Jvc-KDAR-8500-Service-Manual 电路图 维修手册.pdf

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1、SERVICE MANUAL COPYRIGHT 2005 Victor Company of Japan, Limited No.MA191 2005/6 CD / SD RECEIVER MA19120056 KD-AR8500,KD-SHX850 Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade) TABLE OF CONTENTS 1PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . .

2、 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3 2SPECIFIC SERVICE INSTRUCTIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6 3DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . .

3、. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7 4ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22 5TROUBLESHOOTING . . . . . . . . . . . . . . .

4、. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-29 Area suffix J - Northern America ARSENAL rogo KD-AR8500 JKD-SHX850 J MENUPICT SOURCE DISP BACK BAND MENUPICT SOURCE DISP BACK BAND RadioFans.CN 收音机爱 好者资料库 1-2 (No.MA191) SPECIFICATION Design and

5、specifications are subject to change without notice. Microsoft and Windows Media are either registered trademarks or trademarks of Microsoft Corporation in the United States and/ or other countries. SD logo is a trademark. AUDIO AMPLIFIER SECTION Power Output35 W RMS 4 Channels at 4 and or = 1% THD+

6、N Signal-to-Noise Ratio85 dBA (reference: 1 W into 4 ) Load Impedance4 (4 to 8 allowance) Equalizer Control RangeFrequencies : Graphic EQ63 Hz, 125 Hz, 250 Hz, 500 Hz, 1 kHz, 2 kHz, 4 kHz, 8 kHz, 12.5 kHz (9 bands) Frequencies : Parametric EQ3 bands (Band 1/2/3)20 Hz, 25 Hz, 31.5 Hz, 40 Hz, 50 Hz, 6

7、3 Hz, 80 Hz, 100 Hz,125 Hz, 160 Hz, 200 Hz, 250 Hz, 315 Hz, 400 Hz, 500 Hz, 630 Hz,800 Hz, 1 kHz, 1.2 kHz, 1.6 kHz, 2 kHz, 2.5 kHz, 3.2 kHz, 4 kHz,5 kHz, 6.3 kHz, 8 kHz, 10 kHz, 12.5 kHz, 16 kHz, 20 kHz (31 frequencies) Level10 dB Frequency Response40 Hz to 20 000 Hz Line-In Level/ImpedanceLINE IN1.

8、5 V/20 k load Line-Out Level/ImpedanceLINE OUT5.0 V/20 k load (full scale) Output Impedance1 k Power Supply UnitDC/DC converter Other TerminalsSUBWOOFER OUT, Changer control, Steering wheel remote input TUNER SECTION Frequency RangeFM87.5 MHz to 107.9 MHz (with channel interval set to 200 kHz) 87.5

9、MHz to 108.0 MHz (with channel interval set to 50 kHz) AM530 kHz to 1 710 kHz (with channel interval set to 10 kHz) 531 kHz to 1 602 kHz (with channel interval set to 9 kHz) FM TunerUsable Sensitivity11.3 dBf (1.0 V/75 ) 50 dB Quieting Sensitivity16.3 dBf (1.8 V/75 ) Alternate Channel Selectivity (4

10、00 kHz) 65 dB Frequency Response40 Hz to 15 000 Hz Stereo Separation35 dB Capture Ratio1.5 dB AM TunerSensitivity20 V Selectivity65 dB CD/SD PLAYER SECTION TypeCompact disc player Signal Detection SystemNon-contact optical pickup (semiconductor laser) Number of Channels2 channels (stereo) Frequency

11、Response5 Hz to 20 000 Hz Dynamic Range98 dB Signal-to-Noise Ratio102 dB Wow and FlutterLess than measurable limit MP3 (MPEG Audio Layer 3)Max. Bit Rate320 kbps WMA (Windows Media Audio) Max. Bit Rate192 kbps Playable SD CardFormatFAT 12/16 StorageUp to 512 MB Playable Audio Format for SD CardMP3/WM

12、A GENERAL Power RequirementOperating VoltageDC 14.4 V (11 V to 16 V allowance) Grounding SystemNegative ground Allowable Operating Temperature0C to +40C (32F to 104F) Dimensions (W H D)Installation Size (approx.)182 mm 52 mm 159 mm (7-3/16 2-1/16 6-5/16) Panel Size (approx.)188 mm 58 mm 13 mm (7-7/1

13、6 2-5/16 9/16) Mass (approx.)1.7 kg (3.8 lbs) (excluding accessories) RadioFans.CN 收音机爱 好者资料库 (No.MA191)1-3 SECTION 1 PRECAUTIONS 1.1Safety Precautions ! Burrs formed during molding may be left over on some parts of the chassis. Therefore, pay attention to such burrs in the case of preforming repair

14、 of this system. ! Please use enough caution not to see the beam directly or touch it in case of an adjustment or operation check. RadioFans.CN 收音机爱 好者资料库 1-4 (No.MA191) 1.2Preventing static electricity Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, e

15、tc. is discharged, can destroy the laser diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs. 1.2.1 Grounding to prevent damage by static electricity Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as CD play

16、ers. Be careful to use proper grounding in the area where repairs are being performed. (1) Ground the workbench Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the traverse unit (optical pickup) on it. (2) Ground yourself Use an

17、 anti-static wrist strap to release any static electricity built up in your body. (3) Handling the optical pickup In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical pickup are shorted. After replacement, return the shorted

18、parts to their original condition. (Refer to the text.) Do not use a tester to check the condition of the laser diode in the optical pickup. The testers internal power source can easily destroy the laser diode. 1.3Handling the traverse unit (optical pickup) (1) Do not subject the traverse unit (opti

19、cal pickup) to strong shocks, as it is a sensitive, complex unit. (2) Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the replacement procedure in the text. Remove the anti-static pin when replacing the traverse un

20、it. Be careful not to take too long a time when attaching it to the connector. (3) Handle the flexible cable carefully as it may break when subjected to strong force. (4) It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it. 1.4Attention when traverse uni

21、t is decomposed *Please refer to Disassembly method in the text for the CD pickup unit. Apply solder to the short land before the flexible wire is disconnected from the connector on the CD pickup unit. (If the flexible wire is disconnected without applying solder, the CD pickup may be destroyed by s

22、tatic electricity.) In the assembly, be sure to remove solder from the short land after connecting the flexible wire. 1M (caption) Anti-static wrist strap Conductive material (conductive sheet) or iron plate CN601 Short sections Flexible wire Mechanism control board (No.MA191)1-5 1.5Important for la

23、ser products 1.CLASS 1 LASER PRODUCT 2.DANGER : Invisible laser radiation when open and inter lock failed or defeated. Avoid direct exposure to beam. 3.CAUTION : There are no serviceable parts inside the Laser Unit. Do not disassemble the Laser Unit. Replace the complete Laser Unit if it malfunction

24、s. 4.CAUTION : The CD,MD and DVD player uses invisible laser radiation and is equipped with safety switches which prevent emission of radiation when the drawer is open and the safety interlocks have failed or are defeated. It is dangerous to defeat the safety switches. 5.CAUTION : If safety switches

25、 malfunction, the laser is able to function. 6.CAUTION : Use of controls, adjustments or performance of procedures other than those specified here in may result in hazardous radiation exposure. REPRODUCTION AND POSITION OF LABELS ! Please use enough caution not to see the beam directly or touch it i

26、n case of an adjustment or operation check. WARNING LABEL CAUTION : Visible and Invisible laser radiation when open and interlock failed or defeated. AVOID DIRECT EXPOSURE TO BEAM. (e) VARNING : Synlig och osynling laserstrlning nr den ppnas och sprren r urkopplad. Betrakta ej strlen. (s) VARO : Ava

27、ttaessa ja suojalukitus ohitettuna tai viallisena olet alttiina nkyvlle ja nkymttmlle lasersteilylle. Vlt steen kohdistumista suoraan itseesi. (f) ADVARSEL : Synlig og usynlig laserstrling nr maskinen er ben eller interlocken fejeler. Undg direkte eksponering til strling. (d) CLASS 1 LASER PRODUCT 1

28、-6 (No.MA191) SECTION 2 SPECIFIC SERVICE INSTRUCTIONS This service manual does not describe DISASSEMBLY. (No.MA191)1-7 SECTION 3 DISASSEMBLY 3.1Main body section 3.1.1Removing the front panel assembly (See Fig.1) (1) Push the detach button in the lower right part of the front panel assembly. (2) Rem

29、ove the front panel assembly. Fig.1 3.1.2Removing the heat sink (See Fig.2) Reference: Remove the front panel assembly as required. (1) From the left side of the main body, remove the two screws A and three screws B attaching the heat sink. (2) Remove the heat sink from the main body. Fig.2 Detach b

30、utton Front panel assembly Heat sink AAB 1-8 (No.MA191) 3.1.3Removing the top chassis assembly (See Figs.3 to 6) Prior to performing the following procedures, remove the heat sink. Reference: Remove the front panel assembly as required. (1) From the bottom side of the main body, remove the two screw

31、s C attaching the top chassis assembly to the bottom chassis assembly. (See Fig.3) (2) From the both and rear sides of the main body, remove the five screws D attaching the top chassis assembly to the bottom chassis assembly. (See Figs.4 to 6) (3) Lift the top chassis assembly in the direction of th

32、e arrow, disconnect the connector CN503 on the mechanism con- trol board from the connector CN721 on the main board. (See Figs.4 to 6) (4) Take out the top chassis assembly from the bottom chassis assembly. Fig.3 Fig.4 Fig.5 Fig.6 Top chassis assembly C C Bottom chassis assembly Bottom chassis assem

33、bly Top chassis assembly D CN503 CN721 Main board Mechanism control board D Bottom chassis assembly Main board CN721 Top chassis assembly Mechanism control board CN503 Top chassis assembly Bottom chassis assemblyRear bracket DD D (No.MA191)1-9 3.1.4Removing the front chassis assembly (See Figs.7 and

34、 8) Prior to performing the following procedure, remove the front panel assembly, heat sink and top chassis assembly. (1) From the both sides of the top chassis assembly, remove the two screws E attaching the front chassis assembly. (2) Remove the front chassis assembly from the top chassis assembly

35、. Fig.7 Fig.8 3.1.5Removing the CD mechanism assembly (See Fig.9) Prior to performing the following procedures, remove the front panel assembly, heat sink and top chassis assembly. Reference: Remove the front chassis assembly as required. (1) From the inside of the top chassis assembly, remove the t

36、hree screws F attaching the CD mechanism assembly. (2) Release the mecha heat sink from the slots a on the mech- anism control board and remove the mecha heat sink from the main body. (3) Take out the CD mechanism assembly from the top chas- sis. Fig.9 Top chassis assembly Front chassis assembly E T

37、op chassis assembly Front chassis assembly E Top chassis Mecha heat sink F FF CD mechanism assembly a Mechanism control board 1-10 (No.MA191) 3.1.6Removing the main board (See Figs.10 and 11) Prior to performing the following procedures, remove the front panel assembly, heat sink and top chassis ass

38、embly. (1) From the rear side of the bottom chassis assembly, remove the two screws G attaching the rear bracket to the bottom chassis assembly. (See Fig.10) (2) From the top side of the bottom chassis assembly, remove the two screws H attaching the main board to the bottom chassis assembly. (See Fi

39、g.11) (3) Release the stopper of the connector CN701 on the main board in an upward direction, disconnect the card wire from the connector CN701. (See Fig.11) (4) Disconnect the wire from the connector of the front door mechanism assembly. (See Fig.11) (5) Disconnect the wire from the connector CN91

40、1 on the main board. (See Fig.11) Reference: After connecting the wires, fix the wires with the wire holders. (6) Take out the main board from the bottom chassis assem- bly. Fig.10 Fig.11 3.1.7Removing the rear bracket (See Fig.12) Prior to performing the following procedures, remove the front panel

41、 assembly, heat sink, top chassis assembly and main board. (1) Remove the two screws J and three screws K attaching the wires to the rear bracket. (2) Remove two screws M attaching the wire bracket to the rear bracket. (3) From the rear side of the main board, remove the wires from the rear bracket

42、in the direction of the arrow. Reference: After attaching the rear bracket to the main board, pass the wires through the wire bracket and insert them into the slots of the rear bracket. Fig.12 Bottom chassis assembly Rear bracket G Connector Wire holdersCN701 Stopper Bottom chassis assembly H H CN91

43、1Main board Card wire Front door mechanism assembly Rear bracket Wire bracket Wire JK M (No.MA191)1-11 3.1.8Removing the front door mechanism assembly (See Fig.13) Prior to performing the following procedures, remove the front panel assembly, heat sink, top chassis assembly and main board. (1) From

44、the top side of the bottom chassis assembly, remove the screw N attaching the FPC guide to the bottom chassis. (2) Remove the five screws P attaching the front door mecha- nism assembly to the bottom chassis. Reference: When attaching the screws N and P, apply a locking agent them. (3) Take out the

45、front door mechanism assembly from the bot- tom chassis. Fig.13 3.1.9Removing the switch board (See Figs.14 to 16) Prior to performing the following procedures, remove the front panel assembly. (1) From the rear side of the front panel assembly, remove the six screws Q attaching the rear cover to th

46、e front panel as- sembly. (See Fig.14) (2) Release the two joints b of the front panel assembly and re- move the rear cover. (See Fig.15.) (3) Take out the switch board from the front panel assembly. (See Fig.16) Note: When removing the rear cover assembly and switch board, be careful not to lose th

47、e spring. Fig.14 Fig.15 Fig.16 Bottom chassis P P N FPC guide Front door mechanism assembly Q Rear cover assembly Q Q Rear cover assembly Joints bJoints b Switch board Front panel assembly Spring 1-12 (No.MA191) 3.2CD mechanism assembly section Remove the CD mechanism assembly from the main body. (S

48、ee 3.1.5 Removing the CD mechanism assembly.) 3.2.1Removing the mechanism control board (See Fig.1) (1) From the bottom side of the CD mechanism assembly, sol- der the short sections on the flexible wire. Caution: Solder the short sections on the flexible wire before dis- connecting the flexible wir

49、e from the connector CN601 on the mechanism control board. If you do not follow this instruction, the CD pickup may be damaged. (2) Disconnect the flexible wire from the connector CN601 on the mechanism control board. (3) Disconnect the flexible wire from the connector CN602 on the mechanism control board. (4) Remove the solders from the soldered sections a on the mechanism control board and remove the wires of the feed motor. (5) Remove the solders from the soldered sections b on the mec