tmux6212.pdf

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1、TMUX621x 36 V, Low-RON, 1:1 (SPST), 4-Channel Precision Switches with 1.8 V Logic 1 Features Dual supply range: 4.5 V to 18 V Single supply range: 4.5 V to 36 V Low on-resistance: 2 High current support: 330 mA (maximum) (WQFN) High current support: 220 mA (maximum) (TSSOP) 40C to +125C operating te

2、mperature 1.8 V logic compatible Integrated pull-down resistor on logic pins Fail-safe logic Rail-to-rail operation Bidirectional operation 2 Applications Sample-and-hold circuits Feedback gain switching Signal isolation Field transmitters Programmable logic controllers (PLC) Factory automation and

3、control Ultrasound scanners Patient monitoring and diagnostics Electrocardiogram (ECG) Data acquisition systems (DAQ) Semiconductor test equipment LCD test Instrumentation: lab, analytical, portable Ultrasonic smart meters: water and gas Optical networking Optical test equipment 3 Description The TM

4、UX6211, TMUX6212, and TMUX6213 are complementary metal-oxide semiconductor (CMOS) switches with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The devices work with a single supply (4.5 V to 36 V), dual supplies (4.5 V to 18 V), or asymmetric supplies (such as V

5、DD = 12 V, VSS = 5 V). The TMUX621x supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD. The switches of the TMUX621x are controlled with appropriate logic control inputs on the SELx pins. The TMUX621x are part of the precision switches an

6、d multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications. Device Information(1) PART NUMBERPACKAGEBODY SIZE (NOM) TMUX6211TSSOP (16) (PW)5.00 mm 4.40 mm TMUX6212 WQFN (16) (RUM)4.00 mm 4.00 mm TMUX6213 (1)For a

7、ll available packages, see the package option addendum at the end of the data sheet. SW SW SW SW S1 S2 S3 S4 SEL1 SEL2 SEL3 SEL4 D1 D2 D3 D4 VDDVSS S1 S2 S3 S4 D1 D2 D3 D4 VDDVSS SW SW SW SW S1 S2 S3 S4 D1 D2 D3 D4 VDDVSS SW SW SW SW SEL1 SEL2 SEL3 SEL4 SEL1 SEL2 SEL3 SEL4 TMUX6211 (SELx = Logic 1)

8、TMUX6212 (SELx = Logic 1) TMUX6213 (SELx = Logic 1) TMUX621x Block Diagrams TMUX6211, TMUX6212, TMUX6213 SCDS431C OCTOBER 2020 REVISED AUGUST 2021 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property m

9、atters and other important disclaimers. PRODUCTION DATA. Table of Contents 1 Features.1 2 Applications.1 3 Description.1 4 Revision History.2 5 Device Comparison Table.3 6 Pin Configuration and Functions.3 7 Specifications.4 7.1 Absolute Maximum Ratings .4 7.2 ESD Ratings . 4 7.3 Thermal Information

10、 .5 7.4 Recommended Operating Conditions .5 7.5 Source or Drain Continuous Current .5 7.6 15 V Dual Supply: Electrical Characteristics .6 7.7 15 V Dual Supply: Switching Characteristics .7 7.8 36 V Single Supply: Electrical Characteristics .8 7.9 36 V Single Supply: Switching Characteristics . 9 7.1

11、0 12 V Single Supply: Electrical Characteristics .10 7.11 12 V Single Supply: Switching Characteristics .11 7.12 5 V Dual Supply: Electrical Characteristics .12 7.13 5 V Dual Supply: Switching Characteristics .13 7.14 Typical Characteristics.14 8 Parameter Measurement Information.19 8.1 On-Resistanc

12、e.19 8.2 Off-Leakage Current. 19 8.3 On-Leakage Current.20 8.4 tON and tOFF Time.20 8.5 tON (VDD) Time.21 8.6 Propagation Delay. 21 8.7 Charge Injection.22 8.8 Off Isolation.22 8.9 Channel-to-Channel Crosstalk.23 8.10 Bandwidth.23 8.11 THD + Noise.24 8.12 Power Supply Rejection Ratio (PSRR).24 9 Det

13、ailed Description.25 9.1 Overview.25 9.2 Functional Block Diagram.25 9.3 Feature Description.25 9.4 Device Functional Modes.27 9.5 Truth Tables. 27 10 Application and Implementation.28 10.1 Application Information. 28 10.2 Typical Application .28 11 Power Supply Recommendations.30 12 Layout.30 12.1

14、Layout Guidelines.30 12.2 Layout Example.31 13 Device and Documentation Support.32 13.1 Documentation Support.32 13.2 Receiving Notification of Documentation Updates.32 13.3 Support Resources.32 13.4 Trademarks.32 13.5 Electrostatic Discharge Caution.32 13.6 Glossary.32 14 Mechanical, Packaging, and

15、 Orderable Information.32 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (April 2021) to Revision C (July 2021)Page Added the high current support for the TSSOP package. 1 Changed the status of the QFN package

16、 for TMUX621x from: preview to: active .1 Added ESD detail for RUM package. 4 Changed THD+N typical for 12V supply.11 Added the Integrated Pull-Down Resistor on Logic Pins section.25 Updated the Ultra-Low Charge Injection section.26 Updated the TMUX621x Layout Example Figure.31 Changes from Revision

17、 A (January 2021) to Revision B (April 2021)Page Added thermal information for QFN package.5 Updated IDC specs for TSSOP package in Source or Drain Continuous Current table .5 Added IDC specs for QFN package in Source or Drain Continuous Current table .5 Included Break-before-make time delay for TMU

18、X6213.7 Updated VDD rise time value from 100ns to 1s in TON(VDD) test condition.7 Updated CL value from 1nF to 100pF in Charge Injection test condition.7 Changes from Revision * (October 2020) to Revision A (January 2021)Page Changed status of data sheet from Advanced Information to Production Data

19、.1 TMUX6211, TMUX6212, TMUX6213 SCDS431C OCTOBER 2020 REVISED AUGUST 2Submit Document Feedback Copyright 2021 Texas Instruments Incorporated Product Folder Links: TMUX6211 TMUX6212 TMUX6213 5 Device Comparison Table PRODUCTDESCRIPTION TMUX6211Low-Leakage-Current, Precision, 4-Channel, 1:1 (SPST) Swi

20、tches (Logic Low) TMUX6212Low-Leakage-Current, Precision, 4-Channel, 1:1 (SPST) Switches (Logic High) TMUX6213Low-Leakage-Current, Precision, 4-Channel, 1:1 (SPST) Switches (Logic Low + Logic High) 6 Pin Configuration and Functions Figure 6-1. PW Package 16-Pin TSSOP Top View Figure 6-2. RUM Package

21、 16-Pin WQFN Top View Table 6-1. Pin Functions PIN TYPE(1)DESCRIPTION(2) NAMETSSOPWQFN D1216I/ODrain pin 1. Can be an input or output. D21513I/ODrain pin 2. Can be an input or output. D3108I/ODrain pin 3. Can be an input or output. D475I/ODrain pin 4. Can be an input or output. GND53PGround (0 V) re

22、ference N.C.1210No internal connection. Can be shorted to GND or left floating. S131I/OSource pin 1. Can be an input or output. S21412I/OSource pin 2. Can be an input or output. S3119I/OSource pin 3. Can be an input or output. S464I/OSource pin 4. Can be an input or output. S3119I/OSource pin 3. Can

23、 be an input or output. SEL1115ILogic control input 1, has internal 4 M pull-down resistor. Controls channel 1 state as shown in Section 9.5. SEL21614ILogic control input 2, has internal 4 M pull-down resistor. Controls channel 2 state as shown in Section 9.5. SEL397ILogic control input 3, has inter

24、nal 4 M pull-down resistor. Controls channel 3 state as shown in Section 9.5. SEL486ILogic control input 4, has internal 4 M pull-down resistor. Controls channel 4 state as shown in Section 9.5. VDD1311P Positive power supply. This pin is the most positive power-supply potential. For reliable operat

25、ion, connect a decoupling capacitor ranging from 0.1 F to 10 F between VDD and GND. VSS42P Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging f

26、rom 0.1 F to 10 F between VSS and GND. Thermal Pad The thermal pad is not connected internally. No requirement to solder this pad, if connected it is recommended that the pad be left floating or tied to GND (1)I = input, O = output, I/O = input and output, P = power. (2)Refer to Section 9.4 for what

27、 to do with unused pins. TMUX6211, TMUX6212, TMUX6213 SCDS431C OCTOBER 2020 REVISED AUGUST 2021 Copyright 2021 Texas Instruments Incorporated Submit Document Feedback3 Product Folder Links: TMUX6211 TMUX6212 TMUX6213 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature r

28、ange (unless otherwise noted)(1) (2) MINMAXUNIT VDD VSS Supply voltage 38V VDD0.538V VSS380.5V VSEL or VENLogic control input pin voltage (SELx)0.538V ISEL or IENLogic control input pin current (SELx)3030mA VS or VDSource or drain voltage (Sx, Dx)VSS0.5VDD+0.5V IIK Diode clamp current(3)3030mA IS or

29、 ID (CONT)Source or drain continuous current (Sx, Dx)IDC + 10 %(4)mA TAAmbient temperature55150C TstgStorage temperature65150C TJJunction temperature150C Ptot Total power dissipation (QFN)(5)1650mW Total power dissipation (TSSOP)(5)700mW (1)Stresses beyond those listed under Absolute Maximum Rating

30、may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect

31、device reliability. (2)All voltages are with respect to ground, unless otherwise specified. (3)Pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum ratings. (4)Refer to Source or Drain Continuous Current table for IDC specifications. (

32、5)For QFN package: Ptot derates linearily above TA = 70C by 24.2mW/C. For TSSOP package: Ptot = 700 mW (max) and derates linearily above TA = 70C by 10.7mW/C. 7.2 ESD Ratings VALUEUNIT TMUX621x in PW package V(ESD)Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001, all pins(

33、1) 1500 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 500 TMUX621x in RUM package V(ESD)Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001, all pins(1) 1000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 500 (1

34、)JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2)JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. TMUX6211, TMUX6212, TMUX6213 SCDS431C OCTOBER 2020 REVISED AUGUST 4Submit Document

35、 Feedback Copyright 2021 Texas Instruments Incorporated Product Folder Links: TMUX6211 TMUX6212 TMUX6213 7.3 Thermal Information THERMAL METRIC(1) TMUX621x UNITPW (TSSOP)RUM (WQFN) 16 PINS16 PINS RJA Junction-to-ambient thermal resistance 94.541.5C/W RJC(top)Junction-to-case (top) thermal resistance

36、25.525.1C/W RJBJunction-to-board thermal resistance41.116.5C/W JTJunction-to-top characterization parameter1.10.3C/W JBJunction-to-board characterization parameter40.416.4C/W RJC(bot)Junction-to-case (bottom) thermal resistanceN/A2.9C/W (1)For more information about traditional and new thermal metri

37、cs, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MINNOMMAXUNIT VDD VSS (1)Power supply voltage differential4.536V VDDPositive power supply voltage4.536V VS or VDSignal

38、path input/output voltage (source or drain pin) (Sx, D)VSSVDDV VSEL or VENAddress or enable pin voltage036V IS or ID (CONT)Source or drain continuous current (Sx, D)IDC (2)mA TAAmbient temperature40125C (1)VDD and VSS can be any value as long as 4.5 V (VDD VSS) 36 V, and the minimum VDD is met. (2)Refer to Source or Drain Continuous Current table for IDC specifications. 7.5 Source or Drain Continuous Current at supply voltage of VDD 10%, VSS 10 % (unless otherwise noted) CONTINUOUS CURRENT PER CHANNEL (IDC) (2) TA = 2