Philips-HTS-5510-C-Service-Manual(1) 电路图 维修手册.pdf

《Philips-HTS-5510-C-Service-Manual(1) 电路图 维修手册.pdf》由会员分享，可在线阅读，更多相关《Philips-HTS-5510-C-Service-Manual(1) 电路图 维修手册.pdf（56页珍藏版）》请在收音机爱好者资料库上搜索。

1、Published by KC-TE 0519 AV Systems Printed in the Netherlands Subject to modifi cation EN 3139 785 31570 HTS5510C/75/98DVD Player CLASS 1 LASER PRODUCT 1 Technical Specifi cations and Connection Facilities 2 Location of PC Boards 2 Technical Specifi cations 3 Measurement Setup 4 Service Aids 5 Lead

2、Free Requirements 7 2 Dismantling instructions fr Reparaturen sind Original-Ersatzteile zu verwenden. Sicherheitsbauteile sind durch das Symbol ! markiert. I Le norme di sicurezza esigono che lapparecchio venga rimesso nelle condizioni originali e che siano utilizzati i pezzi di ricambio identici a

3、quelli specificati. Componenty di sicurezza sono marcati con ! GB After servicing and before returning set to customer perform a leakage current measurement test from all exposed metal parts to earth ground to assure no shock hazard exist. The leakage current must not exceed 0.5mA. Technical Specifi

4、 cations and Connection Facilities EN 7HTS5510C/75/98 Technical Specifi cations and Connection Facilities1. Lead Free Requirements Pb(Lead) Free Solder When soldering , be sure to use the pb free solder. INDENTIFICATION: Regardless of special logo (not always indicated) one must treat all sets from

5、1 Jan 2005 onwards, according next rules: Important note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have

6、 to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because

7、paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different application

8、s. Adjust your solder tool so that a temperature around 360C 380C is reached and stabilized at the solder joint. Heating- time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and fl ux-fl uid will be destroyed. To avoid wear

9、-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead- free,

10、clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12

11、nc-recognizable soldering temperature profi le of the specifi c BGA (for de-soldering always use the lead-free temperature profi le, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry- packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After

12、 opening, dependent of MSL- level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded

13、solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P you fi nd more information to: ? BGA-de-/soldering (+ baking instructions) ? Heating-profi les of BGAs and other IC

14、s used in Philips-sets You will fi nd this and more technical information within the “magazine”, chapter “workshop news”. For additional questions please contact your local repair-helpdesk. EN 8HTS5510C/75/982. 2.1 Dismantling of the SD5.5_5dis changer 1) The tray can be manually open by inserting a

15、 minus screw drive and push the lever in the direction as shown in Figure 1 to unlock the tray before sliding it out. 2) Slide out the tray and remove the Cover Tray (pos 110) as shown in Figure 2. Figure 1 3) Loosen 7 screws to remove the Front Top.(pos 240) - 2 screw each on the left & right side

16、(pos 272) - 3 screws A behind 4) Loosen 6 screws G (see Figure 4a and 4b) to remove the SD5.5_5dis changer. Figure 2 2. Dismantling Instructions Push lever in direction shown to open the tray manually 2.2 Dismantling of the Tuner Module, AV Board, SD6.3 ,Front Board, PSU Module 1) Loosen 2 screw B (

17、see Figure 3a) to remove the Tuner Module (pos 1040). 2) Loosen 4 screws C (see Figure 3b) to remove AV Board 1. 3) Loosen 4 screws D (see Figure 3c) and 2 screws H (see Figure 4a) to remove AV Board 2. 4) Loosen 2 screws E (see Figure 4a) to remove the PSU Module. 5) Loosen 6 screws I (see Figure 4

18、a) and 4 snap hooks to remove Front Board. - 1 snap hook each on the left & right side (pos 161). - 2 snap hooks on the bottom side (pos 161). Figure 3a Figure 3b Figure 3c D A B C Dismantling Instructions & Service Positions EN 9HTS5510C/75/982.Dismantling Instructions & Service Positions Figure 4a

19、 2.3 Service Positions Figure 5 Figure 7 Figure 4b Figure 6 Figure 8 I E G H F Catch G Insert Thick Insulation Sheet in between the AV Board 1 and 2. AV Board 2 AV Board 1 AV Board 1 Thick Insulation Sheet Thick Insulation Sheet PSU Thick Insulation Sheet Front Board Thick Insulation Sheet SD6.3 AV

20、Board 2 EN 10HTS5510C/75/98 3. Diagnostic Software Service test program To start service test program hold open/close and buttons depressed while plugging in the mains cord Display shows “SERVICE” followed by ROM version “S-Vxx-yy” S refers to Service Mode V refers to Version xx refers to Software v

21、ersion number of BEA (counting up from 01 to 99) yy refers to Software version number of Front uP (counting up from 01 to 99) Hold open/close and buttons depressed till the Display shown “S-Vxx-yy” TESTActivated withACTION EEPROM FORMAT TEST DISC 1 Load default data. Display shows “NEW”. Caution! Al

22、l presets from the customer will be lost! ROTARY ENCODER TEST Volume Knob Display shows value for 2 seconds. Volume values increases or decreases in steps of 1 until 0 (VOL MIN) or 40 (VOL MAX) is reached. LEAVE SERVICE TEST PROGRAM Disconnect mains cord Main Menu Key “Display Test” triggered? Displ

23、ay Test n Activate and display “Pattern1” y Display Test Following display patterns are used to test the display and its connections to P. Pattern 1: All display control pins are ON All LEDs are ON. - to check for open-circuits Pattern 2: Alternate display control pins are ON (Test Pattern: 0 x55) T

24、he following LEDs are ON: DiscAvailable1 DiscAvailable3 DiscAvailable5 DiscActive2 DiscActive4 - to check for short-circuits (tbd) Key “Display Test” triggered? n y Activate and display “Pattern2” Key “ ” triggered? n y Key “ ” triggered? y n 3.Diagnostic Software EN 11HTS5510C/75/98 Reprogramming o

25、f DVD version Matrix After repair, the customer setting and region code may be lost. Reprogramming will put the set back in the state in which it has left the factory, ie. with the default setting and the allowed region code. HTS5x00 Software Version Matrix Model Key Sequence Region Region Code TV T

26、ype 1HTS5510C/75 Open Tray 9999 Audio 4 Australia4PAL 2HTS5510C/98 Open Tray 9999 Audio 5 AP3PAL To reprogram do as follows: 1) Power up the set and select DISC source. 2) Open tray by press “OPEN/CLOSE” button on the set or press and hold “STOP” button on the RC. 3) Press the following buttons on t

27、he Remote Control: . for HTS5510C/75 . for HTS5510C/98 4) The display shows YYYY-ZZ and the tray will close. YYYY = model number (eg. 8300, 8500, etc.) ZZ = slash stroke version (eg. 01, 69, etc.) Procedure for check Software version 1) Power up the set and select DISC source. 2) Open tray by press

28、“OPEN/CLOSE” button on the set or press and hold “STOP” button on the RC. 3) Press “DISPLAY” button on the Remote control. 4) The TV screen will shows: SD6.3 Vxx YYYY-ZZ A BB SERVO: nnnnnnnn REG:A xx = version number YYYY = model number (eg. 8300, 8500, etc.) ZZ = slash stroke version (eg. 01, 69, e

29、tc.) A = region code BB = Front uP software version number nnnnnnnn = servo version number Procedure to upgrade software 1) Power up the set and select DISC source. 2) Open tray by press “OPEN/CLOSE” button on the set or press and hold “STOP” button on the RC. 3) Place Upgrade CD-ROM with fi lename

30、“HTS5500.bin” onto tray and close. 4) The set will response and display the following: - LOAD (After the disc is read, the tray will open for you to remove the disc) - ERASE (Erasing disc) - WRITE (Writing disc) - ERROR (if upgrade is unsuccessful) - UPG END (if upgrade is successful) - DISC-CLOSE-L

31、OAD (Tray will close indicating that the upgrade process is completed) 5) The whole process should not take more than 5 minutes. Caution: Do not unplug the set until upgrade is completed. Trade Mode Trade mode is a feature that will block all set keys when enabled. It is for dealers to prevent custo

32、mers from removing disc, changing source etc using the set keys. Rotary and Remote Control (RC) keys are still allowed inTrade mode. To activate Trade Mode: 1) Power up the set and select DISC source. 2) Open tray by press “OPEN/CLOSE” button on the set or press and hold “STOP” button on the RC. 3)

33、Then press buttons on the RC. 4) The display shows TRA ON and the tray will close. Trade Mode is now enabled. To deactivate Trade Mode: 1) Power up the set and select DISC source. 2) Open tray by press and hold “STOP” button on the RC. 3) Then press buttons on the RC. 4) The display shows TRA OFF an

34、d the tray will close. Trade Mode is now disabled. Procedure to change Tuner Grid (not for all versions) In North and South America, the frequency step between adjacent channels in the MW band is 10kHz (9kHz in some areas). The preset frequency step in the factory is 9kHz. IMPORTANT! Changing the tu

35、ning grid will erase all previously stored preset radio stations. 1) Press TUNER on the remote (or press SOURCE control on front panel) to select “FM” or “MW”. 2) Press STANDY ON to switch the DVD system to standby mode. 3) While holding down SOURCE and PREV on the front panel, disconnect and connec

36、t the power cord to the power supply again. - The display will show “GRID 9” or “GRID 10”. Helpful hints: - GRID 9 and GRID 10 indicate that the tuning grid is in step of 9kHz and 10kHz respectively. - The FM tuning grid also will be changed from 50kHz to 100kHz or vice versa. 3.Diagnostic Software

37、EN 12HTS5510C/75/983.Diagnostic Software Notes: EN 13HTS5510C/75/98 1 11 1 1 1 RDS_CLK GND_D PCM_Data_LR GND_D GND_D GND_D GND_D PCM_Data_SLR PCM_Data_Sub_Cen GND_ND 1 1 GND_D PCM_Data_LR GND_D RDS_CLK RDS_DAT SCL-DAC SDA-DAC GND_D GND_D GND_D PCM_Data_SLR PCM_Data_Sub_Cen GND_ND 1 1 1 DNG +1V8_Sens

38、e GND_D GND_D +1V8 SCL-DAC SDA-DAC KLCSMCP OL_ATADMCP DNG KLCMCP KLCRLMCP DNG ted_ c i M DNG tuo_FIDPS DNG 05P 1 DNG KLCSMCP OL_ATADMCP DNG KLCMCP KLCRLMCP DNG ted_ c i M DNG tuo_FIDPS DNG 05P 3en i L / 1TRACS 3en i L / 0TRACS 1 1 Y C V_DNG SBVC U_B DNG ETUM_VA n i _ c i M_ATAD_MCPFIDPS V_DNG 1 1 +1

39、V8_Sense GND_D GND_D +1V8 2 en i L / CN V_DNG V_DNG Y_G V_DNG V_R V_DNG 1 1 1 1 1 V_DNG 1 1 1 RDS_DAT 3en i L / 1TRACS 3en i L / 0TRACS 2 en i L / CN V_DNG V_DNG Y_G V_DNG V_R V_DNG Y C V_DNG SBVC U_B DNG ETUM_VA n i _ c i M_ATAD_MCPFIDPS Block Diagram_HTS5500C_HYwk512 4. Set Block diagram Set Block

40、 Diagram4. EN 14HTS5510C/75/985. HEADPHONE GND OUT VS (SAA6581) RDS (TM 08) TUNER 74HC4052 Wiring Diagram_3139 249 27191_HYwk511 5. Set wiring diagram Set Wiring Diagram EN 15HTS5510C/75/98 6. Panel Front Boards Front Display - Component Layout Panel Front Boards6. 3139 243 3174 pt5 wk541 Front Disp

41、lay - Chip Layout 3139 243 3174 pt5 wk541 EN 16HTS5510C/75/98 Front Display - Circuit Diagram Panel Front Boards RESET VASS INT3 INT2 INT4 INT5 XTIN XTOUT SCL V P9 V SO1 5 6 7 6 5 4 3 2 29 28 27 26 25 24 2 3 4 TC1 SCK0 0 1 2 3 4 5 6 SI1 SCK1 DVO TEST VKKVDDVAREF 14 13 12 11 10 9 8 SDA 22 TC3 P1 STOP

42、 P2 SI0 SO0 P3 AIN 31 30 P5 PD V3 P6 V P7 V P8 23 16 21 20 19 18 17 P4 AIN 1 0 15 VSS PDO 2 1 XTAL P0 PPG PWM TC4 13 12 11 10 7 INT0 INT1 TC2 5V * 3342 - 150 YAMAHA C300 * * * -32V T359 A5 T360 C2 T361 H3 T362 H3 T363 H3 T364 H3 T365 C4 T366 D4 T367 D4 NC GND_B * 5V -25V * NC T338 C11 T339 C11 T340

43、C11 T341 C11 T342 C11 T343 C11 T344 C11 T345 C11 T346 C11 T347 C11 T348 C11 T349 C4 T350 C4 T351 C4 T352 C4 T353 G3 T354 D4 T355 E13 T356 B10 T357 B13 T358 A5 -30V NC T318 C6 T319 C6 T320 D6 T321 D6 T322 C6 T323 C6 T324 C6 T325 D6 T326 D6 T327 D6 T328 E6 T329 E6 T330 F6 T331 F6 T332 H3 T333 H3 T334

44、H3 T335 C3 T336 D2 T337 C11 -25V DC vtg measured in STOP MODE -30V - NIL PHILIPS HTS5500 -30V 1F MORF/OT -25V -11V 2F MORF/OT DISPLAY PANEL 5V3 T307 C12 T309 A5 T310 A5 T311 B3 T314 F6 T315 F6 T316 F6 T317 C6 NC 7302 F3 7303 E11 7304 E11 7305 E12 7306 H12 7307 D2 7308 C2 7309 I5 7310 H6 7311 I7 7312

45、 H8 T300 E4 T301 F3 T302 C10 T303 C13 T304 G4 T305 C11 T306 C12 P S U -18V -30V -18V NC -30V -25V 5V NC 4304 D5 4305 D5 5300 B7 6300 A3 6301 A4 6302 I11 6303 C1 6304 H6 6305 I6 6306 H8 6307 I8 7300 B7 7301 B10 5V2 NC 5V TO/FROM -22V 27V -30V DISC3_G 5V -27V V 3345 G6 3346 I6 3347 H6 3348 I8 3349 H8

46、3350 H7 3351 H5 4301 H4 4302 H4 4303 E3 NC NC A Optional +5VL -32V 5V -25V -27V # 3333 B5 3334 B6 3335 B10 3336 B13 3337 B10 3338 B13 3340 H7 3341 H5 3342 H6 3343 H6 3344 E6 5V 2V5 0V5 0V -30V -30V Key_B02 DISC1_Y OPTIONAL -20V 3324 C2 3325 C2 3326 D12 3327 E12 3328 E11 3329 F13 3330 F13 3331 F11 33

47、32 D5 1V6 DISC4_G B DISC5_G 3306 I12 3307 I11 3308 I11 3309 H4 3310 H4 3313 F6 3314 F6 3315 F6 3316 F6 3317 F6 3318 D6 3319 E6 3320 D6 3321 D3 3322 D3 3323 C3 DISC5_Y 5V * 2V 5V 2335 E13 2336 E13 2337 B7 2338 B7 2339 C5 2340 C6 2341 B7 3300 F4 3301 F4 3302 B3 3303 E3 3304 H11 3305 I11 -30V * NC NC 5

48、V 0V 2319 B8 2320 D11 2321 D11 2322 E11 2323 F13 2324 F11 2325 C13 2326 C13 2327 C13 2328 D13 2329 D13 2330 D13 2331 D13 2332 D13 2333 D13 2334 D13 -24V +12V * FTD DISPLAY 5V DISC1_G 8MHz 1304 C5 1305 B1 1306 B1 2300 E4 2301 E3 2302 A3 2303 B4 2304 B5 2305 B4 2306 B4 2307 B4 2308 I10 2309 I11 2310 I

49、11 2311 I4 2312 E6 2313 E6 2314 E2 2315 C1 2316 C3 2317 C3 2318 C2 DISC3_Y DISC2_Y NC -30V 910111213 123456789101112 5V -25V DISC4_Y -30V 5V FOR OEM MODELS ONLY NC MONO BOARD SD6.3 -32V -25V 12345678 V23- DISC2_G 0V 5V GND_FD 13 A B C D E F G H I A B C D E F G H I 1300 A5 1301 H3 1302 F3 1303 C4 613SAB 3036 TO/FROM * 1304 GND_FD 2033 K01 GND_FD VKK 100R 3303 6305 BAS316 BAS316 6304 2336100p GND 2 OUT 1 VS