Philips-DVP-3960-Service-Manual电路原理图.pdf

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1、. Technical Specifications.1-2 . Safety Instruction, Warning 60HZ Power consumption 10W Power consumption in standby mode 1W Specifications subject to change without prior notice. 1-2 Safety instruction 1. General safety Safety regulations require that during a repair: . Connect the unit to the main

2、s via an isolation transformer. . Replace safety components indicated by the symbol , only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard. Safety regulations require that after a repair, y

3、ou must return the unit in its original condition. Pay, in particular, attention to the following points: . Route the wires/cables correctly, and fix them with the mounted cable clamps. . Check the insulation of the mains lead for external damage. . Check the electrical DC resistance between the mai

4、ns plug and the secondary side: 1) Unplug the mains cord, and connect a wire between the two pins of the mains plug. 2) Set the mains switch the “on” position (keep the mains cord unplug). 3) Measure the resistance value between the mains plug and the front panel, controls, and chassis bottom. 4) Re

5、pair or correct unit when the resistance measurement is less than 1M. 5) Verify this, before you return the unit to the customer/user (ref. UL-standard no. 1492). 6) Switch the unit “off”, and remove the wire between the two pins of the mains plug. 2.Laser safety This unit employs a laser. Only qual

6、ified service personnel may remove the cover, or attempt to service this device (due to possible eye injury). Laser device unit Type : Semiconductor laser GaAlAs Wavelength : 650nm (DVD) : 780nm (VCD/CD) Output power : 7mW (DVD) : 10mW (DVD /CD) Beam divergence: 60 degree Note: Use of controls or ad

7、justments or performance of procedure other than those specified herein, may result in hazardous radiation exposure. Avoid direct exposure to beam. Safety instruction, Warning & Notes 1-3 Warning 1.General . All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD). Car

8、eless handing during repair can reduce life drastically. Make sure that, during repair, you are at the same potential as the mass of the set by a wristband with resistance. Keep components and tools at this same potential. Available ESD protection equipment: 1) Complete kit ESD3 (small tablemat, wri

9、stband, connection box, extension cable and earth cable) 4822 310 10671. 2) Wristband tester 4822 344 13999. . Be careful during measurements in the live voltage section. The primary side of the power supply , including the heat sink, carries live mains voltage when you connect the player to the mai

10、ns (even when the player is “off”!). It is possible to touch copper tracks and/or components in this unshielded primary area, when you service the player. Service personnel must take precautions to prevent touching this area or components in this area. A “lighting stroke” and a stripe-marked printin

11、g on the printed wiring board, indicate the primary side of the power supply. . Never replace modules, or components, while the unit is “on”. 2. Laser . The use of optical instruments with this product, will increase eye hazard. . Only qualified service personnel may remove the cover or attempt to s

12、ervice this device, due to possible eye injury. . Repair handing should take place as much as possible with a disc loaded inside the player. . Text below is placed inside the unit, on the laser cover shield: Notes: Manufactured under licence from Dolby Laboratories. The double-D symbol is trademarks

13、 of Dolby Laboratories, Inc. All rights reserved. CAUTION: VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN, AVOID EXPOSURE TO BEAM. 1-4 Lead-Free requirement for service INDENTIFICATION: Regardless of special logo (not always indicated) One must treat all sets from 1.1.2005 onwards, according next r

14、ules. Important note: In fact also products a little older can also be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have to be respected by the worksh

15、op during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and

16、 to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so

17、that a temperature around 360C 380C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used e

18、quipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid, clean carefully the solder-joint from old solder alloy and re-solder with new so

19、lder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de-solder

20、ing always use highest lead-free temperature profile, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC

21、possibly still has to be baked dry. This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005, containing leaded soldering-tin and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing ch

22、anges. On our website: www.atyourservice.ce.P You find more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets You will find this and more technical information within the “magazine”, chapter “workshop news”. For additional questions

23、 please contact your local repair-helpdesk. Notes 1-5 Mechanical and Dismantling Instructions Dismantling Instruction The following guidelines show how to dismantle the player. Step1: Remove 5 screws around the Top Cover, then remove the Top Cover (Figure 1). Step2: If it is necessary to dismantle L

24、oader or Front Panel, It should be remove the Front door assembly first. (Figure 2) Note: Make sure to operate gently otherwise the guider would be damaged. 2-1 Figure1 Please kindly note that dismantlethe front door assembly carefullyto avoid damage tray and thefront door assembly. Figure 2 Mechani

25、cal and Dismantling Instructions Dismantling Instruction Step3: If the tray cant open in normal way, you can make it through the instruction as below (Figure 3). Note: Make sure to operate gently otherwise the guider would be damaged. Step4: Dismantling Loader, disconnect the 3 connectors aiming in

26、the below figure, and remove 4 screws around the Loader. (Figure 4) 2-2 Figure 3 Push the guider until the tray out. Make sure to operate gently to avoid damage happening. CON 2 CON 1CON 3 Figure 4 Mechanical and Dismantling Instructions Dismantling Instruction Step5: Dismantling Front Panel, discon

27、nect the 1 connector, then release the snaps on the both sides of Front Panel and bottom cabinet , then gently pull the Panel out from the set. (Figure 5 & 6 & 7) 2-3 CON 4 Figure 5 Figure 6 Snap 1 Figure 7 Snap 2 Mechanical and Dismantling Instructions Dismantling Instruction Step6: Dismantling Mai

28、n Board, first disconnect the 1 connector, and then remove 5 screws to dismantle Main board. (Figure 8) Step7: Remove the 2 screws on Power Board to dismantle the Power Board. (Figure 9) 2-4 Figure 9 Figure 8 CON 5 Mechanical and Dismantling Instructions Dismantling Instruction ATTENTION OF REPAIRING Make sure adding silicon glue to fix the capacitor C4 after repairing, ( Avoid the hazard of C4 touching the Top Cover.) Figure 10 Add Silicon glue or Heat glue to fix C4 to keep this status 2-5