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1、SERVICE MANUAL COMPACT DISC PLAYER AEP Model UK Model E Model Australian Model SPECIFICATIONS CDP-S3 Ver 1.3 2002.12 CDP-S3 is the CD player section in MHC-S7AV or MHC-S3. Model Name Using Similar MechanismNEW CD Mechanism TypeCDM63B-30BD60 Base Unit NameBU-30BD60 Optical Pick-up NameOP Assy (A-MAX.
2、3) SystemCompact disc and digital audio system LaserSemiconductor laser (=780 nm) Emission duration: continuous Frequency response2 Hz 20 kHz (0.5 dB) Signal-to-noise ratioMore than 90 dB Dynamic rangeMore than 90 dB OPTICAL OUT (Square optical connector jack, rear panel) Dimensions (w/h/d)Approx. 2
3、80 x 108 x 330 mm MassApprox. 2.7 kg Design and specifications are subject to change without notice. 9-873-831-14Sony Corporation 2002L0500-1Home Audio Company C 2002.12Published by Sony Engineering Corporation RadioFans.CN 收音机爱 好者资料库 2 CDP-S3 SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED
4、BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. The laser diode in the optical pick-up block may suff
5、er electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The fle
6、xible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis- sion,
7、observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the “S curve check” in “CD section adjustment” and check that the S curve waveforms is output three times. Notes on chip component replacement Never reuse a disconnected chip component.
8、Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270 C dur- ing repairing. Do not touch the soldering iron on the same conductor of the circuit board. (within 3 times) Be careful not to app
9、ly force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. This appliance is classified as a CLAS
10、S 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. The following caution label is located inside the unit. RadioFans.CN 收音机爱 好者资料库 3 CDP-S3 TABLE OF CONTENTS 1.SERVICI
11、NG NOTES.4 2.GENERAL.5 3.DISASSEMBLY 3-1.Disassembly Flow .6 3-2.Cover .7 3-3.CD Mechanism Deck (CDM63B-30BD60) .7 3-4.MAIN Board .8 3-5.Front Panel Section .8 3-6.PANEL (L) Board, PANEL (R) Board .9 3-7.Lid (CD) .9 4.TEST MODE. 10 5.ELECTRICAL ADJUSTMENTS. 11 6.DIAGRAMS 6-1.Note for Printed Wiring
12、Boards and Schematic Diagrams . 12 6-2.Printed Wiring Board BD Section . 14 6-3.Schematic Diagram BD Section . 15 6-4.Printed Wiring Boards CD CHANGER Section . 16 6-5.Schematic Diagram CD CHANGER Section . 17 6-6.Printed Wiring Board MAIN Section . 18 6-7.Schematic Diagram MAIN Section . 19 6-8.Pri
13、nted Wiring Boards PANEL Section . 20 6-9.Schematic Diagram PANEL Section . 21 6-10. IC Pin Function Description . 24 7.EXPLODED VIEWS 7-1.General Section . 26 7-2.CD Mechanism Deck Section-1 (CDM63B-30BD60) . 27 7-3.CD Mechanism Deck Section-2 (CDM63B-30BD60) . 28 7-4.Base Unit Section (BU-30BD60)
14、. 29 8.ELECTRICAL PARTS LIST. 30 RadioFans.CN 收音机爱 好者资料库 4 CDP-S3 SECTION 1 SERVICING NOTES This set is a component of the MHC-S7AV or MHC-S3. The MHC-S7AV or MHC-S3 system configuration is as shown below, and therefore it does not operate normally unless all four components are connected. In perfor
15、ming the repair, connect all components with the system cables. Note: The precaution to the users is described on the label stuck on the back panel (CD player) and in the troubleshooting section in the Operation Manual. System Configuration: POWER SUPPLY AC IN TA SYSTEM ea es ed efegehejek DISC 13 e
16、k (14, 15, 21) DISC 13 indicators ej DISC 13 Z (eject) wl (14) PLAY MODE wj (14, 15, 21) REPEAT wk (14) N (play) eh (14, 15) X (pause) eg (14) x (stop) ef (14, 20) . (go back) ed (14, 15, 21) (go forward) es (14, 15, 21) m (rewind) e; (14) M (fast forward) ea (14) x hH H hH O o Pp MmX . 1 2 3 wg qh
17、qa wk wj wh wa 4 5 6 7 qs qf qd qg 8 9 q; qk ql w; qj wd ws wf es ea e; wl CD H es (14, 15) CHECK 5 (15) CLEAR 6 (15) CLOCK/TIMER SELECT qj (30) CLOCK/TIMER SET qk (13, 21, 29) DBFB qg (23) DISPLAY ws (13, 16, 18, 29, 35) D.SKIP 4 (14) ENTER wg (10, 12, 13, 15, 17, 18, 21, 22, 2630) EQ qd (27) EQ ON
18、/OFF qf (10, 28) FUNCTION wf (10, 14, 15, 20, 21, 31) GROOVE wa (23) SET UP qs (10, 12, 26, 28, 29) SLEEP 7 (29) SUR wd (25) TAPE A hH ea (19, 35) TAPE B hH e; (19, 20, 35) TUNER/BAND wl (17) TUNING + 9 (17) TUNING wh (17) TV CH +/ ql TV VOL +/ w; TV /1 2 TV/VIDEO 1 VOL +/ qh BUTTON DESCRIPTIONS /1
19、(power) 3 X (pause) q; x (stop) 8 . (go back) wk (go forward) wj m (rewind) wh M (fast forward) 9 O/o/P/p qa Remote Control CDP-S3 6 This set can be disassembled in the order shown below. 3-1.DISASSEMBLY FLOW SECTION 3 DISASSEMBLY 3-2. COVER (Page 7) 3-3. CD MECHANISM DECK (CDM63B-30BD60) (Page 7) 3
20、-6. PANEL (L) BOARD, PANEL (R) BOARD (Page 9) 3-7. LID (CD) (Page 9) 3-5. FRONT PANEL SECTION (Page 8) 3-4. MAIN BOARD (Page 8) SET CDP-S3 7 3-3.CD MECHANISM DECK (CDM63B-30BD60) Note: Follow the disassembly procedure in the numerical order given. 3-2.COVER 1two screws (case 3 TP2) 3cover 2screw (BV
21、TT3 6) 1two screws (case 3 TP2) 3four screws (BVTP3 8) 1wire (flat type) (21 core) (CN301) 2connector (CN701) 4CD mechanism deck (CDM63B-30BD60) CDP-S3 8 3-4.MAIN BOARD 3-5.FRONT PANEL SECTION 2connector (CN401) 1wire (flat type) (21 core) (CN301) 2two connectors (CN101, 102) 5MAIN board 3screw (BVT
22、P3 8) 4lug 3screw (BVTP3 8) 2connector (CN701) 3two screws (BVTP3 8) 2three screws (BVTP3 8) 3two claws 1connector (CN401) 4front panel section 3claw CDP-S3 9 3-6.PANEL (L) BOARD, PANEL (R) BOARD 3-7.LID (CD) 5two claws 4four screws (BVTP2.6 8) 6PANEL (R) board 1five screws (BVTP2.6 8) 3PANEL (L) bo
23、ard 2two claws 3lid (CD) 4spring (CD) 1screw (BVTP2.6 8) 2bracket (LID) assy 10 CDP-S3 SECTION 4 TEST MODE Note: Use flowing buttons in the test mode. no mark: Button of CD unit (CDP-S3) *1: Button of amplifier unit (TA-S7AV or TA-S3) *2: Button of tuner unit (ST-S5 or ST-S3) CD Delivery Mode This m
24、ode moves the optical pick-up to the position durable to vibration. Use this mode when returning the set to the customer after repair. Procedure: 1.Press the I/1 *1 button to turn the power on. 2.Turn the FILE SELECT *1 knob to set the CD function. 3.While pressing the EQ ON/OFF *1 button, press the
25、 I/1 *1 button. 4.The message “LOCK” is displayed on the fluorescent indica- tor tube of tuner unit and turn the power off automatically, and the CD delivery mode is set. GC Test Mode Enter the GC Test Mode Procedure 1: 1.Press the I/1 *1 button to turn the power on. 2.While pressing the both PLAY M
26、ODE and buttons, press the (DISC 1) button. 3.LEDs and fluorescent indicator tube are all turned on of all units. Procedure 2: 1.Press the I/1 *1 button to turn the power on. 2.While pressing the both STEREO/MONO *2 and CINEMA STUDIO C *1 buttons, press the CLOCK/TIMER *2 button. 3.LEDs and fluoresc
27、ent indicator tube are all turned on of all units. Version Display Mode Procedure: 1.Enter the GC test mode. 2.Each time the DISC 1 or TUNER MEMORY *2 button is pressed, microcomputer or mechanism deck version is dis- played of each unit. 3.Press the DISC 3 or TUNING + *2 button to detail is dis- pl
28、ayed the version. Key Check Mode Procedure: 1.Enter the GC test mode. 2.Press the DISC 2 or TUNING - *2 button to set the key check mode, and displays “K 0 J 0 V 0” on the fluorescent indicator tube of tuner unit. 3.All buttons are pressed of CD unit, all LEDs are blinking of CD unit. (not change th
29、e display of fluorescent indicator tube) Releasing the GC Test Mode To release from this mode, press three buttons in the same manner as entering this mode or disconnect the power cord. x Z CD Service Mode This mode can run the CD sled motor optionally. Use this mode, for instance, when cleaning the
30、 optical pick-up. Procedure: 1.Press the I/1 *1 button to turn the power on. 2.Turn the FILE SELECT *1 knob to set the CD function. 3.While pressing the both PLAY MODE and buttons, press the button. 4.Set to the CD service mode. 5.With the CD in stop status, press the button to move the optical pick
31、-up to outside track, or press the button to inside track. 6.To release from this mode, perform as follows. 1) Move the optical pick-up to the most inside track. 2) Disconnect the power cord. Notes: Always move the optical pick-up to most inside track when releasing from this mode. Otherwise, a disc
32、 will not be un- loaded. Do not run the sled motor excessively, otherwise the gear can be chipped. CD Cancellation Mode of Repeat Limitation This mode can cancel the CD repeat limitation (5 times). Procedure: 1.Press the I/1 *1 button to turn the power on. 2.Turn the FILE SELECT *1 knob to set the C
33、D function. 3.While pressing the both PLAY MODE and buttons, press the REPEAT button. 4.CD repeat limitation is canceled. 5.To release this mode, disconnect the power cord. x . M m x 11 CDP-S3 SECTION 5 ELECTRICAL ADJUSTMENTS Note : 1.CD Block is basically designed to operate without adjustment. The
34、refore, check each item in order given. 2.Use LUV-P01 (4-999-032-01) unless otherwise indicated. 3.Use an oscilloscope with more than 10M impedance. 4.Clean the object lens by an applicator with neutral detergent when the signal level is low than specified value with the following checks. S-Curve Ch
35、eck Procedure : 1.Connect an oscilloscope to TP (FEO). 2.Connect between TP (FEI) and TP (DVC) (1.65 V) by lead wire. 3.Turn Power switch on. 4.Load a disc (LUV-P01) and actuate the focus search. (In consequence of open and close the disc tray, actuate the focus search) 5.Confirm that the oscillosco
36、pe waveform (S-curve) is symmetrical between A and B. And confirm peak to peak level within 2 0.5 Vp-p. 6.After check, remove the lead wire connected in step 2. Note : Try to measure several times to make sure than the ratio of A : B or B : A is more than 10 : 7. Take sweep time as long as possible
37、and light up the brightness to obtain best waveform. RF Level Check Procedure : 1.Connect an oscilloscope CH1 to TP (RFDC) and CH2 to TP (RFAC). 2.Turn Power switch on. 3.Load a disc (LUV-P01) and playback. 4.Confirm that oscilloscope waveform is clear and check if RF signal level is correct or not.
38、 Note : Clear RF signal waveform means that the shape “ ” can be clearly distinguished at the center of the waveform. BD board Oscilloscope TP(FEO) TP(DVC) symmetry S-curve waveform within 2 0.5Vp-p A B TP(RFDC) TP(RFAC) BD board oscilloscope TP(DVC) E-F Balance (1 Track jump) Check Procedure : 1.Co
39、nnect an oscilloscope to TP (TEO) and TP (DVC). 2.Turn Power switch on. 3.Load a disc (LUV-P01) and playback the number nine track. 4.Press the N button. (Becomes the 1 track jump mode.) 5.Confirm that the level B and A (DC voltage) on the oscilloscope waveform. 6.Adjust RV101 on the BD board so tha
40、t the center of waveform becomes the same voltage of DVC. (i.e. A=0V) Adjustment Location: BD BOARD (Conductor Side) RF signal waveform VOLT/DIV : 200mV TIME/DIV : 500ns level : 0.65 0.15Vp-p (RFDC) 1.1 0.4Vp-p (RFAC) TP(TEO) TP(DVC) BD board oscilloscope level=1.0 0.5Vp-p symmetry A (DC voltage) ce
41、nter of waveform B DVC 1 track jump waveform TP (TEO) TP (RFAC) TP (FEI) TP (RFDC) TP (FEO) IC101 IC103 RV101 TP (DVC) 115 30 1 2021 40 60 80 41 61 16 12 CDP-S3 SECTION 6 DIAGRAMS C B These are omitted. E Q B These are omitted. CE Q Note on Printed Wiring Boards: X : parts extracted from the compone
42、nt side. Y : parts extracted from the conductor side. f: internal component. : Pattern from the side which enables seeing. Indication of transistor. Note on Schematic Diagram: All capacitors are in F unless otherwise noted. pF: F 50 WV or less are not indicated except for electrolytics and tantalums
43、. All resistors are in and 1/4 W or less unless otherwise specified. f: internal component. C : panel designation. A : B+ Line. Voltages are taken with a VOM (Input impedance 10 M). Voltage variations may be noted due to normal produc- tion tolerances. Waveforms are taken with a oscilloscope. Voltag
44、e variations may be noted due to normal produc- tion tolerances. Circled numbers refer to waveforms. Signal path. J: CD PLAY Note: The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. 6-1.NOTE FOR PRINTED WIRING BOARDS AND S
45、CHEMATIC DIAGRAMS (In addition to this, the necessary note is printed in each block) 13 CDP-S3 Circuit Boards Location DISC SENSOR board BD board IN OUT SW board MOTOR board DRIVER board TRAY SENSOR board MAIN board PANEL (L) board PANEL (R) board 14 CDP-S3 6-2.PRINTED WIRING BOARD BD Section See pa
46、ge 13 for Circuit Boards Location. There are a few cases that the part printed on this diagram isnt mounted in this model. Semiconductor Location Ref. No.Location MAIN BOARD CN301 M102 (SLED) TP (RFDC) TP (RFAC) TP (FEI) TP (DVC) TP (TEO) TP (FEO) M101 (SPINDLE) A D101B-3 IC101C-3 IC102B-2 IC103D-2 Q101C-1 Q102A-3 (Page 18) CDP-S3 1515 TP (RFDC) TP (DVC) T