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1、I I AMPLIFIER SECTION RMS output power stereo mode THD 10%, both channels driven 1 kHz125 W per channel (3 ) Total RMS stereo mode power250 W I I FM/AM TUNER, TERMINALS SECTION Preset stationFM 25 stations AM 15 stations Frequency Modulation (FM) Frequency range 87.50 to 108.00 MHz (50 kHz steps) An
2、tenna terminal(s)75 (unbalanced) Amplitude Modulation (AM) Frequency range522 to 1629 kHz (9 kHz step) Music Port (front) jack Sensitivity100 mV, 4.0 k TerminalStereo, 3.5 mm jack Headphone jack TerminalStereo, 3.5 mm jack Output impedance32 (Max) I I CASSETTE DECK SECTION Type1 way Track system4 tr
3、ack, 2 channel Heads 2008 Matsushita Electric Industrial Co. Ltd. All rightsreserved.Unauthorizedcopyingand distribution is a violation of law. SA-AK270EB SA-AK270EG Colour (K). Black Type Record/playbackSolid permalloy head ErasureDouble gap ferrite head MotorDC servo motor Recording systemAC bias
4、100 kHz Erase systemAC erase 100 kHz Tape speed4.8 cm/s Overall frequency response (+3, -6 dB) at DECK OUT NORMAL35 Hz to 14 kHz S/N ratio50 dB (A weighted) Wow and flutter0.18 % (WRMS) Fast forward and rewind time Approx. 120 seconds with C-60 cassette tape I I DISC SECTION Disc played 8 cm or 12 c
5、m (1) CD-Audio (CD-DA) (2) CD-R/RW (CD-DA, MP3* formatted disc) (3) MP3* * MPEG-1 Layer 3, MPEG-2 Layer 3 Pick up Wavelength780 nm Beam SourceSemiconductor laser Audio output (Disc) Number of channels2 (FL, FR) CD Stereo System Notes: This models CD mechanism changer unit is CRS1. Please refer to th
6、e original Service Manual (Order No. MD0509368C0) for this mechanism. Specifications ORDER NO. MD0803003CERadioFans.CN 收音机爱 好者资料库 I I USB SECTION USB Port USB StandardUSB 2.0 full speed Media file format support MP3 (*.mp3) USB device file system FAT 12 FAT 16 FAT 32 USB port power500 mA (Max) I I G
7、ENERAL Power supply AC 230 to 240 V, 50Hz Power consumption65 W Dimensions (W x H x D)250 x 331 x 342 mm Mass4.7 kg 1 Safety Precautions 3 2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices 6 3 Handling Precautions For Traverse Unit 7 4 Precaution of Laser Dio
8、de 9 5 About Lead Free Solder (PbF) 10 6 Operation Procedures 11 7 New Features 14 8 Self diagnosis and special mode setting 16 9 Assembling and Disassembling 25 10 Service Fixture and Tools 54 11 Service Positions 54 Operating temperature range0 to 40C Operating humidity range35% to 80% RH (no cond
9、ensation) Powerconsumptioninstandby mode 0.4 W I I SYSTEM SC-AK270 (EB)Music center: SA-AK270 (EB) Speaker: SB-AK270 (PL) SC-AK270 (EG)Music center: SA-AK270 (EG) Speaker: SB-AK270 (PL) For information on speaker system, please refer to the original Service Manual (Order No. MD0802018CE) for SB-AK27
10、0PL-K. Notes: 1. Specifications are subject to change without notice. Mass and dimensions are approximate. 2. Total harmonic distortion is measured by the digital spectrum analyzer. 12 Procedure for Checking Operation of Individual Parts of Deck Mechanism Unit 61 13 Measurement And Adjustments 62 14
11、 Voltage Measurement and Waveform Chart 64 15 Wiring Connection Diagram 69 16 Block Diagram 71 17 Notes Of Schematic Diagram 79 18 Schematic Diagram 81 19 Printed Circuit Board 95 20 Illustration of ICs, Transistors and Diodes 103 21 Terminal Function of Integrated Circuits 104 22 Exploded Views 107
12、 23 Replacement Parts List 111 CONTENTS Page Page 2 SA-AK270EB / SA-AK270EG RadioFans.CN 收音机爱 好者资料库 1 Safety Precautions 1.1. General Guidelines 1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circu
13、it. 2. After servicing, ensure that all the protective devices such as insulation barriers and insulation papers shields are properly installed. 3. After servicing, check for leakage current checks to prevent from being exposed to shock hazards. 1.1.1. Leakage Current Cold Check 1. Unplug the AC cor
14、d and connect a jumper between the two prongs on the plug. 2. Using an ohmmeter measure the resistance value, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to
15、the chassis, the reading should be between 1M and 5.2M. When the exposed metal does not have a return path to the chassis, the reading must be. 1.1.2. Leakage Current Hot Check (See Figure 1) 1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check. 2. Conn
16、ect a 1.5k, 10 watts resistor, in parallel with a 0.15F capacitor, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1. 3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor. 4. Check
17、 each exposed metallic part, and measure the voltage at each point. 5. Reverse the AC plug in the AC outlet and repeat each of the above measurements. 6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the ho
18、t checks, leakage current must not exceed 1/2 milliamp. Should the measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer. Fig. 1 3 SA-AK270EB / SA-AK270EG RadioFans.CN 收音机爱 好者资料库
19、1.2. Caution for AC Mains Lead 1.3. Before repair and adjustment Disconnect AC power, discharge AC Capacitors C5700, C5701, C5703, C5704, C5705, C5706 and C5707 through a 10, 5W 4 SA-AK270EB / SA-AK270EG resistor to ground. DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as t
20、his may destroy solid state devices. After repairs are completed, restore power gradually using a variac, to avoid overcurrent. Current consumption at AC 230V - 240V, 50 Hz in NO SIGNAL mode (volume min at CD mode) should be 500mA. 1.4. Protection Circuitry The protection circuitry may have operated
21、 if either of the following conditions are noticed: No sound is heard when the power is turned on. Sound stops during a performance. The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are “shorted”, or if speaker systems
22、with an impedance less than the indicated rated impedance of the amplifier are used. If this occurs, follow the procedure outlines below: 1. Turn off the power. 2. Determine the cause of the problem and correct it. 3. Turn on the power once again after one minute. Note : When the protection circuitr
23、y functions, the unit will not operate unless the power is first turned off and then on again. 1.5. Safety Part Information Safety Parts List: There are special components used in this equipment which are important for safety. These parts are marked byin the Schematic Diagrams & Replacement Parts Li
24、st. It is essential that these critical parts should be replaced with manufacturers specified parts to prevent shock, fire or other hazards. Do not modify the original design without permission of manufacturer. Table 1 Reference No.Part No.Part name & DescriptionRemarks 18RGRX0070C-AREAR PANELM EG 1
25、8RGRX0070C-BREAR PANELM EB 36RKMX0144-KTOP CABINETM 68REXX0684PRIMARY WIRE 1 (BLACK)M 69REXX0685PRIMARY WIRE 2 (RED)M 360RAE0165A-VTRAVERSE ASSEMBLYM PCB1REPX0622JSMPS P.C.B.M (RTL) A2K2CQ2CA00006AC CORDM EG A2K2CT3CA00004AC CORDM EB DZ5701ERZV10V511CSZENERM L5001G0B9R5K00003LINE FILTERM L5002G0B9R5
26、K00004LINE FILTERM L5701ELF15N035ANLINE FILTERM L5703ELF22V020ALINE FILTERM T2900G4D1A0000117TRANSFORMERM T5701ETS42BN1A6ADMAIN SW TRANSFORMERM T5751ETS19AB256AGBACKUP TRANSFORMERM PC5701B3PBA0000402PHOTO COUPLERM PC5702B3PBA0000402PHOTO COUPLERM PC5720B3PBA0000402PHOTO COUPLERM PC5799B3PBA0000402PH
27、OTO COUPLERM F1K5D502BNA005FUSEM FP2901K5G4013A0001FUSE PROTECTORM TH5701D4CAC8R00002THERMISTORM TH5860D4CC11040013THERMISTORM P5701K2AA2B000017AC INLETM C5700F1BAF10200201000pFM C5701F0CAF334A0870.33uFM C5703F0C2H10400010.1uF 500VM C5704F1BAF10200201000pFM C5705F1BAF10200201000pFM C5706F1BAF1020020
28、1000pFM C5707F1BAF10200201000pFM 5 SA-AK270EB / SA-AK270EG 2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called Electrostatically Sensitive (ES) De
29、vices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD). 1. Immediately before handling any s
30、emiconductor component or semiconductor-equiped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit unde
31、r test. 2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as aluminium foil, to prevent electrostatic charge build up or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only a
32、n anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can generate electrical charge to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a rep
33、lacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or comparable conductive material). 7. Immediately before removing the protective
34、 material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. Caution Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize body motions when handli
35、ng unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device). 6 SA-AK270EB / SA-AK270EG 3 Handling Precautions For Trave
36、rse Unit The laser diode in the traverse deck (optical pickup) may break down due to potential difference caused by the static electricity of clothes or our human body. So, be careful of electrostatic breakdown during repair of the traverse deck (optical pickup). Way of handling the traverse deck (o
37、ptical pickup) 1. Do not subject the traverse deck (optical pickup) to static electricity as it is extremely sensitive to electrical shock. 2. To prevent the breakdown of the laser diode, an antistatic shorting pin is inserted into the flexible board (FFC board). 3. Do not to apply excessive stress
38、to the flexible board (FFC board). When removing or connecting the short pin, finish the job in as short time as possible. 4. Do not turn the variable resistor for laser power adjustment. (It is pre-adjusted during production time) Grounding for electrostatic breakdown prevention 1. Human body groun
39、ding Use the anti-static wrist strap to discharge the static electricity from your body. 2. Work table grounding Put a conductive material (sheet) or steel sheet on the area where the traverse deck (optical pickup) is place, and ground the sheet. Caution : The static electricity of your clothes will
40、 not be grounded through the wrist strap. So, take care not to let your clothes touch the traverse deck (optical pickup). Caution when replacing the Traverse Deck The traverse deck has a short point shorted with solder to protect the laser diode against electrostatics breakdown. Be sure to remove th
41、e solder from the short point before making connections. 7 SA-AK270EB / SA-AK270EG 8 SA-AK270EB / SA-AK270EG 4 Precaution of Laser Diode Caution : This product utilizes a laser diode with the unit turned ON, invisible laser radiation is emitted from the pick up lens. Wavelength : 780 nm Maximum outp
42、ut radiation power from pick up : 100 W/VDE Laser radiation from pick up unit is safety level, but be sure the followings: 1. Do not disassemble the optical pick up unit, since radiation from exposed laser diode is dangerous. 2. Do not adjust the variable resistor on the pick up unit. It was already
43、 adjusted. 3. Do not look at the focus lens using optical instruments. 4. Recommend not to look at pick up lens for a long time. ACHTUNG : Dieses Produkt enthlt eine Laserdiode. Im eingeschalteten Zustand wird unsichtbare Laserstrahlung von der Lasereinheit abgestrahlt. Wellenlnge : 780nm Maximale S
44、trahlungsleistung der Lasereinheit :100 W/VDE Die Strahlung an der Lasereinheit ist ungefhrlich, wenn folgende Punkte beachtet werden: 1. Die Lasereinheit nicht zerlegen, da die Strahlung an der freigelegten Laserdiode gefhrlich ist. 2. Den werkseitig justierten Einstellregler der Lasereinhit nicht
45、verstellen. 3. Nicht mit optischen Instrumenten in die Fokussierlinse blicken. 4. Nicht ber lngere Zeit in die Fokussierlinse blicken. ADVARSEL: I dette a apparat anvendes laser. CAUTION! THIS PRODUCT UTILIZES A LASER. USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPEC
46、IFIED HEREIN MAY RESULT IN HAZARDOUS RADIATION EXPOSURE. I Use of caution label 9 SA-AK270EB / SA-AK270EG 5 About Lead Free Solder (PbF) 5.1. Service caution based on legal restrictions 5.1.1. General description about Lead Free Solder (PbF) The lead free solder has been used in the mounting process
47、 of all electrical components on the printed circuit boards used for this equipment in considering the globally environmental conservation. The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin (Sn), silver (Ag) and Copp
48、er (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86F) more than that of the normal solder. Definition of PCB Lead Free Solder being used The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder. (See right figure) S
49、ervice caution for repair work using Lead Free Solder (PbF) The lead free solder has to be used when repairing the equipment for which the lead free solder is used. (Definition: The letter of “PbF” is printed on the PCB using the lead free solder.) To put lead free solder, it should be well molten and mixed with the original lead free solder. Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC. Since the melting point of the lead free solder is higher than that of