80% Software FE Completed Software MCU1: Software Dock: Software MCU3: Software upgrade will take 5 minutes Do not switch off! Package version: 000025.0 Software BE Completed Software FE Complete

27、d Software MCU1: Not started Software Dock: 2% Software MCU3: Not started Software upgrade will take 5 minutes Do not switch off! Package version: 000025.0 Software BE Completed Software FE Completed Software MCU1: 1% Software Dock: Failed Software MCU3: g)The set will shut down automatically when t

28、he software upgrade is completed. Method 2: Update software from the internet Note: To check for new updates, compare the current software version of your home theater with the latest software version (if available) on the Philips web site, and for BD-Live application and software update, make sure

29、that the network router has access to the Internet and the firewall is disabled. a) The “LAN” jack at the back panel of the set must be connect to the network router via network cable and the set connect to TV, Prepare the connection as shown follow: b) Press “” button on R/C, and select . c) Select

30、 . d) TV will show message as follow: Now searching for upgrade software! Please wait.! Software updates for this player have been found. Do you want to upgrade? CancelStart e) Select , press button on R/C. LAN www /NI IMDH CRA I MDH Software upgrade will take 5 minutes Do not switch off! Package ve

31、rsion: 000025.0 Software BE 80% Software FE Completed Software MCU1: Software Dock: Software MCU3: 2 - 22 - 2 f) The set will shut down automatically when the software upgrade is completed. 6) How to replace the defective Blu-ray Loader a) Remove the defective Blu-ray Loader. b) Loosen 2 screws “A”

32、on the top of BD loader jack pcb to remove the board as shown below. A c) Loosen 4 screws “B” to take out the “Sanyo TRV-414H05” as shown below. B d) Blu-ray Loader to connect “HA802” on the top of BD Board as shown below. ? e) Remove soldered joint on the ESD protection points. Note: The 2 ESD prot

33、ection points on any one side must be soldered if o the Blu-ray Loader is OK and needs to be disconnected from connector HA802 of the BD Board. o the defective Blu-ray Loader is needed to be send back to supplier for failure analysis and to support backcharging evidence. CAUTION! This information is

34、 confi dential and may not be distributed.Only a qualifi ed service person should reprogram the Region Code. Software upgrade will take 5 minutes Do not switch off! Package version: 000025.0 Software BE Completed Software FE Completed Software MCU1: Not started Software Dock: 2% Software MCU3: Not s

35、tarted Software upgrade will take 5 minutes Do not switch off! Package version: 000025.0 Software BE Completed Software FE Completed Software MCU1: 1% Software Dock: Failed Software MCU3: The ESD protection points on the top of board 7) OSD Language setup (only for 51 version) a) Press “” button on

36、R/C. b) Select , then press “OK” button on R/C. c) Select , then press button on R/C. d) Select , then press button on R/C. C) Select , then press button on R/C. 2 - 32 - 3 REPAIR INSTRUCTIONS-part one 2 - 42 - 4 REPAIR INSTRUCTIONS-part two 3 - 13 - 1 DISASSEMBLY INSTRUCTIONS Dismantling of the Rea

37、r Panel Assemble 1) Loosen 2 screws “A” at the rear panel to remove rear stand as shown in fi gure 1. 2) Loosen 12 screws “B” at the rear panel to remove rear panel as shown in fi gure 2. Figure 8 Figure 1 Figure 2 Figure 3 Figure 4 Dismantling of the Main Board 1) Loosen 6 screws “F” on the top of

38、main board as shown in fi gure 6. 2) Loosen 5 screws “G” at the main board jack bracket to remove the main board as shown in fi gure 7. Figure 6 Dismantling of the BD Board 1) Loosen 2 screws “H” at the BD board jack bracket as shown in fi gure 8. 2) Loosen 6 screws “I” to remove BD board as shown i

39、f fi gure 9. Figure 10 Note:In some service positions the components or copper patterns of one board may risk touching its neighbouring pc boards or metallic parts. To prevent such short-circuit use a piece of hard paper or other insulating material between them. A B Dismantling of the WIFI & MP3 Bo

40、ard 1) Loosen 2 screws “C” on the top of WIFI board as shown in fi gure 3. 2) Loosen 2 screws “D” on the top of MP3 board as shown in fi gure 4. C Dismantling of the PCB Bractket 1) Loosen 9 screws “E” at the PCB bracket as shown in fi gure 5. D F G Figure 7 H I Figure 9 Dismantling of the Power Boa

41、rd 1) Loosen 6 screws “J” to remove the power board as shown in fi gure 10. 2) Loosen 2 screws “K” to remove the AC socket as shown in fi gure 11. J K Figure 11 E Figure 5 3 - 23 - 2 SERVICE POSITIONS Dismantling of the BD Module 1) Loosen 6 screws “L” as shown in fi gure 12. 2) Loosen 2 screws “M”

42、to remove the BD module as shown in fi gure 13. Note: When install the BD module, please note the part of as shown in fi gure 14. Figure 12 Figure 13 Service Position A - Main Board Service Position B - BD Board L M Dismantling of the VFD Board 1) Loosen 1 screw “N” on the top of VFD board to remove

43、 the VFD board as shown in fi gure 15. N O Figure 15 Figure 16 Dismantling of the Touch Board 1) Loosen 6 screws “O” to remove the Touch board as shown in fi gure 16. Dismantling of the Stop SW+Open SW+Close SW Board & Damper 1) Loosen 2 screws “P” to remove stop sw+open sw board as shown in fi gure

44、 17. 2) Loosen 1 screws “Q” to remove close sw board as shown in fi gure 18. Figure 14 P Q Figure 17Figure 18 3 - 33 - 3 Service Position C - VFD Board Service Position D - ALL Board 4 - 14 - 1 BLOCK DIAGRAM 4 - 24 - 2 WIRING DIAGRAM V7 V6 V3 V2 V5 V8 V1 V4 AC V10 V11 V12 V16 V17 V15 V14 V13 5 - 15

45、- 1 QUICK START GUIDE The following excerpt of the QSG/DFU serves as an introduction to the set. The complete Direction for Use can be download in the different languages from the internet site of Philips Consumer Care Center:. Quick start guide User manual Asia Pacific, Russia 5 - 25 - 2 MUSIC iLIN

46、K Wi-Fi ANTENNA DOCK for iPod L (WHITE) R (RED) AUDIO IN-AUX COAXIAL OPTICAL DIGITAL IN LAN VIDEO OUT (YELLOW) HDMI OUT (ARC) AC MAINS HDMI OUT (ARC) AC MAINS ANTENNA Europe only MUSIC iLINK 110-127V 220-240V Asia Pacific only HDMI (ARC) 5 - 35 - 3 1 2 TV HDMI 1 5 - 45 - 4 HOME THEATERHOME THEATER 3 4 2 3 3 4 1 2 3 2 3 1 2 3 MUSIC iLINK 1 5 - 55 - 5 DOCK for iPod 3 1 2 6 - 16 - 1 MAIN+VFD+FR+FL+MP3+WIFI+OPEN+CLOS+RFS BOARD TABLE OF CONTENTS Internal IC Diagram .6-1 Circuit Diagram (part one) .6-2 Circuit Diagram (part two) .6-3 PCB Layout Top View .6-4 PCB Layout Bottom Vie

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