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1、lGeneral Power Source: E/ EG areas:AC 230V, 50Hz EB area:AC 230V-240V, 50Hz Power consumption:90 W Dimensions (WHD):43060342 mm Mass:3kg lAmplifier section RMS Output Power: Dolby Digital Mode lTotal RMS Dolby Digital mode Power:330 W At 1kHz and total harmonic of 10% lFront:55 W/ Channel (5) lCente
2、r:55 W/ Channel (5) lSurround:55 W/ Channel (5) At 100Hz and total harmonic of 10% lActive subwoofers:55 W/ Channel (5) DIN Output Power: Dolby Digital Mode: lTotal DIN Dolby Digital mode Power: 150 W At 1kHz and total harmonic of 1% lFront:25 W/ Channel (5) lCenter:25 W/ Channel (5) lSurround:25 W/
3、 Channel (5) 2006 Panasonic AVC Networks Singapore Pte. Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law. SA-HT340E SA-HT340EB SA-HT340EG Colour (S).Silver Type At 100Hz and total harmonic of 1% lSubwoofer:25 W/ Channel (5) lFM tuner section (FM) Preset Memory:FM
4、 15 stations AM/MW 15 stations Frequency Range:87.5-108.00MHz (50kHz step) Sensitivity:1.8V (IHF) S/N 26dB1.4V Antenna Terminals:75 (unbalanced) lAM tuner section (AM/MW) Frequency Range:522-1629kHz (9kHz step) AM Sensitivity S/N 20dB at 999kHz: 560V/m lDisc section Discs played (8 cm or 12 cm): (1)
5、 DVD DVD-Video, DivX(*6,7) (2) DVD-RAM DVD-VR, MP3(*2,7), JPEG(*4,7), MPEG4(*5,7), DivX(*6,7) (3) DVD-R DVD-Video, DVD-VR, MP3(*2,7), JPEG(*4,7), MPEG4(*5,7), DivX(*6,7) (4) DVD-R DL DVD-Video, DVD-VR (5) DVD-RW DVD-Video, DVD-VR, MP3(*2,7), JPEG(*4,7), MPEG4(*5,7), DivX(*6,7) (6) +R/RW Video DVD Ho
6、me Theater Sound System Specifications ORDER NO.MD0605168C2 RadioFans.CN 收音机爱 好者资料库 (7) +R DL Video (8) CD, CD-R/RW CD-DA, Video CD, SVCD(*1), MP3(*2,7), WMA(*3,7), JPEG(*4,7), MPEG4(*5,7), DivX (*6,7), HighMAT Level 2 (Audio and Image) *1Conforming to IEC62107 *2MPEG-1 Layer 3, MPEG-2 Layer 3 *3Win
7、dows Media Audio Ver.9.0 L3 lNot compatible with Multiple Bit Rate (MBR) *4Exif Ver 2.1 JPEG Baseline files lPicture resolution: between 160 x 120 and 6144 x 4096 pixels (Sub sampling is 4:0:0, 4:2:0, 4:2:2, 4:4:4). Extremely long and narrow pictures may not be displayed. *5MPEG4 data recorded with
8、Panasonic SD multi cameras or DVD video recorders. lConforming to SD VIDEO specifications (ASF standard)/ MPEG4 (Simple Profile) video system/G.726 audio system. *6Plays all versions of DivX video (including DivX6) with standard playback of DivX media files. Certified to the DivX Home Theater Profil
9、e. lGMC (Global Motion Compensation) is not supported. *7The total combined maximum number of recognizable audio, picture and video contents and groups: 4000 audio, picture and video contents and 400 groups. Pick up: Wavelength: lCD:785nm lDVD:662nm Laser power: lCD:CLASS 1M lDVD:CLASS 1 Audio outpu
10、t (DISC): Number of channels:5.1 ch (FL, FR, C, SL, SR, SW) Audio performance: Frequency response: DVD (linear audio):4 Hz-22 kHz (48 kHz sampling) 4 Hz-44 kHz (96 kHz sampling) CD-Audio:4 Hz-20 kHz S/N ratio: CD-Audio:105 dB Dynamic range: DVD (linear audio):95 dB CD-Audio:95 dB Total harmonic dist
11、ortion: CD-Audio:0.005 % lVideo section Video system: Signal system:PAL 625/50, PAL 525/60, NTSC Composite video output: Output level:1 Vp-p (75 ) Terminal:Scart jack (1 system) S-video output: Y output level:1 Vp-p (75 ) C output level:PAL; 0.3Vp-p (75) NTSC; 0.286 Vp-p (75 ) TerminalScart jack (1
12、system) RGB video output: R output level:0.7 Vp-p (75 ) G output level:0.7 Vp-p (75 ) B output level:0.7 Vp-p (75 ) Terminal:Scart jack (1 system) Power consumption in standby mode: approx 1W Note: 1.Specifications are subject to change without notice. Mass and dimensions are approximate. 2.Total ha
13、rmonic distortion is measured by the digital spectrum analyzer. Solder: This model uses lead free solder (PbF). Mechanism: This model uses DL2SU (Single tray) mechanism. Power Supply: This model uses Switching Mode Power Supply (SMPS) Module for power-up unit. Refer to original service manual for *1
14、, *2, *3, *4. 2 SA-HT340E / SA-HT340EB / SA-HT340EG RadioFans.CN 收音机爱 好者资料库 3 SA-HT340E / SA-HT340EB / SA-HT340EG RadioFans.CN 收音机爱 好者资料库 1 Safety Precautions 5 1.1. GENERAL GUIDELINES 5 1.2. Before Repair and Adjustment (Using SMPS) 5 1.3. Protection Circuitry 5 1.4. Caution for AC Cord 6 2 Prevent
15、ion of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices 7 3 Precaution of Laser Diode 8 4 About Lead Free Solder (PbF) 9 4.1. Service caution based on legal restrictions 9 5 Handling Precautions for Traverse Unit 10 5.1. Cautions to Be Taken in Handling the Optical Pickup U
16、nit 10 5.2. Grounding for electrostatic breakdown prevention 10 6 Accessories 12 7 Operation Procedures 13 7.1. Remote Control Keys Operation 13 7.2. Main Unit Keys Operation 14 7.3. Connection Setup 15 7.4. Disc information 16 7.5. About DivX VOD Content 18 8 Self-Diagnosis and special mode setting
17、 19 8.1. Service Mode Summary Table 19 8.2. Service Mode Table 1 19 8.3. DVD Self Diagnostic Function-Error Code 24 8.4. Sales Demonstration Lock Function 26 8.5. Service Precautions 27 9 Assembling and Disassembling 28 9.1. Disassembly Flow Chart 29 9.2. Main Components and P.C.B. Locations 29 9.3.
18、 Disassembly of Top Cabinet 30 9.4. Disassembly of the DVD Lid (When taking out disc manually) 30 9.5. Disassembly of Front Panel Assembly 31 9.6. Disassembly of FL P.C.B. & Volume P.C.B. 31 9.7. Disassembly of DVD Mechanism Unit 32 9.8. Disassembly of DVD Module P.C.B. 32 9.9. Disassembly of Rear p
19、anel 33 9.10. Disassembly of SMPS Module P.C.B. 33 9.11. Disassembly of Main P.C.B. & Tuner Extent P.C.B. 33 9.12. Disassembly of Digital Amp IC 33 10 Service Position 34 10.1. Servicing position of the DVD Module P.C.B. 34 10.2. Servicing position of the Main P.C.B. 34 10.3. Servicing position of t
20、he SMPS Module P.C.B. 34 11 Assembly and disassembly of Mechanism Unit 35 11.1. Disassembly Procedure 35 12 Measurements and Adjustments 41 12.1. Service Tools and Equipment 41 12.2. Important points in adjustment 41 12.3. Storing and handling of test discs 41 12.4. Optical adjustment 42 13 Abbrevia
21、tions 43 14 Voltage and Waveform Chart 45 14.1. DVD Module P.C.B. 45 14.2. Main P.C.B. 46 14.3. FL P.C.B. & Tray Loading P.C.B. 47 14.4. SMPS Module P.C.B. 47 14.5. Waveform Chart 48 15 Illustration of ICs, Transistors and Diodes 49 16 Wiring Connection Diagram 51 17 Block Diagram 53 18 Schematic No
22、tes 59 19 Schematic Diagram 61 19.1. (A) DVD Module (DV3.2) Circuit 61 19.2. (B) Main/FL/Volume/Tray Loading/Tuner Extent Circuit 65 20 Printed Circuit Board 71 20.1. (A) DVD Module P.C.B. 71 20.2. (B) Main/Power P.C.B. 72 20.3. (C) FL, Volume, Tuner Extent, & Tray Loading P.C.B. 73 21 Basic Trouble
23、shooting Guide 75 21.1. Basic Troubleshooting Guide for Traverse Unit (DVD Module P.C.B.) 75 21.2. Troubleshooting Guide for Power section (Power circuit) 75 22 Overall Block (HT340) 76 22.1. HT340 DVD Unit Block 77 22.2. HT340 Block (Analog Signal : DVD 5.1ch Play Back Mode) 78 22.3. HT340 Block (A
24、nalog Signal : 2ch Analog Input Mode) 79 22.4. HT340 Power Supply Block 80 22.5. HT340 Power (Main) Block 81 23 Terminal Function of ICs 82 23.1. IC2018 (C2CBYY000194): System Control Microprocessor IC 82 24 Exploded Views 83 24.1. Cabinet Parts Location 83 24.2. Packaging 85 25 Replacement Parts Li
25、st 86 25.1. Component Parts List 87 CONTENTS Page Page 4 SA-HT340E / SA-HT340EB / SA-HT340EG 1 Safety Precautions 1.1. GENERAL GUIDELINES 1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit. 2.
26、After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed. 3. After servicing, carry out the following leakage current checks to prevent the customer from being exposed to shock hazards. 1.1.1. LEAKAGE CURRENT COLD CHECK
27、1. Unplug the AC cord and connect a jumper between the two prongs on the plug. 2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part h
28、as a return path to the chassis, the reading should be between 1M and 5.2M. When the exposed metal does not have a return path to the chassis, the reading must be. Figure 1 1.1.2. LEAKAGE CURRENT HOT CHECK (See Figure 1.) 1. Plug the AC cord directly into the AC outlet. Do not use an isolation trans
29、former for this check. 2. Connect a 1.5k, 10 watts resistor, in parallel with a 0.15F capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1. 3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potentia
30、l across the resistor. 4. Check each exposed metallic part, and measure the voltage at each point. 5. Reverse the AC plug in the AC outlet and repeat each of the above measurements. 6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equival
31、ent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer. 1.2. Before Repair and
32、Adjustment (Using SMPS) This model uses Switching Mode Power Supply (SMPS) Module to provide the neccessary voltages for the unit. DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices. After repairs are completed, restore power gradually usi
33、ng a variac, to avoid overcurrent. Current consumption at AC 230 V, 50 Hz in NO SIGNAL mode volume minimal should be 650 mA. (For E/EG) Current consumption at AC 230V240V, 50 Hz in NO SIGNAL mode volume minimal should be 650 mA. (For EB) 1.3. Protection Circuitry The protection circuitry may have op
34、erated if either of the following conditions are noticed: No sound is heard when the power is turned on. Sound stops during a performance. The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are “shorted”, or if speaker sy
35、stems with an impedance less than the indicated rated impedance of the amplifier are used. 5 SA-HT340E / SA-HT340EB / SA-HT340EG If this occurs, follow the procedure outlines below: 1. Turn off the power. 2. Determine the cause of the problem and correct it. 3. Turn on the power once again after one
36、 minute. Note: When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again. 1.4. Caution for AC Cord 6 SA-HT340E / SA-HT340EB / SA-HT340EG 2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices Some sem
37、iconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techni
38、ques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD). 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wea
39、r a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent
40、electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static (ESD protected) can generate electrical charge sufficient
41、to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged w
42、ith leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will
43、be installed. Caution Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your fo
44、ot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device). 7 SA-HT340E / SA-HT340EB / SA-HT340EG 3 Precaution of Laser Diode 8 SA-HT340E / SA-HT340EB / SA-HT340EG 4 About Lead Free Solder (PbF) 4.1. Service caution based on legal restrictions 4.1.1. General de
45、scription about Lead Free Solder (PbF) The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this equipment in considering the globally environmental conservation. The normal solder is the alloy of tin (Sn) and lead (Pb). On th
46、e other hand, the lead free solder is the alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86F) more than that of the normal solder. Definition of PCB Lead Free Solder being used The letter of “PbF” is printe
47、d either foil side or components side on the PCB using the lead free solder. (See right figure) Service caution for repair work using Lead Free Solder (PbF) The lead free solder has to be used when repairing the equipment for which the lead free solder is used. (Definition: The letter of “PbF” is pr
48、inted on the PCB using the lead free solder.) To put lead free solder, it should be well molten and mixed with the original lead free solder. Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC. Since the melting point of the lead free solder is higher than that of t
49、he normal lead solder, it takes the longer time to melt the lead free solder. Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 35030 degrees C (66286F). Recommended Lead Free Solder (Service Parts Route.) The following 3 types of lead free solder are available through the service parts route. RFKZ03D01K-(0.3mm 100g Reel) RFKZ06D01K-(0.6mm 100g Re