Philips-DVD-740-VR-Service-Manual电路原理图.pdf

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1、Published by MW 0269 Service PaCE Printed in the Netherlands Subject to modification EN 3122 785 12940Copyright 2002 Philips Consumer Electronics B.V. Eindhoven, The Netherlands. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any f

2、orm or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.DVD-Video Player DVD740VRDVD740VR /001 /051Contents PageLaser Beam Safety Precautions 1-1-1Important Safety Precautions 1-2-1Preparation for Servicing 1-3-1Standart Notes for Servicing 1-4

3、-1Operating Controls and Functions 1-5-1Signal Name Abbreviations 1-6-1Cabinet Disassembly Instructions 1-7-1Electrical Adjustment Instructions 1-8-1Firmware Renewal Mode 1-9-1Block Diagrams 1-10-1Schematic Diagrams/CBAs and Test Points 1-11-1Waveforms 1-12-1Wiring Diagram 1-13-1System Control Timin

4、g Charts 1-14-1IC Pin Function Descriptions 1-15-1Lead Identifications 1-16-1Exploded Views 1-18-1Spare Parts ListMAIN SECTIONDIGITAL VIDEO DISC PLAYER when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-

5、6)(4) Release the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)Caution:1. Do not supply hot air to the chip parts around theflat pack-IC for over 6 seconds because damage tothe chip parts may occur. Put masking tape aroundthe flat pack-IC to protect other parts from damage.(Fig. S-1-2)2. T

6、he flat pack-IC on the CBA is affixed with glue, sobe careful not to break or damage the foil of eachpin or the solder lands under the IC when removingit.Top ViewOut InBottom ViewInput510Pin 1Pin 1FFC CableConnectorCBA* Be careful to avoid a short circuit.Fig. S-1-1Hot-airFlat Pack-ICDesolderingMach

7、ineCBAFlat Pack-ICTweezersMasking TapeFig. S-1-21-3-2 NOTE_1-3With Soldering Iron:(1) Using desoldering braid, remove the solder from allpins of the flat pack-IC. When you use solder fluxwhich is applied to all pins of the flat pack-IC, youcan remove it easily. (Fig. S-1-3)(2) Lift each lead of the

8、flat pack-IC upward one byone, using a sharp pin or wire to which solder willnot adhere (iron wire). When heating the pins, usea fine tip soldering iron or a hot air desolderingmachine. (Fig. S-1-4)(3) Bottom of the flat pack-IC is fixed with glue to theCBA; when removing entire flat pack-IC, first

9、applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)(4) Release the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)With Iron Wire:(1) Using desoldering braid, remove the solder from allpins of the flat pack-IC. When you use solder flux

10、which is applied to all pins of the flat pack-IC, youcan remove it easily. (Fig. S-1-3)(2) Affix the wire to a workbench or solid mountingpoint, as shown in Fig. S-1-5.(3) While heating the pins using a fine tip solderingiron or hot air blower, pull up the wire as the soldermelts so as to lift the I

11、C leads from the CBA contactpads as shown in Fig. S-1-5(4) Bottom of the flat pack-IC is fixed with glue to theCBA; when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)(5) Release the flat pack-IC from

12、the CBA using twee-zers. (Fig. S-1-6)Note:When using a soldering iron, care must be takento ensure that the flat pack-IC is not being held byglue. When the flat pack-IC is removed from theCBA, handle it gently because it may be damagedif force is applied.Flat Pack-ICDesoldering BraidSoldering IronFi

13、g. S-1-3Fine TipSoldering IronSharpPinFig. S-1-4To Solid Mounting PointSoldering IronIron WireorHot Air BlowerFig. S-1-5Fine TipSoldering IronCBAFlat Pack-ICTweezersFig. S-1-61-3-3 NOTE_1-32. Installation(1) Using desoldering braid, remove the solder fromthe foil of each pin of the flat pack-IC on t

14、he CBA soyou can install a replacement flat pack-IC moreeasily.(2) The “ I ” mark on the flat pack-IC indicates pin 1.(See Fig. S-1-7.) Be sure this mark matches the 1on the PCB when positioning for installation. Thenpresolder the four corners of the flat pack-IC. (SeeFig. S-1-8.)(3) Solder all pins

15、 of the flat pack-IC. Be sure that noneof the pins have solder bridges.Instructions for Handling Semi-conductorsElectrostatic breakdown of the semi-conductors mayoccur due to a potential difference caused by electro-static charge during unpacking or repair work.1. Ground for Human BodyBe sure to wea

16、r a grounding band (1M) that is prop-erly grounded to remove any static electricity that maybe charged on the body.2. Ground for WorkbenchBe sure to place a conductive sheet or copper platewith proper grounding (1M) on the workbench orother surface, where the semi-conductors are to beplaced. Because

17、 the static electricity charge on cloth-ing will not escape through the body grounding band,be careful to avoid contacting semi-conductors withyour clothing.Example :Pin 1 of the Flat Pack-ICis indicated by a “ “ mark.Fig. S-1-7PresolderCBAFlat Pack-ICFig. S-1-8CBACBAGrounding BandConductive Sheet o

18、rCopper Plate1M1M1-4-1 H9330PFSPREPARATION FOR SERVICING How to Enter the Service ModeAbout Optical SensorsCaution:An optical sensor system is used for the Tape Startand End Sensors on this equipment. Carefully readand follow the instructions below. Otherwise the unitmay operate erratically.What to

19、do for preparationInsert a tape into the Deck Mechanism Assembly andpress the PLAY button. The tape will be loaded intothe Deck Mechanism Assembly. Make sure the poweris on, TP501 (SENSOR INHIBITION) to GND. This willstop the function of Tape Start Sensor, Tape End Sen-sor and Reel Sensors. (If thes

20、e TPs are connectedbefore plugging in the unit, the function of the sensorswill stay valid.) See Fig. 1.Note: Because the Tape End Sensors are inactive, donot run a tape all the way to the start or the end of thetape to avoid tape damage.About REC-Safety SwitchCaution:The REC-Safety Switch is direct

21、ly mounted on theMain CBA. When the Deck Mechanism Assembly isremoved from the Main CBA for servicing, this switchdoes not work automatically.What to do for preparationIn order to record, press the Rec button while pushingREC-SAFETY SW on the Main CBA. See Fig. 1.(REC-SAFETY SW)SW506Q504TP501S-INHQ503Fig. 11-5-1 H9330IBOPERATING CONTROLS AND FUNCTIONS DVD740VR/001

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