Philips-HTS-4600-Service-Manual(1) 电路图 维修手册.pdf

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1、1 - 1 HTS4600/05/12 Copyright 2008 Philips Consumer Electronics B.V. Eindhoven, The Netherlands All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the

2、 prior permission of Philips. P ublis hed b y KC-RL1018 Serv i c e Audio P rint ed in The Net herlands Subject to modi f icat ion DVD Mini-HiFi System Version 1.1 TABLE OF CONTENTS Location of PCB Boards . 1-2 Versions Variation . 1-2 Measurement Setup . 1-4 Specifications . 1-3 Service Aids . 1-5 E

3、SD fr Reparaturen sind Original-Ersatzteile zu verwenden. Sicherheitsbauteile sind durch das Symbol ! markiert. I Le norme di sicurezza esigono che lapparecchio venga rimesso nelle condizioni originali e che siano utilizzati i pezzi di ricambio identici a quelli specificati. Componenty di sicurezza

4、sono marcati con ! . GB After servicing and before returning set to customer perform a leakage current measurement test from all exposed metal parts to earth ground to assure no shock hazard exist, The leakage current must not exceed 0.5mA. CLASS 1 LASER PRODUCT 3122 110 03420 GBWarning ! Invisible

5、laser radiation when open. Avoid direct exposure to beam. SVarning ! Osynlig laserstrlning nr apparaten r ppnad och sprren r urkopplad. Betrakta ej strlen. SFVaroitus ! Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina nkymttmlle laseristeilylle. l katso steeseen! GBWARNING All ICs a

6、nd many other semi-conductors are susceptible to electrostatic discharges (ESD). Careless handling during repair can reduce life drastically. When repairing, make sure that you are connected with the same potential as the mass of the set via a wrist wrap with resistance. Keep components and tools al

7、so at this potential. F ATTENTION Tous les IC et beaucoup dautres semi-conducteurs sont sensibles aux dcharges statiques (ESD). Leur longvit pourrait tre considrablement courte par le fait quaucune prcaution nest prise leur manipulation. Lors de rparations, sassurer de bien tre reli au mme potentiel

8、 que la masse de lappareil et enfiler le bracelet serti dune rsistance de scurit. Veiller ce que les composants ainsi que les outils que lon utilise soient galement ce potentiel. ESD DWARNUNG Alle ICs und viele andere Halbleiter sind empfindlich gegenber elektrostatischen Entladungen (ESD). Unsorgfl

9、tige Behandlung im Reparaturfall kan die Lebensdauer drastisch reduzieren. Veranlassen Sie, dass Sie im Reparaturfall ber ein Pulsarmband mit Widerstand verbunden sind mit dem gleichen Potential wie die Masse des Gertes. Bauteile und Hilfsmittel auch auf dieses gleiche Potential halten. DKAdvarse !

10、Usynlig laserstrling ved bning nr sikkerhedsafbrydere er ude af funktion. Undg udsaettelse for strling. F Pour votre scurit, ces documents doivent tre utiliss par des spcialistes agrs, seuls habilits rparer votre appareil en panne. GB ESD PROTECTION EQUIPMENT Complete Kit ESD3 (small tablemat, wrist

11、band, connection box, estention cable and earth cable .4822 310 10671 Wristband tester . 4822 344 13999 1 - 7 Pb(Lead) Free Solder When soldering , be sure to use the pb free solder. INDENTIFICATION: Regardless of special logo (not always indicated) onemusttreatallsetsfrom1 Jan2005onwards,according

12、next rules: Important note: In fact also products of year 2004 must be treatedin this way as long as youavoidmixingsolder- alloys(leaded/ lead-free). Sobest to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have to be respected by the workshop du

13、ring a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste withinworkshopsshouldbeavoidedbecausepaste is not easy to store and to handle.

14、 Use only adequate solder tools applicable for lead- free solder alloy. The solder tool must be able To reach at least a solder-temperature of 400?C, To stabilize theadjustedtemperature atthesolder- tip To exchange solder-tips for different applications. Adjust your solder tool so that a temperature

15、 around 360?C 380?C is reachedandstabilized at thesolder joint.Heating-timeofthesolder-jointshould notexceed 4 sec. Avoid temperatures above 400?C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un- used equipment, or reduce hea

16、t. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoidmixed solderalloy types (leadedand lead-free). Ifonecannot avoidordoes not knowwhetherproduct is lead-free, clean carefully the solder-joint from old solder alloy and re-sold

17、er with new solder alloy (SAC305). Use only original spare-parts listed in the Service- Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: Always use the 12nc-recognizable soldering temperature profile of the specific BGA (

18、for de- solderingalwaysuse thelead-free temperatureprofile, in case of doubt) Lead free BGA-ICs will be delivered in so-called dry- packaging(sealedpack including a silica gelpack) to protect the IC against moisture. After opening, dependent of MSL-level seenonindicator-labelin the bag, the BGA-IC p

19、ossibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end

20、 of the service-period. For repair of such sets nothing changes. On our websitewww.atyourservice.ce.P you find more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets You will find this and more technical information within the “maga

21、zine”, chapter “workshop news”. For additional questions please contact your local repair-helpdesk. 2 - 12 - 1 Current model HTS4600/05/12 Version: 00.12.01 region : 2 Servo: 5B.61.00.00 8032: 05.00.04.06 RISC: 00.00.02.00 MCU: V04.08 IF current model does not match you set use down arrow key on the

22、 remote to change OK System , Region Code , etc. Setting Produre 1)System Reset a) Press “OPTIONS“ button on R/C,TV will show setup menu b) Select the menu using the and on R/C c) Go preference page to do system reset 2)Region Code Change a) Open the CD Door, press”9” “9“ “9“ “9“ on R/C,then input d

23、esired number to change region code : 1 USA 2 EU 3 AP 4 Australia ,NZ , Latam 5 Russia , INDIA 6 CHINA 3)Version Control Change a) In open model, press “1“ “5“ “9“ on R/C b) Press “ok” button to conf rm c) TV will show message as below: 7) Upgrading new sofeware a) Copy “sofeware f les” into a CD-R

24、b) Open the CD Door,the insert CD into USB jack in the front panel c) Close the CD Door d) VFD will show: “Loading“ “Erase” - erase the f ash memory “Writing” about 1 minute “done “ * The system will switch off and on again automatically. e) OSD will show: CAUTION! This information is confi dential

25、and may not be distributed.Only a qualifi ed service person should reprogram the Region Code. 4)Password Change a) Press “OPTIONS “ button on R/C,TV will show setup menu b) Select the menu using the? and ? on R/C c) Go preference page select “password“ to change * 000000 is default password supplied

26、. 5)Check on the Sofeware Version a) Open the CD Door b) Press “INFO“ button on R/C c) TV will show the version on screen upgrade f le detected Do you wish to continue with the sofeware upgrade? OKCancel f) Select “OK”, OSD will show: upgrade in process. V4600 please do not unplug or switch off the

27、device. 6)Trade model a) Press “Open/Close “ button on R/C b) Press “2” “5” “9” on R/C,VFD will display “TRA ON “ or “TRA OFF“ 2 - 22 - 2 REPAIR INSTRUCTIONS (part one) 2 - 32 - 3 REPAIR INSTRUCTIONS (part two) 3 - 13 - 1 DISASSEMBLY INSTRUCTIONS (MAIN UNIT) Figure 4 Figure 1 Figure 2 Dismantling of

28、 the Front Panel Assemble 1) Push the base support to the right will remove it as shown in f gure 1. 2) Loosen 5 screws “A“ at the back panel as shown in f gure 2, and pull the front panel to remove it as shown in f gure 3. Figure 4 A PUSH PULL B Dismantling of the Middle Base 1) Loosen 5 screws “B”

29、 at the Middle Base as shown in f gure 4. Figure 7 Figure 5 Dismantling of the MAIN+IR+SW+CVBS+FCC+K1+K2+MP3 IN Board 1) Loosen 10 screws “ C “ on the top of MAIN+IR+SW+CVBS+FCC+K1+K2+MP3 IN board as shown in f gure 5. C 3 - 23 - 2 SERVICE POSITIONS Service position A Figure 6 Figure 1 Dismantling o

30、f the Back Panel 1) Loosen 8 screws “A” at the back panel to remove it as shown in f gure 1. Dismantling of the VFD Board 1) Loosen 7 screws “D“ to remove the VFD board as shown in f gure 6. D DISASSEMBLY INSTRUCTIONS (SUBWOOFER) A Dismantling of the Power Board 1) Loosen 4 screws “ B “ on the top o

31、f power board as shown in f gure 2. 2) With a pincers to nip this space as shown in f gurer 3 and to take up the power board. B Figure 2 Figure 3 3 - 33 - 3 Note:In some service positions the components or copper patterns of one board may risk touching its neighbouring pc boards or metallic parts. T

32、o prevent such short-circuit use a piece of hard paper or other insulating material between them. Dismantling of the AMP Board 1) Loosen 5 screws “C” at the back panel to remove AMP board as shown in f gure 4. C SERVICE POSITIONS Service position A Figure 4 4 - 14 - 1 BLOCK DIAGRAM 4 - 24 - 2 WIRING

33、 DIAGRAM (MAIN UNIT) V1 V3 V2 4 - 34 - 3 WIRING DIAGRAM (SUBWOOFER) 5 - 15 - 1 VFD BOARD TABLE OF CONTENTS FTD Display Pin Assignment .5-1 Circuit Diagram .5-2 PCB Layout Top & Bottom View .5-3 FTD DISPLAY PIN ASSIGNMENT PIN CONNECTION 5 - 25 - 2 CIRCUIT DIAGRAM 1234 1234 A B C A B C C201 A1 C205 B2

34、 C206 B2 C207 C3 C208 B3 C209 B3 C210 C1 C211 C1 C212 C1 C213 B2 C214 B1 C215 B1 CN804 A2 DP201 A3 FB201 A1 FB202 A1 FB203 A1 FB204 A1 FB205 A1 FB206 A1 FB207 A1 FB208 A1 FB209 A1 FB210 A1 FB213 A1 FB214 A1 FB216 A1 IC201 B3 Q201 A3 Q206 B1 R201 A2 R202 A2 R203 B1 R204 A3 R205 C2 R206 C2 R207 C2 R20

35、8 C2 R209 C2 R210 C2 R211 C2 R212 B3 R213 B3 R214 B1 R215 B1 R216 B1 R217 C1 R218 C1 R219 C1 R220 B2 RB205 B1 RB207 B1 5 - 35 - 3 PCB LAYOUT - TOP VIEW 1234 1234 A B C A B C C201 C2C206 C3C207 C3CN804 C2DP201 B1RB205 A1RB207 C2 5 - 45 - 4 PCB LAYOUT - BOTTOM VIEW 1234 1234 A B C A B C C205 B3 C208 A

36、1 C209 A3 C210 B3 C211 B3 C212 B3 C213 C2 C214 C3 C215 C3 FB201 A4 FB202 A2 FB203 A4 FB204 A4 FB205 A4 FB206 A4 FB207 B4 FB208 A2 FB209 A2 FB210 A3 FB213 B4 FB214 A2 FB216 A2 IC201 A2 Q201 C4 Q206 C3 R201 C3 R202 C3 R203 C3 R204 C3 R205 B2 R206 B3 R207 B3 R208 B3 R209 B3 R210 B3 R211 B3 R212 A4 R213

37、 A2 R214 C3 R215 C3 R216 C3 R217 A4 R218 A4 R219 A4 R220 B2 6 - 16 - 1 MAIN BOARD TABLE OF CONTENTS Internal IC Diagram .6-1 Circuit Diagram (part one) .6-2 Circuit Diagram (part two) .6-3 PCB Layout Top View .6-4 PCB Layout Bottom View .6-5 INTERNAL IC DIAGRAM - MT1389S INTERNAL IC DIAGRAM - STA309

38、A De- Interlacer Video DAC GPIO IR/VFD System CPU 32-bit RISC Memory Controller DRAM RASH ROM Motor Drive DVD PUH Module RF Amplifier Servo IO Spindle Control Debug Port Servo Processor Audio DSP System Parser CPPM/CPRM DRM 108MHz TV Encoder Video DAC CVBS,Y/C Component Video Video Processor MPEG-1/

39、2 JPEG Video Decoder Audio output Audio DAC SDPIF Analog Audio Output C HMDI 1.2 Tx HMDI Tx VBS,Y/C Component Video Audeo DAC 8ch Adio PCM USB 2.0 MS/SD/MMC Controller SACD Controller USB device MS/SD/MMC Card SACD DVB-T Controller DVB-T LRCKI BICKI SDI12 SDI34 SDI56 SKI78 I C 2 SASCLSDAMVO SYSTEM C

40、ONTROL CHANNEL MAPPING SERIAL DATA IN XTI PLL PLLB CKOUT SYSTEM TIMING VARIABLE OVER- SAMPLING TREBLE BASS EQ (BIQUADS) VOLUME LIMITING OVERSAMPING POWER DOWN PWDN EAPD VARIABLE DOWN- SAMPLING DDX OUT1A/B OUT2A/B OUT3A/B OUT4A/B OUT5A/B OUT6A/B OUT7A/B OUT8A/B LRCKO BICKO SDO12 SDO56 SDO34 SDO78 SER

41、IAL DATA OUT 6 - 26 - 2 CIRCUIT DIAGRAM - part one 1234 1234 A B C D A B C D C202 B4 C203 B4 C204 B4 C301 A1 C302 A1 C303 A1 C304 A1 C305 A2 C306 A2 C307 A2 C308 A3 C309 A3 C310 A3 C311 B3 C312 B3 C313 B3 C314 B4 C315 A1 C316 A1 C317 A1 C318 A1 C319 A1 C320 A1 C321 A2 C322 A2 C323 A3 C324 A3 C325 A3

42、 C326 A3 C327 A3 C328 A3 C329 A3 C330 A1 C331 A1 C332 B3 C333 B2 C334 A3 C335 B3 C336 B3 C337 B3 C338 B4 C339 A4 C340 B2 C341 B2 C342 B2 C343 B2 C346 B1 C347 B1 C348 B1 C349 B1 C350 A2 C351 B2 C352 B2 C353 B2 C354 B2 C355 B2 C356 A2 C357 B2 C358 B1 C401 D2 C402 D4 C403 D4 C404 D4 C405 B3 C406 D1 C40

43、7 C2 C410 C2 C411 C2 C412 B3 C414 D1 C415 C1 C416 D1 C417 C2 C418 C2 C419 B3 C420 C3 C421 C3 C422 D3 C423 C3 C424 C4 C425 C4 C426 D2 C427 D2 C428 D2 C429 D4 C430 D4 C432 B4 C433 D1 C434 B3 C435 B3 C436 D1 C437 C3 C438 D3 C440 C3 C441 C3 C442 C3 C443 C3 C444 C4 C445 C4 C446 C4 C447 B3 C448 C3 C449 C3

44、 C450 B3 C451 B3 C452 C3 C453 C3 C454 C3 C455 C3 C456 C3 C457 C3 C458 B3 C459 C3 C460 C3 C461 C1 C462 D4 C464 B3 C466 B4 C469 B4 C470 C4 C471 C1 C472 D2 C473 D1 C474 D1 C475 D1 C476 D1 C477 C4 C479 C4 C480 D2 C481 D2 C482 D2 C483 D2 C484 D2 C485 D4 C486 D4 C487 D1 C488 D1 C489 C3 C490 C3 C491 C3 C49

45、2 D1 C493 C4 CN203 A4 CN207 A4 CN301 A1 CN302 B2 D401 B1 D402 B1 D403 C1 D407 D3 D408 D3 D409 D3 FB215 A4 FB228 B4 FB229 A4 FB301 A4 FB302 B2 FB303 B2 FB304 B1 FB305 B1 FB306 B2 FB307 B2 FB308 A1 FB309 A1 FB310 A1 FB311 A1 FB312 B2 FB313 B2 FB401 D4 FB402 C4 FB405 C4 FB406 D4 FB407 D4 FB409 C4 IC301 A1 IC302 A2 IC303 A3 IC401 B3 IC402 B4 IC403 C3 IC404 C3 IC405 C2 JK301 A1 JK302 B3 JK401 C4 L302 B1 L401 D1 L402 C1 L403 D1 L404 C4 Q301 A3 Q401 B4 Q403 C1 Q405 D3 Q406 D4 Q407 D4 Q408 D3 Q413 D4 Q414 D4 Q415 D4 Q416 D3 Q417 D3