Philips-BDP-5012-F-7-A-Service-Manual电路原理图.pdf

上传人:cc518 文档编号:82468 上传时间:2020-10-06 格式:PDF 页数:71 大小:6.05MB
下载 相关 举报
Philips-BDP-5012-F-7-A-Service-Manual电路原理图.pdf_第1页
第1页 / 共71页
Philips-BDP-5012-F-7-A-Service-Manual电路原理图.pdf_第2页
第2页 / 共71页
Philips-BDP-5012-F-7-A-Service-Manual电路原理图.pdf_第3页
第3页 / 共71页
亲,该文档总共71页,到这儿已超出免费预览范围,如果喜欢就下载吧!
资源描述

《Philips-BDP-5012-F-7-A-Service-Manual电路原理图.pdf》由会员分享,可在线阅读,更多相关《Philips-BDP-5012-F-7-A-Service-Manual电路原理图.pdf(71页珍藏版)》请在收音机爱好者资料库上搜索。

1、SERVICE MANUALBLU-RAY DISC PLAYERBDP5012/F7BDP5012/F7 AIMPORTANT SAFETY NOTICEProper service and repair is important to the safe, reliable operation of all P when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (F

2、ig. S-1-6)4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)CAUTION:1. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC.2. Do not supply hot air to the chip parts around the flat

3、pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2)Top ViewOut InBottom ViewInput510Pin 1Pin 1FFC CableConnectorCBA* Be careful to avoid a short circuit.Fig. S-1-11-4-2 BDN_SN3. The flat pack

4、-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it.With Soldering Iron:1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins

5、of the flat pack-IC, you can remove it easily. (Fig. S-1-3)2. Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)3. Bottom of t

6、he flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)Hot-airFlat Pack-ICDesolderingMa

7、chineCBAFlat Pack-ICTweezersMasking TapeFig. S-1-2Flat Pack-ICDesoldering BraidSoldering IronFig. S-1-3Fine TipSoldering IronSharpPinFig. S-1-41-4-3 BDN_SNWith Iron Wire:1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all

8、pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)2. Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5.3. While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA c

9、ontact pads as shown in Fig. S-1-5.4. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)5. Release the flat pack-IC from the CBA using tweez

10、ers. (Fig. S-1-6)Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied.2. Installation1. Using desoldering braid, remove the solder

11、 from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily.2. The “” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of t

12、he flat pack-IC. (See Fig. S-1-8.)3. Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges.To Solid Mounting PointSoldering IronIron WireorHot Air BlowerFig. S-1-5Fine TipSoldering IronCBAFlat Pack-ICTweezersFig. S-1-6Example :Pin 1 of the Flat Pack-ICis indicated by

13、 a “ “ mark.Fig. S-1-7PresolderCBAFlat Pack-ICFig. S-1-81-4-4 BDN_SNInstructions for Handling Semi-conductorsElectrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electrostatic charge during unpacking or repair work.1. Ground for Human BodyBe sure to wear a

14、 grounding band (1 M) that is properly grounded to remove any static electricity that may be charged on the body.2. Ground for WorkbenchBe sure to place a conductive sheet or copper plate with proper grounding (1 M) on the workbench or other surface, where the semi-conductors are to be placed. Because the static electricity charge on clothing will not escape through the body grounding band, be careful to avoid contacting semi-conductors with your clothing.CBAGrounding BandConductive Sheet orCopper Plate1M1MCBA

展开阅读全文
相关资源
猜你喜欢
相关搜索

当前位置:首页 > 功放/音响/收扩 > Philips

copyright@ 2008-2025 收音机爱好者资料库 版权所有
备案编号:鄂ICP备16009402-5号