Philips-DVDR-5500-Service-Manual电路原理图.pdf

上传人:cc518 文档编号:83130 上传时间:2020-10-06 格式:PDF 页数:46 大小:12.10MB
下载 相关 举报
Philips-DVDR-5500-Service-Manual电路原理图.pdf_第1页
第1页 / 共46页
Philips-DVDR-5500-Service-Manual电路原理图.pdf_第2页
第2页 / 共46页
Philips-DVDR-5500-Service-Manual电路原理图.pdf_第3页
第3页 / 共46页
亲,该文档总共46页,到这儿已超出免费预览范围,如果喜欢就下载吧!
资源描述

《Philips-DVDR-5500-Service-Manual电路原理图.pdf》由会员分享,可在线阅读,更多相关《Philips-DVDR-5500-Service-Manual电路原理图.pdf(46页珍藏版)》请在收音机爱好者资料库上搜索。

1、2.1 Safety Instructions2.1.1 General SafetySafety regulations require that during a repair: Connect the unit to the mains via an isolation transformer. Replace safety components, indicated by the symbol ,only by components identical to the original ones. Anyother component substitution (other than o

2、riginal type) may increase risk of re or electrical shock hazard.Safety regulations require that after a repair, you must return the unit in its original condition. Pay, in particular, attention tothe following points: Route the wires/cables correctly, and x them with themounted cable clamps. Check

3、the insulation of the mains lead for externaldamage. Check the electrical DC resistance between the mains plug and the secondary side:1. Unplug the mains cord, and connect a wire betweenthe two pins of the mains plug.2. Set the mains switch to the on position (keep themains cord unplugged!).3. Measu

4、re the resistance value between the mains plug and the front panel, controls, and chassis bottom.4. Repair or correct unit when the resistancemeasurement is less than 1 M.5. Verify this, before you return the unit to the customer/user (ref. UL-standard no. 1492).6. Switch the unit off, and remove th

5、e wire between the two pins of the mains plug.2.1.2 Laser SafetyThis unit employs a laser. Only qualied service personnel may remove the cover, or attempt to service this device (due to possible eye injury).Laser Device UnitType : Semiconductor laser GaAlAsWavelength : 650 nm (DVD): 780 nm (VCD/CD)O

6、utput Power : 20 mW(DVD+RW writing): 0.8 mW(DVD reading): 0.3 mW(VCD/CD reading)Beam divergence : 60 degreeCLASS 1LASER PRODUCTFigure 2-1Note: Use of controls or adjustments or performance of procedure other than those specied herein, may result in hazardous radiation exposure. Avoid direct exposure

7、 to beam.2.2 Warnings2.2.1 General All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD, ). Careless handling during repair can reduce life drastically. Make sure that, during repair, you are at the same potential as the mass of the set by a wristband with resistanc

8、e. Keep components and tools at this same potential.Available ESD protection equipment: Complete kit ESD3 (small tablemat, wristband, connection box, extension cable and earth cable) 4822 310 10671. Wristband tester 4822 344 13999. Be careful during measurements in the live voltage section. The prim

9、ary side of the power supply, including the heatsink, carries live mains voltage when you connect the player to the mains (even when the player is off!). It is possible to touch copper tracks and/ or components in this unshielded primary area, when you service the player. Service personnel must take

10、 precautions to prevent touching this area or components in this area. A lightning stroke and a stripe-marked printing on the printed wiring board, indicate the primary side of the power supply. Never replace modules, or components, while the unit is on.2.2.2 Laser The use of optical instruments wit

11、h this product, will increase eye hazard. Only qualied service personnel may remove the cover or attempt to service this device, due to possible eye injury. Repair handling should take place as much as possible with a disc loaded inside the player. Text below is placed inside the unit, on the laser

12、cover shield:Figure 2-22. Safety Information, General Notes & Lead Free RequirementsCAUTION VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAMADVARSEL SYNLIG OG USYNLIG LASERSTRLING VED BNING UNDG UDSTTELSE FOR STRLINGADVARSEL SYNLIG OG USYNLIG LASERSTRLING NR DEKSEL PNES UNNG EK

13、SPONERING FOR STRLENVARNING SYNLIG OCH OSYNLIG LASERSTRLNING NR DENNA DEL R PPNAD BETRAKTA EJ STRLENVARO! AVATTAESSA OLET ALTTIINA NKYVLLE JA NKYMTTMLLE LASER STEILYLLE. L KATSO STEESEENVORSICHT SICHTBARE UND UNSICHTBARE LASERSTRAHLUNG WENN ABDECKUNG GEFFNET NICHT DEM STRAHL AUSSETSEN DANGER VISIBLE

14、 AND INVISIBLE LASER RADIATION WHEN OPEN AVOID DIRECT EXPOSURE TO BEAMATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS DOUVERTURE EXPOSITION DANGEREUSE AU FAISCEAU2.3 Lead Free RequirementInformation about Lead-free produced setsPhilips CE is starting production of lead-free sets from 1.1.200

15、5 onwards. INDENTIFICATION:Regardless of special logo (not always indicated) One must treat all sets from 1 Jan 2005 onwards, according next rules. Example S/N:Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is the week number, so in this case 1991 wk 18So from 0501 o

16、nwards = from 1 Jan 2005 onwardsImportant note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.Due to lead-free technology some rules have to be resp

17、ected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-pate is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not

18、 easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust yo

19、ur solder tool so that a temperature around 360C 380C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and ux-uid will be destroyed. To avoid wear-out of tips switch

20、 off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the

21、solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable sold

22、ering temperature prole of the specic BGA (for de-soldering always use the lead-free temperature prole, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-lev

23、el seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website.Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all

24、 needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P you nd more information to: BGA-de-/soldering (+ baking instructions) Heating-proles of BGAs and other ICs used in Philips-setsYou will nd this and

25、 more technical information within the “magazine”, chapter “workshop news”.For additional questions please contact your local repair-helpdesk.1. Firmware Upgrading 1.1. Preparation to upgrade firmware Download the latest software release package. Extract the files from ZIP archive (Do not rename the

26、 filename). Start the CD Burning Software and create a new CD project (data disc) with the following settings: File System: Joliet Format: MODE 1 Recording Mode: SINGLE SESSION (TRACK-AT-ONCE), FINALIZE CD Note: Long file name is necessary for the preparation of the upgrade disc. Place the extracted

27、 file into the root directory of the new CD project. Burn the data onto the CDRs or CD-RWs. Notes: Burn ALL the extracted files onto a single blank CD-R or CD-RW disc for firmware upgrade 1.2. Procedures to apply the System Software Upgrade and Loader Software Upgrade There are 2 upgrade processes s

28、upported: - Normal Upgrade (Software Downgrade is NOT possible) and - Forced Download (Software Downgrade is possible). 1.2.1. Normal Upgrade (All existing settings will remain the same after software upgrade) For normal upgrading, power up the set, open the tray, insert the upgrade disc, close the

29、tray and follow the on screen instructions. VFD will show “ VERIFY - ERASE - UPGRADE ”. After upgrading the set, the Disc will be ejected. Remove the disc and close the tray. Then the set will go to standby. Waking up again from standby, the set will reboot from upgraded flash. 1.2.2. Forced Upgrade

30、 (All the settings will be reset to default /58 version) Notes: After Forced Upgrade, the procedures described in 1.4 must be proceeded to restore the stroke version. Press and Hold Rec key on front Panel. Power ON the set VFD will show “FRC DWLD” Open the tray and insert the upgrade disc. Close the

31、 tray and the sets will start upgrading:-VFD will show “ VERIFY - ERASE - UPGRADE ” After upgrading the set, the Disc will be ejected. Disc tray remains open for 5 minutes and closes after time out without user action. Or, if the tray is closed by the user, then the set goes to standby and boots fro

32、m upgraded flash. (Time out of 5 mins or user action, whichever is earlier, causes the set to go to standby.) Note: Do not press any buttons or interrupt the mains supply during the upgrading process, otherwise the set may become defective. 1.3. How to read out the firmware version to confirm set ha

33、s been upgraded Press “HOME” button on remote control and navigate to Settings - Setup - Version Info. Press the blue button on remote control for OSD to display the Detail Version Info: Figure 1 shows the version info displayed by DVDR5500 EU running 49.0a backend software and drive firmware is 51.

34、05.02.17. Product Number: 5500 EU Software Version: 49.0a URL: Loader Version: FE: 51.05.02.17 Figure 1 : Firmware Information shown by DVDR5500 1.4. Restore the Dynamic Stroke Version It is important to restore the Dynamic Stroke version of the set before returning the repaired set back to the cust

35、omer. Restoring this stroke version will ensure that the set is correctly set for the region. Recorders are configured to a desired stroke version by entering a pre-defined RC key sequence. The RC key sequence is made up of 2 parts: + , where refers to a platform and refers to the stroke version. Fo

36、llow the steps below to change dynamic stroke versions: Close DVD tray with no disc Make sure the OSD to display the home menu. Enter the following RC sequence: for /05 for /31 for /58 While entering the RC sequence, the VFD will display the entered keys The VFD will display “WRNGSTRK” if the incorr

37、ect sequence is entered. If the correct RC sequence is entered and is pressed the VFD will dispaly “STROKEYY” Press standby button to go to standby mode or power off the mains to complete the process Note:It is essential to standby or power off the set for the stroke version restoration to take effe

38、ct. The set will then start in the Virgin Mode. 1. Mechanical Instructions Note: The position numbers given here refers to the Exploded view in chapter 8. 1.1. Dismantling of the DVD Tray cover manually 1) Insert a screwdriver into the slot provided at the bottom of the set and push in the direction

39、 as shown in Figure1 to unlock before sliding the Tray cover 110 out. Figure 1- unlock the tray loader 2) Remove the Tray cover 110 as shown in Figure 2. Figure 2 - remove the tray cover 1.2. Dismantling of the Front Panel 1) Remove 7 screws to loosen Top cover 240. 2) Remove the screws to detach th

40、e Front Panel and loosen the Front Loader Plate190 as shown in Figure 3. The Front Panel Service Position as shown in Figure 4. Figure 3 - detach the front panel Figure 4 - Front Panel Service Position 1.3. Dismantling of the Basic Engine 1) To dismantle the Basic Engine without interference, it is

41、necessary to detach the Front Panel together with the Plate Front Loader. Remove 4 mounting screw as shown in Figure 5 to detach the Basic Engine Assembly 1004 from the Frame 162. Figure 5 - Basic Engine mounting screw Front Panel Insulation Sheet 2) Flip the Basic Engine over to remove 4 screws fro

42、m the PCB protection plate. Service Position of the Basic Engine is shown in Figure 6. Figure 6 - Basic Engine Service Position 1.4. Dismantling of the PSU Board 1) Remove 3 screws and detach the PSU Board 1005 as shown in Figure 7. Figure 7 - PSU remove mounting screws 2) Service position for PSU B

43、oard is given in Figure 8. Figure 8 - PSU Board Service Position Insulation Sheet Insulation Sheet 1.5. Dismantling of the Digital Board 1) Remove 5 screws to loosen the Digital Board 1002 as shown in Figure 9. Figure 9 - Remove mounting screws for Digital Board 2) It is necessary to detach the Fron

44、t Panel for Digital Board Service Position as shown in Figure 10. Figure 10 - Digital Board Service Position 1.6. Dismantling of the Analog Board 1) Remove screws from the Back Plate 230 to detach Analogue Board 1001. Service position for Analogue Board is given in Figure 13. Notes: Beware of short

45、cable connections from the Analog Board to the PSU Board. Make sure them not to come out from the connectors of PSU Board while flipping over the Analog Board for servicing. Insulation Sheet Figure 11 - Analogue Board Service Position Insulation Sheet Beware of the cable connections 1. Technical Spe

46、cifications and Connection Facilities 1.1. PCB Locations PSU Analog Board Digital Board Drive D 5.1 OpenFront Display Board (Behind the Front Plate) Front Standby Board (Behind the Front Plate) 1.2. General Mains voltage: 220V-240V Mains frequency: 50 Hz Power consumption: 23 WStandby Power consumpt

47、ion: 3.2W 1.3. Hybrid Tuner 1.3.1. Hybrid Tuner-Analogue TV Test equipment: Fluke 54200 TV Signal generator Test streams: PAL BG Philips Standard test pattern 1.3.1.1. System B/G, I, L/L, D/K 1.3.1.2. RF Loop Through: Frequency range: 43 MHz 860 M Hz Gain (ANT IN ANT OUT) without amplifier: -4 dB 2 dB Gain (ANT IN ANT OUT) with amplifier: From 2 dB + 3 dB until 2 dB 2 dB 1.3.2. Receiver Output of Euro connector/Cinch to be used for measurements (direct output from front end)

展开阅读全文
相关资源
猜你喜欢
相关搜索

当前位置:首页 > CD/VCD/DVD/MD/DAC > philips

copyright@ 2008-2025 收音机爱好者资料库 版权所有
备案编号:鄂ICP备16009402-5号