Panasonic-BRS14P-cdm-sm 电路图 维修手册.pdf

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1、 Panasonic Corporation 2012. All rights reserved. Unauthorized copying and distribution is a violation of law. PSG1201008CE A6 Mechanism Unit Model No.BRS14P TABLE OF CONTENTS PAGEPAGE 1 Mechanism Overview (BRS14P)- 2 1.1. Mecha Chassis Assembly / Tray - 2 1.2. Traverse Unit - 2 2 Warning- 4 2.1. Pr

2、evention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices- 4 2.2. Precaution of Laser Diode- 5 2.3. Service caution based on Legal restrictions- 6 2.4. Handling Precaution for Traverse Unit - 7 3 Mechanism Operation -10 3.1. Close/Open Operation -10 3.2. Open/Close Opera

3、tion -11 3.3. Initialization-12 3.4. Fail Safe Mode-14 4 Disassembly and Assembly Instructions -15 4.1. Flow Chart-16 4.2. Disassembly of Dust Cover- 17 4.3. Replacement of Tray- 18 4.4. Replacement of Traverse Unit- 20 4.5. Replacement of Mid Base - 31 4.6. Replacement of Slide Cam- 32 4.7. Replace

4、ment of Belt- 34 4.8. Replacement of Pulley Gear - 35 4.9. Replacement of Drive Gear - 36 4.10. Replacement of Loading P.C.B.- 37 4.11. Replacement of Loading Motor Unit- 39 5 Exploded View and Replacement Parts List- 43 5.1. Exploded View and Mechanical replacement Parts List - 43 RadioFans.CN 收音机爱

5、 好者资料库 2 1Mechanism Overview (BRS14P) 1.1.Mecha Chassis Assembly / Tray 1.2.Traverse Unit RadioFans.CN 收音机爱 好者资料库 3 1.2.1.Optical Pickup / Spindle Motor / Stepping Motor RadioFans.CN 收音机爱 好者资料库 4 2Warning 2.1.Prevention of Electro Static Discharge (ESD) to Electrostatically Sensi- tive (ES) Devices

6、Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec- trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The foll

7、owing techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD). 1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obta

8、in and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as alumin- ium foil,

9、 to prevent electrostatic charge build up or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can generate electrical cha

10、rge sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices

11、 are packaged with leads electrically shorted together by conductive foam, aluminium foil or compara- ble conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into whic

12、h the device will be installed. Caution : Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or th

13、e lifting of your foot from a carpeted floor can generate static electricity (ESD) suf- ficient to damage an ES device). 5 2.2.Precaution of Laser Diode Caution: This product utilizes a laser diode with the unit turned on, invisible laser radiation is emitted from the pickup lens. Wavelength: 790 nm

14、 (CD) / 660 nm (DVD) / 405 nm (BD) Maximum output radiation power from pickup: 100 W/VDE Laser radiation from the pickup unit is safety level, but be sure the followings: 1. Do not disassemble the pickup unit, since radiation from exposed laser diode is dangerous. 2. Do not adjust the variable resis

15、tor on the pickup unit. It was already adjusted. 3. Do not look at the focus lens using optical instruments. 4. Recommend not to look at pickup lens for a long time. ACHTUNG : Dieses Produkt enthlt eine Laserdiode. Im eingeschalteten Zustand wird unsichtbare Laserstrahlung von der Lasereinheitadg- e

16、strahit. Wellenlnge : 790 nm (CD) / 660 nm (DVD) / 405 nm (BD) Maximale Strahlungsleistung der Lasereinheit :100 W/VDE Die Strahlung an der Lasereinheit ist ungefhrlich, wenn folgende Punkte beachtet werden: 1. Die Lasereinheit nicht zerlegen, da die Strahlung an der freigelegten Laserdiode gefhrlic

17、h ist. 2. Den werkseitig justierten Einstellregler der Lasereinhit nicht verstellen. 3. Nicht mit optischen Instrumenten in die Fokussierlinse blicken. 4. Nicht ber lngere Zeit in die Fokussierlinse blicken. CAUTION! THIS PRODUCT UTILIZES A LASER. USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PRO

18、CEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT IN HAZARDOUS RADIATION EXPOSURE. 6 2.3.Service caution based on Legal restrictions 2.3.1.General description about Lead Free Solder (PbF) The lead free solder has been used in the mounting process of all electrical components on the printed circui

19、t boards used for this equipment in considering the globally environmental conservation. The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free sol

20、der is higher approx.30 degrees C (86F) more than that of the normal solder. Definition of PCB Lead Free Solder being used Service caution for repair work using Lead Free Solder (PbF) The lead free solder has to be used when repairing the equipment for which the lead free solder is used. (Definition

21、: The letter of “PbF” is printed on the PCB using the lead free solder.) To put lead free solder, it should be well molten and mixed with the original lead free solder. Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC. Since the melting point of the lead free sold

22、er is higher than that of the normal lead solder, it takes the longer time to melt the lead free solder. Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 35030 degrees C (66286F). Recommended Lead Free Solder (Service Parts Route.) The fol

23、lowing 3 types of lead free solder are available through the service parts route. RFKZ03D01K-(0.3mm 100g Reel) RFKZ06D01K-(0.6mm 100g Reel) RFKZ10D01K-(1.0mm 100g Reel) Note * Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3% The letter of “PbF

24、” is printed either foil side or components side on the PCB using the lead free solder. (See right figure) 7 2.4.Handling Precaution for Traverse Unit The laser diode in the optical pickup unit may break down due to static electricity of clothes or human body. Special care must be taken avoid cautio

25、n to electrostatic breakdown when servicing and handling the laser diode in the traverse unit. 8 2.4.1.Cautions to Be Taken in Handling the Optical Pickup Unit 1. Never look at the laser light beam directly or directly the laser light beam at exposed skin, the laser light beam has the poten- tial to

26、 cause serious eye and skin damage. 2. Do not drop or otherwise subject the OPU to physical shocks. 3. Never touch the objective lens, actuator, photo diode, laser diode when handling the OPU. 4. Do not leave unpack OPU in hot, high humid or dusty place. 5. Ensure that the work benches, tools, jigs,

27、 measuring instruments and soldering irons (including ceramics) on the production line and in the inspection department are ground, and the personnel wear wrist straps. 6. Keep the power source of the OPU protected from internal and external sources of electrical noise. 7. Do not handle OPU carcless

28、ly due to actuator and photo diode may deteriorate. 8. When applying the grease to main shaft and sub shaft, ensure no grease contact with the critical area of the OPU. 9. Remove the solder at the short land area (laser diode terminal between LD and GND) promptly. 10. When removing the OPU from the

29、tray, ensure to grasp the OPU at the areas indicated in Diagram A. Never touch the objec- tive lens, actuator, photo diode and laser diodes. Touching them may impair their performance. 9 2.4.2.Grounding for electrostatic breakdown prevention Some devices such as the CD player use the optical pickup

30、(laser diode) and the optical pickup will be damaged by static electricity in the working environment. Proceed servicing works under the working environment where grounding works is completed. 2.4.2.1.Worktable grounding 1. Put a conductive material (sheet) or iron sheet on the area where the optica

31、l pickup is placed, and ground the sheet. 2.4.2.2.Human body grounding 1. Use the anti-static wrist strap to discharge the static electricity form your body (Figure 2). Figure 2 10 3Mechanism Operation 3.1.Close/Open Operation Tray Slide CAM TRV Base Close SW Open SW Loading Motor Unit state Close S

32、W ONstopper Open SW ONstopper T.S.P.Tray 51.6 55 135 49.9 41.7 R4 R3 7.71 0 0 R8 R4 R3 2.1 38.6 9.2 31.9 129.2 31.1 126.9 R8.45 R3 30.1 132 Reverse brake Short brake H L H L CW CCW TT center TT center Front boss 33.4 T.S.P. Rack engage Tray Rack engage 26.9 11 3.2.Open/Close Operation Tray Slide CAM

33、 TRV Base Close SW Open SW Loading Motor Unit state Close SW ONstopper Open SW ONstopper T.S.P.Tray 51.6 55 135 49.9 41.7 7.71 0 0 2.1 38.6 8.6 31.9 129.2 31.1 126.9 30.1 132 H L H L CW CCW TT center TT center Front boss 33.8 T.S.P. Rack engage Tray Rack engage 2 R3 R8.45 R3 6.8 Short brake 12 3.3.I

34、nitialization During the power-up of main unit the state of switches is sensored by the micro-p IC and the traverse motor is adjusted accordingly. Note : Refer to Table 1 for the initialization process. 3.3.1.When there is no Initialization Condition for Initialization Processing: Table 1 LOAD-SWLD-

35、MOTORINNER-SWTRV-MOTOR LC-HCCW LOCCWHCCW LC-LCW LOCCWLCW Main Consideration Condition 2 Condition 1 Initialization Decision Processing No need initialization Backup Memory cleared? N Y EXIT INNER-SW= L ? LOAD-SW = LC? N Y EXIT Initialization Processing 13 3.3.2.When there is Initialization Initializ

36、ation Processing INNER-SW = L ? N Y TRV-MOTOR CCW TRV-MOTOR CW INNER-SW = H ? N Y TRV-MOTOR CCW INNER-SW = L ? N Y TRV-MOTOR Brake EXIT 14 3.4.Fail Safe Mode * Fail safe is a function for recovery of tray movement if mechanism cannot carry out tray open or close within a specified time. Below are th

37、e fail safe specification at each position. Refer to table 2. Fail Safe specification Close positionmove to Open positionOpen positionmove to Close positionClose position Locked at Motor CCW condition ( in the case motor can turn CW) Motor CCW for 5sec (Time out) Motor CW to Open position Locked at

38、Motor CCW condition ( in the case motor can not turn CW) Motor CCW for 5sec (TO) Motor CW for 5sec (TO) Loop ERROR stop (at 4th TO) Locked at Motor CW condition ( in the case motor can turn CCW) Motor CW for 5sec (Time out) Motor CCW to Close position Locked at Motor CW condition ( in the case motor

39、 can not turn CCW) Motor CW for 5sec (TO) Motor CCW for 5sec (TO) Loop ERROR stop (at 4th TO) Fail Safe state Table 2 15 4Disassembly and Assembly Instructions Caution Note: This section describes the disassembly and/or assembly procedures for all major printed circuit boards & main compo- nents for

40、 the unit. (You may refer to the section of “Main components and P.C.B Locations” as described in the service manual) Before carrying out the disassembly process, please ensure all the safety precautions & procedures are followed. During the disassembly and/or assembly process, please handle with ca

41、re as there may be chassis components with sharp edges. During disassembly and assembly, please ensure proper service tools, equipments or jigs is being used. During replacement of component parts, please refer to the section of “Replacement Parts List” as described in the ser- vice manual. Select i

42、tems from the following indexes when disassembly or replacement are required. Disassembly of Dust Cover Replacement of Tray Replacement of Traverse Unit Replacement of Mid Base Replacement of Slide Cam Replacement of Belt Replacement of Pulley Gear Replacement of Drive Gear Replacement of Loading P.

43、C.B. Replacement of Loading Motor Unit 16 4.1.Flow Chart Below describes the disassembly flow for the mechanism. 17 4.2.Disassembly of Dust Cover Step 1 : Release 2 catches. Caution : During assembling, ensure the Top Dust Cover is fully catched. Step 2 : Release 2 catches. Caution : During assembli

44、ng, ensure the Top Dust Cover is fully catched. 18 Step 3 : Remove Dust Cover Top & Bottom. 4.3.Replacement of Tray Refer to “Disassembly of Dust Cover”. 4.3.1.Disassembly of Tray Step 1 : Use a pin to push the Slide Cam until it come to a stop. The Tray will open automatically. Step 2 : Gently push

45、 out the tray until it is open fully. 19 Step 3 : Press the catches inwards & remove the tray. 4.3.2.Assembly of Tray Step 1 : Insert the Tray into the guide rails as picture shown. Step 2 : Align the guides of the Slide Cam with the groove of the tray. 20 Step 3 : Gently push in the tray until it i

46、s fully closed. Caution : Do not use strong force during pushing of the tray. Repeat Step 1 to Step 2, when the tray cannot be push for- wards or when it is jammed. 4.4.Replacement of Traverse Unit Refer to “Disassembly of Dust Cover”. Refer to “Disassembly of Tray”. 4.4.1.Disassembly of Traverse Un

47、it Step 1 : Slide the Slide Cam until it come to a stop. 21 Step 2 : Lift up the OPU FFC Sheet from the Catches. Step 3 : Push the OPU FFC Sheet from the guides. Step 4 : Release 45P FFC from the Guide. Step 5 : Release 5P FFC. Caution : Avoid using strong force, to prevent damage on the FPC. Step 6 : Release 4P