Philips-DVP-3236-Service-Manual电路原理图.pdf

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1、DVD Player DVP3236/94 when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) CAUTION: 1. The Flat Pack-IC shape may differ by models

2、. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. 2. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other par

3、ts from damage. (Fig. S-1-2) 3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it. With Soldering Iron: 1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When yo

4、u use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) 2. Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air

5、 desoldering machine. (Fig. S-1-4) Page 4 of 513. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4. Release the flat pack-IC from the CB

6、A using tweezers. (Fig. S-1-6) With Iron Wire: 1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) 2. Affix the wire to a workbench or solid mounting point,

7、as shown in Fig. S-1-5. 3. While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig.S-1-5. 4. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat

8、 pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 5. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being hel

9、d by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. 2. Installation 1. Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily.

10、2. The “ ” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.) 3. Solder all pins of the flat pack-IC. Be sure that none of the pins have solde

11、r bridges. Page 5 of 512. Ground for Workbench Be sure to place a conductive sheet or copper plate with proper grounding (1 M) on the workbench or other surface, where the semi-conductors are to be placed. Because the static electricity charge on clothing will not escape through the body grounding b

12、and, be careful to avoid contacting semi-conductors with your clothing. Instructions for Handling Semiconductors Electrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electrostatic charge during unpacking or repair work. 1. Ground for Human Body Be sure to wear a grounding band (1 M) that is properly grounded to remove any static electricity that may be charged on the body. Page 6 of 51OPERATING CONTROLS AND FUNCTIONS Front Panel Back Panel Page 7 of 51Remote Control Page 8 of 51