Yamaha-CDX1110-cd-sm 电路图 维修手册.pdf

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1、COMPACT DISC PLAYER CDX-1110/CDX-1110U RS-CDX1110 CONTENTS SERVICE MANUAL =Bm ; e 7;!S!a:8a E ll J l! i J i i ;ot,ii; iiii iiii Mi iHi iiii iiii iiii iiii iiii .:e= ;i; iiii iiii iiii iiii iiii Mi iiii iiii iiii iiU 8 IMPORTANT NOTICE This manual has been provided for the use of authorized Yamaha Re

2、tailers and their service personnel. It has been assumed that basic service procedures inherant to the industry, and more specifically Yamaha Products, are already known and understood by the users, and have therefore not been restated. WARNING: Failure to follow appropriate service and safety proce

3、dures when servicing this product may result in personal injury, destruction of expensive components and failure of the product to perform as specified. For these reasons, we advise all Yamaha product owners that all service required should be performed by an authorized Yamaha Retailer or the appoin

4、ted service representative. IMPORTANT: The presentation or sale of this manual to any individual or firm does not constitute authorization, certification or recognition of any applicable technical capabilities, or establish a principle-agent relationship of any form. The data provided is believed to

5、 be accurate and applicable to the unit(s) indicated on the cover. The research, engineering, and service departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevitable and specifications are subject to change without notice or obligation to retro

6、fit. Should any discrepancy appear to exist, please contact the distributors Service Division. WARNING: Static discharges can destroy expensive components. Discharge any static electricity your body may have accumulated by grounding yourself to the ground buss in the unit heavy gauge black wires con

7、nect to this buss). IMPORTANT: Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power to the unit . TO SERVICE PERSONNEL . 1/2 INTERLOCK OPERATION 3 SPECIFICATIONS 3 ADJUSTMENTS . 10 26 LSI DATA 27 33 IC BLOCK 34 37 REAR PANELS 4 BLOCK DIAGRAM 5 PROTECTIO

8、N LEVER FOR TRANSPORTATION 6 INTERNAL VIEW . 6 DISASSEMBLY PROCEDURES . 7 CHIP COMPONENT DESCRIPTION . 8/9 FL DISPLAY DATA 38 WIRING . . . 39 PRINTED CIRCUIT BOARD 40-45 SCHEMATIC DIAGRAM . 46 50 PARTS LIST 51 68 YAMAHA YAMAHA CORPORATION P.O. Box 1, Hamamatsu. Japan 3.2k-325 n Printed in Japan. S8.

9、1 RadioFans.CN 收音机爱 好者资料库 CDX-1110/CDX-1110U TO SERVICE PERSONNEL 1. Critical Components Information. Components having special characteristics are marked and must be replaced with parts having specifications equal to those originally installed. 2. Leakage Current Measurement (For 120V Model Only).

10、When service has been completed, it is imperative that you verify that all exposed conductive surfaces are properly insulated from supply circuits. Meter impedance should be equivalent to 1500 ohm shunted by 0.151lF Leakage current must not exceed 0.5mA. Be sure to test for leakage with the AC plug

11、in both polarities. POLARIZATION (U, C models only) This CD player product is equipped with a polarized alter- nating-current line plug (a plug having one blade wider than the other). This plug will fit into the power outlet only one way. This is a safety feature. EQUIPMENT AC LEAKAGE TESTER lJ u-0

12、UIVAlENT OUTLET INSULATING TABLE -=- CAUTION -USE OF CONTROLS, ADJUSTMENTS, OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN, MAY RESULT IN HAZARDOUS RADIATION EXPOSURE. THE COMPACT DISC PLAYER SHOULD NOT BE ADJUSTED OR REPAIRED BY ANYONE EXCEPT PROPERLY QUALIFIED SERVICE PERSONNEL. TH

13、IS PRODUCT COMPLIES WITH OHHS RULES 21 CFR SUBCHAPTER J APPLICABLE AT DATE OF MANUFACTURE. MANUFACTURED BY YAMAHA CORPORATION. 1 01 NAKAZAWACHO. HAMAMATSUSHI. SHIZUOKAKEN.IAPAN MANUFACTURED: LASER BEAM RADIATION SPOT laser Diode Properties Material: Ga-AI-As Wavelength: 755-805 nm (25C) laser Output

14、: Continuous Wave max. 5 mW U.S.A. model OANGER-Invtstble laser radiation when open and mterlock fatled or defeated. AVOID DIRECT EXPOSURE TO BEAM. ICAOB537-11 CAUTION -HAZARDOUS LASER ANO ELECTROMAGNETIC RADIATION WHEN OPEN ANO INTERLOCK DEFEATED ATTENTION RAYONNEMENT LASER E1 ELECTROMAGNETIOUE OAN

15、GEREUX Sl OUVERT AVEC L ENCLENCHEMENT OE SECURITE ANNULE CB.1418 BOTTbM SIDE 0 D e Laser Beam Radiation RadioFans.CN 收音机爱 好者资料库 G, B models English CDX-1110/CDX-1110U ADVARSEL : USYNLIG LASER- STRALING VEO ABNING NAR SIKKERHEDSAFBRYOERE ER UOE AF FUNKTION . UNDGA UOS ETTELSE FOR STRALING. CD CLASS 1

16、 LASER PAOOUCT (DTHIS LABEL IS ATTACHED AT THE PLACE ILLUSTRATED TO INFORM THAT THE APPARATUS CONTAINS A LASER COMPONENT. THIS LABEL IS ATTACHED IN THE POSITION SHOWN IN THE ILLUSTRATION TO WARN THAT ANY FURTHER PROCEDURE WILL BRING THE USER INTO EXPOSURE WITH THE LASER BEAM. THE WARNING LABEL INFOR

17、MING OF RADIATION IS PLACED INSIDE THE UNIT AS SHOWN IN THE ILLUSTRATION, TO WARN AGAINST FURTHER MEASURES ON THE UNIT. THE EQUIPMENT CONTAINS A LASER COMPONENT RADIATING LASER RAYS EXCEEDING THE LIMIT OF LASER PRODUCTS OF CLASS 1. CAUTION-USE OF CONTROLS, ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OT

18、HER THAN THOSE SPECIFIED HEREIN, MAY RESULT IN HAZARDOUS RADIATION EXPOSURE. Swedish (DPASKRIFTEN SITTER PA APPARATEM SOM VISAS SOM EN UPPMANING OM ATT APPARATEN OMFATTAR EN INBYGGD LASERKOMPONENT. TEXTSKYL TEN FOR LASERN AR PLACERAD PA APPARATEN SOM EN UPPMANING OM ATT APPARATEN I NNE HALLER ENLASE

19、RKOMPONEN VARNINGSSKYLTEN FOR STRALNING HAR PLACERATS I APPARATEN, SOM BILDEN VISAR, SOM EN VARNING OM YTTERLIGARE INGREPP I APPARATEN. MATERIELEN INNEHALLER EN LASERKOMPONENT SOM AVGER LASER- STRALNING OVERSTIGANDE GRANSEN FOR LASERKLASS 1. VARNING- INGREPP I APPARATEN BOR ENDAST FORETAS AV FACKMAN

20、 MED KUNSKAP OM ATT RISK FORELIGGER FOR RADIOAKTIV ATRALNING. Danish (DDETTE MJERKAT ER ANBRAGT SOM VIST I ILLUSTRATIONEN FOR AT ADVARE BRUGEREN OM AT APPARATET INDEHOLDER EN LASERKOMPONENT. DETTE MJERKAT OM LASEREN ER ANBRAGT PA APPARATET SOM EN OPL YSNING OM AT APPARATET INDEHOLDER ET LASERKOMPONE

21、NT. ADVARSELSKIL TET OM STRALING ER PLACE RET INDENI APPARATET, SOM VIST I ILLUSTRATIONEN, SOM EN ADVARSEL OM YDERLIGERE INDGREB I APPARATET. APPARATET INDEHOLDER ET LASERKOMPONENT SOM AVGIVER LASESTRALING DER OVERSTIGER GJENSEVERDIEN FOR LASERKLASSE 1. ADVARSEL! INDGREB B0R KUN FORETAGES AF EN FAGM

22、AND DA DER ER RISIKO FOR RADIOAKTIV STRALING_ Finnish VAROITUS! LAITE SISALTAA LASERDIODIN, JOKA LAHETTAA (NAKYMATONTA) SILMILLE VAARALLISTA LASERSATEILYA: 2 RadioFans.CN 收音机爱 好者资料库 3 CDX-1110/CDX-1110U .INTERLOCK OPERATION The Digital Compact Disc Player reads the disc signals by laser beam detecti

23、on. It must be avoided for the human body to be directly exposed to the laser beam. Human eyes are especially badly affected by the laser beam. This unit is therefore equipped with an interlock to prevent unnecessary laser output. Laser output is controlled by the injection or cutoff of the constant

24、 voltage source to the laser diode at Pin 38 (LSI of IC805 (M50943), and also by Automatic Laser Power Control Circuit. When Pin 38 is in H (High) level, the laser emits the beam. When Pin 38 is in L (Low) level, the laser does not emit the beam. Pin 38 is set in H level when the unit is loaded with

25、 the disc and it reads the index signals or when the unit is set in the play mode after that. When the unit reads the index signals and the OPEN/CLOSE SWITCH TIN TOUT PLAY KEY J SW2 l REMOTE CONTROL TRANSMITTER , RM 23,24 SPECIFICATIONS AUDIO SECTION Frequency Response 2Hz -20kHz 0.3dB Harmonic Dist

26、ortion+ Noise 0.002% (1kHz) S/N Ratio 118dB (EIAJ) Dynamic Range 100dB (EIAJ) Wow a c , TBOI i bC1 - COAXIAL OPTICAL LJ U801 Ll DIRECT 0624 J - Ll ALTER RJ -J . .,.II IC606B IC6QgA CDX1110/CDX1110U .PROTECTION LEVER FOR TRANSPORTATION When transporting the unit, take out the disc and lock the pick-u

27、p head by moving the lever in the opposite direction of the arrow while lifting the rear panel side. *Unless the pick-up head has been locked in place, it may not operate properly even when it is released. It may also fail to operate properly even when the front panel side is lifted with the lever r

28、eleased. In such case, turn OFF the power once and then turn it ON again . INTERNAL VIEW Lock 11+ Release 0 POWER TRANSFORMER 8 DIGITAL CIRCUIT BOARD (2) 8 MAIN CIRCUIT BOARD (2) 8 MAIN CIRCUIT BOARD (1) 0 DISC MECHANISM UNIT 0 8 bit J.LCOM: M50943-400SP 0 SPC CIRCUIT BOARD 6 7 CDX-1110/CDX-1110U DI

29、SASSEMBLY PROCEDURES 1. Removal of Top Cover Remove 5 screws ( CD ) in Fig. 1, and then slide the Top Cover to back side. 2. Removal of Bottom Cover Remove 12 screws ( ) in Fig. 1. Lt;=fii:_:-;:; _ _ _;i;_ -;j-:*:t_;l=cc=.=-=-=-=_:;:1. ,.,D Top Cover Fig. 1 5. Removal of Flapper Push the hook fixing

30、 the flapper in Fig. 5, and remove the flapper. (Remove the spring, too.) *Make sure not to forget the spring when reinstalling it. Fig. 5 3. Removal of Disc Tray Assy a. Lift the flapper and pull out the disc tray assy in Fig. 2. b. Push the hook on the DM unit with a slotted screwdriver or the lik

31、e inserted into the tray hole in Fig. 3, and the disc tray assy can be removed. 4. Removal of Disc Mechanism Unit Remove 4 screws ( ) in Fig. 4, and lift the Disc Mechanism Unit gradually. Flapper- Fig. 2 .CHIP COMPONENTS DESCRIPTION 1. KIND OF CHIP DEVICE We have five kinds of chip devices: a. Thic

32、k film chip resister b. Multi-layer ceramic chip capacitor c. Mini-mould (Chip) transistor d. Mini-mould (Chip) diode e. Mini-mould (Chip) IC 2. IDENTIFICATION OF FOUR KINDS OF CHIP DEVICES Since four kinds of chip devices have similar shape and size, it is quite difficult to identify them at a glan

33、ce, but basically, following identification is available: a. Resistor/Jumper resister All chip resistors have a 3 digit indication of the value of resistance. For example, 472 stands for 4.7k ohms and 000 stands for the jumper resistor. 47 x 102 = 47oon = 4.7kn b. Ceramic capacitor Some chip capacit

34、ors have a 2 digit indication of the valve of capacitance. For example, A2 stands for 100pF. Some chip capacitors have no indication. (Example) Special mark I Ufo-IJ 1.0 X 10 2 = 100pf Alphabet Number Contents of indication Alphabet The numerical value of electrastatic capacity. Number The value of

35、the multiplier. Special mark _Temperature characteristic. Electrostatic capacity (Alphabet (Number Number figures value c. Transistor The transistors can be identified by their identifica- tion codes of 2 to 4 alphabet letters assigned to each of them. Given below is a cross reference table of ident

36、ification codes and transistors. Use it to identify each transistor from its code. Indica- Parts No. Description HFE rank tion FO iA103700 Transistor 2SA 1037 0-rank FA . . . A-rank FS . . . s-rank AO iB070900 . 2SB709 a-rank AA . . . A-rank AS . . . S-rank BO iC241200 . 2SC2412 0-rank BA . . . A-ra

37、nk BS . . . S-rank YO iD060100 . 2SD601 0-rank YA . . . A-rank YS . . . S-rank CDX-1110/CDX-1110U Ex. Transistor: 2SC2412(R) Ex. Digital Transistor DTA144EK Collector Collector Bose Emitter Bose Emitter Collector Emitter d . . Diode and Zener Diode Each diode has a yellow or white band (cathode band

38、) on its cathode side as shown below. CATHODE BAND (YELLOW or WHITE) . The zener diode has three color bands as shown below. I st COLOR SAND /2nd COLOR SAND DlfO- The 1st and 2nd color bands indicate the model as a number is assigned to each color as listed in Table 1. Referring to Table 1, read the

39、 code number by converting the colors of bands into the corresponding numbers and then find the model code in Table 2. The number in the model code indicates the zener voltage. The 3rd color band on the zener diode indicates the subdivision of the zener voltage. 1st color band 2nd color band 3rd col

40、or band COLOR 1st number 2nd number Zener voltage in code in code Subdivision Black 0 0 - Brown 1 1 - Red 2 2 - Orange 3 3 - Yellow 4 4 A Green 5 5 B Blue 6 6 c Purple 7 7 - Gray 8 8 - white 9 9 D Table 1 8 9 CDX-1110/CDX-1110U RLZ Series Zener Code No. and Model Code Cross Reference Table Zener Cod

41、e No. Model Code 07 RLZ3.6 08 RLZ3.9 09 RLZ4.3 10 RLZ4.7 11 RLZ5.1 12 RLZ5.6 13 RLZ6.2 14 RLZ6.8 15 RLZ7.5 16 RLZ8.2 17 RLZ9.1 18 RLZ10 19 RLZ11 20 RLZ12 21 RLZ13 22 RLZ15 23 RLZ16 24 RLZ18 25 RLZ20 26 RLZ22 27 RLZ24 28 RLZ27 29 RLZ30 30 RLZ33 31 RLZ36 32 RLZ39 Table 2 As explained above you can ide

42、ntify chip devices tentatively, but actual identification should be made by referring to the parts layout drawing in the service manual. 3. SPECIAL NOTICE FOR HANDLING CHIP DEVICES Chip devices are not heatproof and shockproof. Use caution when handling them . a. For shock Chip devices are made of c

43、eramic or plastic moulding, please do not subject them to direct shock. Set chip device flat onto printed circuit board. Do not apply unnecessary stress to the chip device. When soldering two terminals of chip device, soldering is done one by one. Sometimes, when one terminal is soldered, the other

44、unsoldered terminal is slightly lift. In such case, do not try to push down the lifted terminal using the tip of the soldering iron. In such a case, you may crack the chip device or may break the terminals. b. For heat Do not apply high temperature to chip devices for long periods. Soldering should

45、be done quickly. c. Soldering Chip devices can not withstand rapid heating or cooling. Do not heat the chip itself, heat the termi- nals of chip devices. Solder quickly, excessive soldering time will cause damage to chip device. Try to reduce amount of solder when soldering. Amount of solder will ef

46、fect the strength of the chip bending against the printed circuit board. Refer to amount of solder as shown below. Solder Chip device Solder Printed circuit board d. Soldering iron When soldering chip devices, use the right soldering iron. Soldering iron Power of soldering iron should be less than 3

47、0 watts. Diameter of iron chip should be about 2 mm. Temperature of iron tip. Temperature of soldering iron tip should be less than 536F. (280C.) e. Mounting chip device onto printed circuit board Set chip devices as close as possible onto the surface of printed circuit board. Do not apply unnecessa

48、ry pressure to chip devices in order to make it close to the surface of printed circuit board. Try to keep distance between chip device and surface of printed circuit board less than 0.5mm. Do not connect (solder) wire or terminal of other- parts to terminal of chip device. Do not mount chip devices incorrectly, such as (b), (c) and (d). (a) Horizontal -Yes (b) Up-side -No (c) Virtical -No (d) Combination -No f. Removal of defective device for r