RCA-RTD152-hts-sm 电路图 维修手册.pdf

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1、SERVICE DVD 5.1 HOME THEATRE SYSTEM SERVICE MANUAL RTD152 RCA RadioFans.CN 收音机爱 好者资料库 CONTENTS 1. PRECAUTIONS-2 1-1 SAFETY PRECAUTIONS-2 1-2 SERVICING PRECAUTIONS-3 1-2-1 General Serving Precautions-3 1-2-2 Insulation Checking Procedure -4 1-3 ESD PRECAUTIONS-4 2. REFERENCE INFORMATION -5 2-1 COMPON

2、ENT DESCRIPTIONS-5 2-1-1 DVD SONY HM-313PUH-5 2-1-2 DVD Processor Chip MTK1389E -7 2-1-3 Serial EEPROM, 2K (256 x 8) (24C02) or 16 K (2048 x 8) (24C16)- 23 2-1-4: FLASH MEMORY( CMOS 16M (2M 8/1M 16) BIT)- 23 2-1-5 1M x 6 Bit x 4 Banks Synchronous DRAM M12L64164A - 27 3. PRODUCT SPECIFICATIONS- 31 4.

3、 UPGRADING SYSTEM AND CHANGING THE REGION CODE- 32 5. OPERATING INSTRUCTION- 33 MAINTENANCE Safety First 1-2-1 General Serving Precautions (1) a. Always unplug the instruments AC power cord from the AC power source before (1) removing or reinstalling any component, circuit board, module or any other

4、 instrument assembly. (2) disconnecting any instrument electrical plug or other electrical connection. (3) connecting a test substitute in parallel with an electrolytic capacitor in the instrument. b. Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this service

5、manual might be equipped. c. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. d. Always connect a test instruments ground lead to the instrument chassis ground before connecting the test instrument posi

6、tive lead. Always remove the test instrument ground lead last. Note: Refer to the Safety Precautions section ground lead last. (2) The service precautions are indicated or printed on the cabinet, chassis or components. When servicing, follow the printed or indicated service precautions and service m

7、aterials. (3) The components used in the unit have a specified flame resistance and dielectric strength. When replacing components, use components which have the same ratings, by () or by () in the circuit diagram are important for safety or for the characteristics of the unit. Always replace them w

8、ith the exact replacement components. (4) An insulation tube or tape is sometimes used and some components are raised above the printed wiring board for safety. The internal wiring is sometimes clamped to prevent contact with heating components. Install such elements as they were. (5) After servicin

9、g, always check that the removed screws, components, and wiring have been installed correctly and that the portion around the serviced part has not been damaged and so on. Further, check the insulation between the blades of the attachment plus and accessible conductive parts. - 3 - 1-2-2 Insulation

10、Checking Procedure Disconnect the attachment plug from the AC outlet and turn the power ON. Connect the insulation resistance meter (500V) to the blades of the attachment plug. The insulation resistance between each blade of the attachment plug and accessible conductive parts (see note) should be mo

11、re than 1 Megohm. Note: Accessible conductive parts include metal panels, input terminals, earphone jacks, etc. 1-3 ESD Precautions Electrostatically Sensitive Devices (ESD) Some semiconductor (solid static electricity) devices can be damaged easily by static electricity. Such compo9nents commonly a

12、re called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques of component damage caused by static electricity. (1) immediately before handling any semiconduct

13、or components or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to t

14、he unit under test. (2) after removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. (3) Use only a grounded-tip soldering iron to solder or unsolder ESD device.

15、 (4) Use only an anti-static solder removal devices. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ESD devices. (5) Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD devices. (6) Do

16、not remove a replacement ESD device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive materials). (7) Immediately before remov

17、ing the protective materials from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. (8) Minimize bodi

18、ly motions when handling unpackaged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ESD device). - 4 - 2. Reference Information 2-1 Compo

19、nent Descriptions 2-1-1 DVDSONY HM 313- Connector Pin Definition - 5 - PUH Block Diagram - 6 - MORPEE yromeM ksa iF MORDSr edaoL cs iD 061L92A M61 e l dn i pS ro t oM sucoF l i oC kca rT l i oC de iS ro t oM gn i daoL ro t oM S8885A ev i rD ro t oM E/F9831TM IPATA )ovr es / edoceD( r eganaM r e f fu

20、B ro t a l udomeD ILP gn i kca rT&sucoF gn i daoL 61C42 M4 61 o i duA r e i f i l pmA F/ I nnoC ) l ennap t nof ( l ang iS CIM no i s r evnoC D/A 2362EC t up t uo oed iV VUY oed iV-S AGV TRACS oed iV FR 2-1-2 DVD Processor Chip MTK1389E/F Features Super Integration DVD player single chip ? High perf

21、ormance analog RF amplifier ? Servo controller and data channel processing ? Disc compatibility: DVD, DVD-R, DVD-RW, DVD+R, DVD+RW, Audio CD, CD-R, CD-RW, VCD, SVCD, MP3-CD, MP3-DVD, PCM, JPEG-CD, JPEG-DVD ? Format compatibility:MPEG-1, MPEG-2, MPEG-4, DivX 3.11, DivX 4.x, DivX5.x (Need licence), Xv

22、id, MP3, WMA, PCM, and JPEG & AVI Dolby Digital, DTS ? Unified memory architecture ? Versatile video scaling & quality enhancement ? OSD & Sub-picture ? 2-D graphic engine ? Global motion compensation (GMC) ? Quarter pixel accurate motion Compensation (Q-PEL) ? B-frame ? Higher bit-rate up to 10 Mbp

23、s ? Full function remote control ? Plays regional code encrypted (RCE) DVDs ? Selectable 4:3 Pan & Scan or 16:9 Widescreen format ? PAL & NTSC playback ? Multi-speed FF/ RW, slow motion & multi level zoom High Performance Analog RF Amplifier ? Programmable fc ? Dual automatic laser power control ? D

24、efect and blank detection ? RF level signal generato - Audio ? Dolby Digital (AC -3)/EX decoding ? DTS/DTS -ES decoding ? MLP decoding for DVD-Audio ? MPEG-1 layer 1/layer 2 audio decoding ? MPEG-2 layer1/layer2 2-channel audio ? High Definition Compatible Digital (HDCD) ? Windows Media Audio (WMA)

25、? Advanced Audio Coding (AAC) ? Dolby ProLogic II ? Concurrent multi-channel and downmix out ? IEC 60958/61937 output -TV Encoder ? Six 108MHz/12bit DACs ? Support NTSC, PAL-BDGHINM, PAL-60 ? Support 525p, 625p progressive TV format ? Automatically turn off unconnected channels ? Support PC monitor

26、(VGA) ? Support Macrovision 7.1 L1, Macrovision 525P ? and 625P - 7 - RF Amplifier DVD PUH Module Servo IO Spindle Control Servo Processor Memory Controller FLASH ROM DRAM GPIO Video Processor 108MHz TV Encoder Video DAC CVBS, Y/C Component Video System Parser MPEG-1/2 JPEG Video Decoder Audio DSP A

27、udio Ouptut Debug Port SDPIF Audio DAC System CPU IR/VFD De- interlacer CPPM/CPRM DRM 32-bit RISC Motor Drive PCM Audio DAC Audio out Functional Block ? -8- * Pinout Diagram - 8 - PIN DESCRIPTON - 10 - - 11 - - 12 - - 13 - - 14 - - 15 - - 16 - - 17 - - 18 - - 19 - - 20 - - 21 - - 22 - 2-1-3 Serial E

28、EPROM, 2K (256 x 8) (24C02) or 16 K (2048 x 8) (24C16) 24C02 is used for DVD player while 24C16 is for DVD receiver. The capacity is the only difference between two kinds of serial EEPROM. Both of them use same package and have same pin configuration. * Features ? Low-Voltage and Standard-Voltage Op

29、eration -5.0 (V CC = 4.5V to 5.5V) -2.7 (V CC = 2.7V to 5.5V) -2.5 (V CC = 2.5V to 5.5V) -1.8 (V CC = 1.8V to 5.5V) ? Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K), 1024 x 8 (8K) or 2048 x 8 (16K) ? 2-Wire Serial Interface ? Schmitt Trigger, Filtered Inputs for Noise Suppression ? Bi

30、-directional Data Transfer Protocol ? 100 kHz (1.8v, 2.5V, 2.7V) and 400 kHz (5V) Compatibility ? Write Protect Pin for Hardware Data Protection ? 8-Byte Page (1K, 2K), 16-Byte Page (4K, 8K, 16K) Write Modes ? Partial Page Writes Are Allowed ? Self-Timed Write Cycle (10 ms max) ? High Reliability -

31、Endurance: 1 Million Write Cycles - Data Retention: 100 Years - - ESD Protection: 3000V ? Automotive Grade and Extended Temperature Devices Available ? 8-Pin and 14-Pin JEDEC SOIC, 8-Pin PDIP, 8-Pin MSOP, and 8-Pin TSSOP Packages * Pin Configurations * Pin Description Pin Name Function A0-A2 Address

32、 Inputs SDA Serial Data SCL Serial Clock input WP Write Protect NC No Connect 2-1-4: FLASH MEMORY( CMOS 16M (2M 8/1M 16) BIT) GENERAL DESCRIPTION The MBM29LV160TE/BE is a 16M-bit, 3.0 V-only Flash memory organized as 2M bytes of 8 bits each or 1M words of 16 bits each. The MBM29LV160TE/BE is offered

33、 in a 48-pin TSOP (I), 48-pin CSOP and 48-ball FBGA packages. The device is designed to be programmed in-system with the standard system 3.0 V VCC supply. 12.0 V VPP and 5.0 V VCC are not required for write or erase operations. The device can also be reprogrammed in standard EPROM programmers. The s

34、tandard MBM29LV160TE/BE offers access times of 70 ns and 90 ns allowing operation of high-speed microprocessors without wait states. To eliminate bus contention the device has separate chip enable (CE), write enable (WE), and output enable (OE) controls. The MBM29LV160TE/BE is pin and command set co

35、mpatible with JEDEC standard E2PROMs. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input - 23 - to an internal state-machine which controls the erase and programming circuitry. Write cycles also internally latch addresses and da

36、ta needed for the programming and erase operations. Reading data out of the device is similar to reading from 5.0 V and 12.0 V Flash or EPROM devices. The MBM29LV160TE/BE is programmed by executing the program command sequence. This will invoke the Embedded ProgramTM* Algorithm which is an internal

37、algorithm that automatically times the program pulse widths and verifies proper cell margins. Typically, each sector can be programmed and verified in about 0.5 seconds. Erase is accomplished by executing the erase command sequence. This will invoke the Embedded EraseTM* Algorithm which is an intern

38、al algorithm that automatically preprograms the array if it is not already programmed before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margins. (Continued) (Continued) Any individual sector is typically erased and veri

39、fied in 1.0 second (if already preprogrammed). The device also features sector erase architecture. The sector mode allows each sector to be erased and reprogrammed without affecting other sectors. The MBM29LV160TE/BE is erased when shipped from the factory. The device features single 3.0 V power sup

40、ply operation for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. A low VCC detector automatically inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ7, by the Togg

41、le Bit feature on DQ6, or the RY/BY output pin. Once the end of a program or erase cycle has been completed, the device internally resets to the read mode. The MBM29LV160TE/BE also has a hardware RESET pin. When this pin is driven low, execution of any Embedded Program Algorithm or Embedded Erase Algorithm is terminated. The internal state machine is then reset to the read mode. The RESET pin may be tied to the system reset cir