Sony-TAA1ES-int-sm 电路图 维修手册.pdf

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1、SERVICE MANUAL Sony Corporation Published by Sony Techno Create Corporation SPECIFICATIONS INTEGRATED STEREO AMPLIFIER 9-893-882-01 2013J33-1 2013.10 US Model Canadian Model AEP Model UK Model Ver. 1.0 2013.10 TA-A1ES Amplifier section POWER OUTPUT (US and Canadian models only) POWER OUTPUT AND TOTA

2、L HARMONIC DISTORTION: With 8 ohm loads, both channels driven, from 20 - 20,000 Hz; rated 80 watts per channel minimum RMS power, with no more than 0.09 % total harmonic distortion from 250 milliwatts to rated output. Rated Power Output* (US and Canadian models) 80 W + 80 W 20 Hz to 20 kHz 0.15 % 8

3、ohms *Measured under the following conditions: Power requirements: 120 V AC, 60 Hz Supported impedance of speakers 4 ohms or higher Distortion 0.008 % 1 kHz 10 W 8 ohms Frequency response 10 Hz to 100 kHz 3 dB (8 ohms) Input (UNBALANCED) Sensitivity: 150 mV Impedance: 47 kohms S/N ratio: 96 dB (Inpu

4、t short, A, 20 kHz LPF) Input (BALANCED) Impedance: 20 kohms / 20 kohms S/N ratio: 96 dB (Input short, A, 20 kHz LPF) Headphones amplifier section Supported impedance LOW: from 8 ohms to less than 50 ohms MID: from 50 ohms to less than 300 ohms (+10 dB against LOW) HI: 300 ohms or higher (+16 dB aga

5、inst LOW) Distortion 0.1 % or less 20 Hz to 20 kHz LOW (8 ohms load impedance) 500 mW + 500 mW MID (150 ohms load impedance) 500 mW + 500 mW HI (300 ohms load impedance) 250 mW + 250 mW Frequency response 10 Hz to 100 kHz +0.5/3 dB (at LOW mode 8 ohms load impedance) General Power requirements 120 V

6、 AC, 60 Hz (US and Canadian models) 230 V AC, 50 Hz/60 Hz (AEP and UK models) Power consumption 300 W Power consumption (during standby mode) 0.4 W Dimensions (Approx.) 430 mm 130 mm 420 mm (17 in 5 1/8 in 16 5/8 in) (w/h/d), including projecting parts and controls Mass (Approx.) 18.0 kg (39 lb 11 o

7、z) Supplied accessories AC power cord (mains lead) (1) Remote control RM-AAU181 (1) R03 (size AAA) batteries (2) Operating Instructions (1) Design and specifications are subject to change without notice. Rated Power Output* (AEP and UK models) 80 W + 80 W 20 Hz to 20 kHz 0.09 % 8 ohms *Measured unde

8、r the following conditions: Power requirements: 230 V AC, 50 Hz/60 Hz RadioFans.CN 收音机爱 好者资料库 TA-A1ES 2 SAFETY CHECK-OUT After correcting the original service problem, perform the follow- ing safety check before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized”

9、 knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE TEST The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.

10、). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for thi

11、s job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery

12、 operated digital multimeters that have a 2 V AC range are suitable. (See Fig. A) 1.5 k0.15 F AC voltmeter (0.75 V) To Exposed Metal Parts on Set Earth Ground Fig. A. Using an AC voltmeter to check AC leakage. NOTES ON CHIP COMPONENT REPLACEMENT Never reuse a disconnected chip component. Notice that

13、 the minus side of a tantalum capacitor may be dam- aged by heat. SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS A

14、PPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT LA SCURIT! LES COMPOSANTS IDENTIFIS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHMATIQUES ET LA LISTE DES PICES SONT CRITIQUES POUR LA SCURIT DE FONC- TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES

15、 PICES SONY DONT LES NUMROS SONT DON- NS DANS CE MANUEL OU DANS LES SUPPLMENTS PUBLIS PAR SONY. RadioFans.CN 收音机爱 好者资料库 TA-A1ES 3 1. SERVICING NOTES . 4 2. DISASSEMBLY 2-1. Disassembly Flow . 6 2-2. Case Top, Fuse (F160, F161, F162, F163, F164, F165) . 7 2-3. Case L Block, Case R Block . 7 2-4. Fron

16、t Panel Block . 8 2-5. HP-POW Board Block . 9 2-6. HP-AMP Board Block . 10 2-7. Power Transformer (T2) . 11 2-8. Lug Wires . 12 2-9. 4-8 Board Block, Fuse (F101) . 13 2-10. AC Board Block, Fuse (F1) . 14 2-11. P-REG Board-1 . 15 2-12. P-REG Board-2 . 16 2-13. Bracket Bridge_INPUT . 17 2-14. REAR-SW

17、Board . 18 2-15. Heat Sink L Assy. 19 2-16. A-CLASS-L Board . 20 2-17. POWER-SUPPLY Board . 20 2-18. Heat Sink R Assy . 21 2-19. A-CLASS-R Board . 22 2-20. POWER-SUPPLY-R Board . 22 2-21. INPUT Board . 23 2-22. AC Inlet 2P (AC1) . 24 3. ELECTRICAL ADJUSTMENTS . 25 4. DIAGRAMS 4-1. Block Diagram - IN

18、PUT Section - . 26 4-2. Block Diagram - ELECTRICAL VOLUME Section - . 27 4-3. Block Diagram - SPEAKER AMP Section - . 28 4-4. Block Diagram - HEADPHONE AMP/PANEL Section - . 29 4-5. Block Diagram - POWER SUPPLY Section - . 30 4-6. Printed Wiring Board - INPUT Board - . 32 4-7. Schematic Diagram - IN

19、PUT Board (1/3) - . 33 4-8. Schematic Diagram - INPUT Board (2/3) - . 34 4-9. Schematic Diagram - INPUT Board (3/3) - . 35 4-10. Schematic Diagram - A-CLASS-L Board - . 36 4-11. Schematic Diagram - A-CLASS-R Board - . 37 4-12. Printed Wiring Boards - A-CLASS Section - . 38 4-13. Printed Wiring Board

20、s - BOOT-STRAP Section - . 39 4-14. Schematic Diagram - BOOT-STRAP-L/TO220 Boards - . 40 TABLE OF CONTENTS 4-15. Schematic Diagram - BOOT-STRAP-R/TO220 Boards - . 41 4-16. Printed Wiring Boards - HP Section - . 42 4-17. Schematic Diagram - HP Section - . 43 4-18. Printed Wiring Boards - CONNECTION S

21、ection - . 44 4-19. Schematic Diagram - CONNECTION Section - . 44 4-20. Printed Wiring Board - DISPLAY Board - . 45 4-21. Schematic Diagram - DISPLAY Board (1/2) - . 46 4-22. Schematic Diagram - DISPLAY Board (2/2) - . 47 4-23. Printed Wiring Boards - SWITCH Section - . 48 4-24. Schematic Diagram -

22、SWITCH Section - . 49 4-25. Schematic Diagram - INPUT_LED Board - . 50 4-26. Schematic Diagram - NUMBER_LED Board - . 51 4-27. Printed Wiring Boards - LED Section - . 52 4-28. Printed Wiring Board - HP-POW Board - . 52 4-29. Schematic Diagram - HP-POW Board - . 53 4-30. Printed Wiring Board - P-REG

23、Board - . 54 4-31. Schematic Diagram - P-REG Board - . 55 4-32. Printed Wiring Boards - POWER SUPPLY Section - . 56 4-33. Schematic Diagram - POWER SUPPLY Section - . 57 5. EXPLODED VIEWS 5-1. Case Top Section . 61 5-2. Case L/R Section . 62 5-3. DISPLAY Board Section . 63 5-4. Front Panel Section .

24、 64 5-5. HP-POW Board, HP-AMP Board Section . 65 5-6. Power Transformer Section . 66 5-7. 4-8 Board Section . 67 5-8. AC Board Section . 68 5-9. P-REG Board Section . 69 5-10. REAR-SW Board Section . 70 5-11. Heat Sink L Section . 71 5-12. POWER-SUPPLY Board Section . 72 5-13. Heat Sink R Section .

25、73 5-14. INPUT Board Section . 74 5-15. Plate Bottom Section . 75 5-16. Bracket Section . 76 5-17. Chassis Section . 77 6. ELECTRICAL PARTS LIST . 78 Accessories are given in the last of the electrical parts list. RadioFans.CN 收音机爱 好者资料库 TA-A1ES 4 SECTION 1 SERVICING NOTES UNLEADED SOLDER Boards req

26、uiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. Unleade

27、d solder melts at a temperature about 40 C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 C. Caution: The printed pattern (co

28、pper foil) may peel away if the heated tip is applied for too long, so be careful! Strong viscosity Unleaded solder is more viscous (sticky, less prone to fl ow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. Usable with ordinary solder It is best to use

29、 only unleaded solder but unleaded solder may also be added to ordinary solder. DESTINATION IDENTIFICATION Distinguish by Part No. on the rear side of a main unit. Rear Panel PART No. DestinationPart No. US and Canadian models4-467-226-1 AEP and UK models4-467-226-2 The indicator is lit in red. Ther

30、e is something wrong with the amplifier. It might be because of a short circuit of the speaker output, a short circuit of the headphones output, or because the ventilation holes on the top of the amplifier are blocked. Resolve the problem, then turn on the amplifier again. NOTE OF OPERATION CHECK Wh

31、en performing the operation, be sure not to remove the wire connected to the Ref No. ET160 (GND) on the P-REG board. P-REG Board (Component Side) ET160 P-REG board TA-A1ES 5 ? ? ? ? Q402 Q403 Q405 Q404 Q407 Q408 Q599 Q602 Q603 Q605 Q604 Q607 Q608 Q599 Q314 Q310 Q313 Q263 Q260 Q264 Q339 Q338 D104 NOT

32、E OF REPLACING THE DIODE AND TRANSISTORS When the transistor of following table is replaced, it is necessary to spread the compound between these parts and the heat sink, bracket. Spread the compound referring to the fi gure below. Connection BoardRef No. 4-8D104 BOOT-SRAP-LQ402, Q403, Q404, Q405, Q

33、407, Q408 BOOT-SRAP-RQ602, Q603, Q604, Q605, Q607, Q608 HP-AMPQ260, Q263, Q264, Q310, Q313, Q314 HP-POWQ338, Q339 TO220Q599 TA-A1ES 6 SECTION 2 DISASSEMBLY This set can be disassembled in the order shown below. 2-1. DISASSEMBLY FLOW SET 2-2. CASE TOP, FUSE (F160, F161, F162, F163, F164, F165) (Page

34、7) 2-3. CASE L BLOCK, CASE R BLOCK (Page 7) 2-4. FRONT PANEL BLOCK (Page 8) 2-15. HEAT SINK L ASSY (Page 19) 2-17. POWER-SUPPLY BOARD (Page 20) 2-18. HEAT SINK R ASSY (Page 21) 2-5. HP-POW BOARD BLOCK (Page 9) 2-6. HP-AMP BOARD BLOCK (Page 10) 2-7. POWER TRANSFORMER (T2) (Page 11) 2-8. LUG WIRES (Pa

35、ge 12) 2-9. 4-8 BOARD BLOCK, FUSE (F101) (Page 13) 2-10. AC BOARD BLOCK, FUSE (F1) (Page 14) 2-11. P-REG BOARD-1 (Page 15) 2-12. P-REG BOARD-2 (Page 16) 2-13. BRACKET BRIDGE_INPUT (Page 17) 2-14. REAR-SW BOARD (Page 18) 2-22. AC INLET 2P (AC1) (Page 24) 2-16. A-CLASS-L BOARD (Page 20) 2-20. POWER-SU

36、PPLY-R BOARD (Page 22) 2-21. INPUT BOARD (Page 23) 2-19. A-CLASS-R BOARD (Page 22) TA-A1ES 7 Note: Follow the disassembly procedure in the numerical order given. 2-2. CASE TOP, FUSE (F160, F161, F162, F163, F164, F165) 1 two flat head screws (TP) 2 case top 1 three flat head screws (TP) 3 fuse (F160

37、) 4 fuse (F165) 5 fuse (F161) 6 fuse (F164) 7 fuse (F163) 8 fuse (F162) 2-3. CASE L BLOCK, CASE R BLOCK 1 two screws (BVTP3 ? 8) 4 three screws (BVTP3 ? 8) 1 two screws (BVTP3 ? 8) 3 two screws (BVTT4 ? 8) 3 two screws (BVTT4 ? 8) 2 plate case back 2 plate case back 4 three screws (BVTP3 ? 8) 5 case

38、 R block 5 case L block TA-A1ES 8 2-4. FRONT PANEL BLOCK 1 seven screws (BVTP3 ? 8) 1 two screws (BVTP3 ? 8) 4 screw (BVTP3 ? 8) 5 lug wire Flat face is chassis side. 2 two brackets (panel) Bottom view 3 Remove the front panel block in the direction of an arrow. qf front panel block front panel bloc

39、k 6 conector (CN2016) 7 conector (CN2019) 8 conector (CN2003) 9 conector (CN2002) 0 conector (CN2450) qa conector (CN2017) qs conector (CN2011) qd conector (CN840) ? ?i?e ?etti? ? ?i?e ?etti? Note: When installing the front panel block, press down all wires in the direction of an arrow. TA-A1ES 9 2-5. HP-POW BOARD BLOCK 1 Remove wires from two wiring stopper. 5 Remove wires from two wiring stopper. 1 Remove wires from the clamp (L35). wiring stopperwiring stopper wiring stopper wiring stopper wiring stopper 6 Remove the wire from the lead pin. lead pin HP-POW boardHP-AMP board 2 conecto

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