Philips-DVDR-7310-H-Service-Manual电路原理图.pdf

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1、 Safety Information, General Notes & Lead Free Requirements2.1 Safety Instructions2.1.1 General SafetySafety regulations require that during a repair: Connect the unit to the mains via an isolation transformer. Replace safety components, indicated by the symbol ,only by components identical to the o

2、riginal ones. Anyother component substitution (other than original type) may increase risk of fi re or electrical shock hazard.Safety regulations require that after a repair, you must return the unit in its original condition. Pay, in particular, attention tothe following points: Route the wires/cab

3、les correctly, and fi x them with themounted cable clamps. Check the insulation of the mains lead for externaldamage. Check the electrical DC resistance between the mains plug and the secondary side:1. Unplug the mains cord, and connect a wire betweenthe two pins of the mains plug.2. Set the mains s

4、witch to the on position (keep themains cord unplugged!).3. Measure the resistance value between the mains plug and the front panel, controls, and chassis bottom.4. Repair or correct unit when the resistancemeasurement is less than 1 M.5. Verify this, before you return the unit to the customer/user

5、(ref. UL-standard no. 1492).6. Switch the unit off, and remove the wire between the two pins of the mains plug.2.1.2 Laser SafetyThis unit employs a laser. Only qualifi ed service personnel may remove the cover, or attempt to service this device (due to possible eye injury).Laser Device UnitType : S

6、emiconductor laser GaAlAsWavelength : 650 nm (DVD): 780 nm (VCD/CD)Output Power : 20 mW(DVD+RW writing): 0.8 mW(DVD reading): 0.3 mW(VCD/CD reading)Beam divergence : 60 degreeCLASS 1LASER PRODUCTFigure 2-1Note: Use of controls or adjustments or performance of procedure other than those specifi ed he

7、rein, may result in hazardous radiation exposure. Avoid direct exposure to beam.2.2 Warnings2.2.1 General All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD, ). Careless handling during repair can reduce life drastically. Make sure that, during repair, you are at

8、the same potential as the mass of the set by a wristband with resistance. Keep components and tools at this same potential.Available ESD protection equipment: Complete kit ESD3 (small tablemat, wristband, connection box, extension cable and earth cable) 4822 310 10671. Wristband tester 4822 344 1399

9、9. Be careful during measurements in the live voltage section. The primary side of the power supply, including the heatsink, carries live mains voltage when you connect the player to the mains (even when the player is off!). It is possible to touch copper tracks and/ or components in this unshielded

10、 primary area, when you service the player. Service personnel must take precautions to prevent touching this area or components in this area. A lightning stroke and a stripe-marked printing on the printed wiring board, indicate the primary side of the power supply. Never replace modules, or componen

11、ts, while the unit is on.2.2.2 Laser The use of optical instruments with this product, will increase eye hazard. Only qualifi ed service personnel may remove the cover or attempt to service this device, due to possible eye injury. Repair handling should take place as much as possible with a disc loa

12、ded inside the player. Text below is placed inside the unit, on the laser cover shield:Figure 2-22. Safety Information, General Notes & Lead Free RequirementsCAUTION VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAMADVARSEL SYNLIG OG USYNLIG LASERSTRLING VED BNING UNDG UDSTTELSE

13、 FOR STRLINGADVARSEL SYNLIG OG USYNLIG LASERSTRLING NR DEKSEL PNES UNNG EKSPONERING FOR STRLENVARNING SYNLIG OCH OSYNLIG LASERSTRLNING NR DENNA DEL R PPNAD BETRAKTA EJ STRLENVARO! AVATTAESSA OLET ALTTIINA NKYVLLE JA NKYMTTMLLE LASER STEILYLLE. L KATSO STEESEENVORSICHT SICHTBARE UND UNSICHTBARE LASER

14、STRAHLUNG WENN ABDECKUNG GEFFNET NICHT DEM STRAHL AUSSETSEN DANGER VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID DIRECT EXPOSURE TO BEAMATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS DOUVERTURE EXPOSITION DANGEREUSE AU FAISCEAUSafety Information, General Notes & Lead Free Requiremen

15、ts2.3 Lead Free RequirementInformation about Lead-free produced setsPhilips CE is starting production of lead-free sets from 1.1.2005 onwards. INDENTIFICATION:Regardless of special logo (not always indicated) One must treat all sets from 1 Jan 2005 onwards, according next rules. Example S/N:Bottom l

16、ine of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is the week number, so in this case 1991 wk 18So from 0501 onwards = from 1 Jan 2005 onwardsImportant note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-f

17、ree). So best to always use SAC305 and the higher temperatures belong to this.Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-pate is required, please conta

18、ct the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperatur

19、e of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around 360C 380C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid tem

20、peratures above 400C otherwise wear-out of tips will rise drastically and fl ux-fl uid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoi

21、d mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-

22、material (commodities) has to be purchased at external companies. Special information for BGA-ICs:- always use the 12nc-recognizable soldering temperature profi le of the specifi c BGA (for de-soldering always use the lead-free temperature profi le, in case of doubt) - lead free BGA-ICs will be deli

23、vered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-

24、website.Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P y

25、ou fi nd more information to: null BGA-de-/soldering (+ baking instructions)null Heating-profi les of BGAs and other ICs used in Philips-setsYou will fi nd this and more technical information within the “magazine”, chapter “workshop news”.For additional questions please contact your local repair-hel

26、pdesk.DVDR7310H_Alignment.doc 1. Alignments & Test Procedures 1.1. Reprogramming Procedure of NVM on the Digital Board The NVM, item 7809 on the Digital board contains the following: Slash information (or slash version) IEEE Unique number The slash version and IEEE Unique number are stored at the en

27、d of the production line of the set. In case of failure the Digital board is replaced by a new board (the NVM is an empty device). After replacement of the NVM the set can only startup in Diagnostic software mode because the Slash version is not in placed. By way of commands via the Diagnostic Softw

28、are (DS) and hyperterminal connection to the PC, these factory settings must be restored into the NVM. 1.1.1. Slash Version The slash version is stored with DS command 1217 followed by the slash version as parameter. The slash versions used in DVDR7310H are as follows: DVDR7310H/05 11208 DVDR7310H/3

29、1 11207 DVDR7310H/51 11222 DVDR7310H/58 11207 Example: DS: 1217 11221 With DS command 1218 the slash version can be displayed 1.1.2. IEEE Unique Number 1. Note the serial number of the set example: VN050136130156 - VN = production center (VN.Szekesfehervar). According to UAW-500: V=22 and N=14 - 05

30、= change code (this is not used for this calculation) - 01 = YEAR - 36 = Production WEEK - 130156 = Lot and SERIAL number 2. Calculate the unique number: this number always exists out of 10 hexadecimal numbers 3. First 5 numbers: First we calculate a decimal number according to formula below: - 3582

31、8*YEAR + 676*WEEK + 26*A + H + 8788 - The figures are fixed, YEAR + WEEK + production center code (A + H) are variables - Example: 35828*01 + 676*36 + 26*1 + 8 + 8788 = 68986 (decimal) - Then we translate this decimal number to a hexadecimal number. - Example: 68986 = 10D7A (hex) 4. Last 5 numbers:

32、The last 5 numbers exist out of the Lot and SERIAL number. We have to translate the decimal number to the next 5 hexadecimal numbers: Example: 130156 (decimal) = 1FC6C (hex) 5. This IEEE Unique number (10-digit hexadecimal number) is stored with DS command 1207. Example: DS:1207 10D7A1FC6C 120700: T

33、est OK The set has now its original IEEE unique number. With DS command 1208 the slash version can be displayed 1.2. Reprogramming Procedure of NVM on the Digital Board The Boot Eeprom, item 7810 on the Digital board contains the “Diversity String” that tells the software during DVDR7310H_Alignment.

34、doc startup which hardware version is present. This setting is stored during the production of the Digital board. In case of failure and the Digital board has been replaced it is adviseable to ensure that the Eeprom containing the correct boot script. With DS command 1228 the settings can be display

35、ed. Note: An error in the Diversity string will render the set not able to boot-up and the Digital board becomes defective Via the Dignostic Software the “Diversity String” is stored with the command 1226, followed by the “Diversity String” as parameter. The Diversity strings used in BHDR2/02 is as

36、follows: 444248499BFB40014630355F330000005504030000010102000101004008080044564452323030312E3030310102020808000000010002010000000000000000 Example: DS: 1226 444248499BFB40014630355F330000005504030000010102000101004008080044564452323030312E3030310102020808000000010002010000000000000000 Test OK 1.3. La

37、ser Control Adjustment No Laser control adjustment is necessary because the Basic Engine (Drive) delivered by the factory is already pre-aligned to optimum matching between the Frontend (Servo) Board & the OPU unit in the Basic Engine. 1.3.1. Adjustment procedure This adjustment is done with the DSW

38、 software nucleus 931. The adjustments takes about 30 seconds and the data is stored in the OPU Eeprom. Example: DS: 931 93100 Test OK 1.4. Procedure for Formatting a new HDD drive In case of failure the HDD is replaced by a new unformatted HDD. To prepare the new HDD for use it must be formatted wi

39、th a Master DVD via the Diagnostic software nucleus 2107. Example: DS: 2107 Please insert the Master DVD Executing transfer table 1 of 4. Please wait. 210700: Transfer OK Test OK DVDR7310H/05/31/51/58 Service Part List 0110 3139 244 14751 COVER TRAY DVDR7310H 0182 3103 604 00291 SCREW SAFETY HOLDER

40、0184 3103 604 01311 SPACER 9 0189 3103 603 20141 SPACER RUBBER IDE CABLE 0190 2422 015 00493 SADDLE WIRE NY6/6 NT 19.1MM B 0192 3103 604 01861 DAMPER HDD 0194 3103 603 20201 AIR GUIDE 0195 2822 031 00041 FAN 12VDC 0.8W 3100RPM B 0202 3103 601 20612 SPRING GROUND TUNER 0204 3103 601 20212 SPRING I-LI

41、NK 0205 3103 601 20291 SPRING ESD 0206 3103 601 20231 SPRING GROUND 0230 3139 247 61211 PLATE BACK HDMI EUR DVDR7300H 0240 3103 607 51621 COVER ASSY DVDR5300H 0292 2522 200 98475 SCR PAN TORX ST BK #6-32X6 0293 3103 600 30021 SCREW-DAMPER-M3 0341 2422 549 00739 REMOTE CONTR DVDR5350H/7300H B 0345 24

42、22 070 98135 $ MAINSCORD UK 5A 1M8 VH BK B /05 0345 2422 070 98151 $ MAINSCORD EUR 1M5 BK B /31/51/58 0351 2422 076 00825 CBLE SCART 1M5 SCART 21P BK B 0352 2422 076 00522 G-LINK CABLE & TRANSMITTER 0353 3103 140 25022 CONNECT. CABLE PAL 0901 3143 027 66211 FRONT CAB ASSY DVDR7310H EUR 0902 3143 027

43、 63321 COVER DUST ASSY DVDR9000H 0920 3143 027 66201 FRAME ASSY DVDR7310H 1001 3103 608 51941 PBAS AB 04 E3/5300H 1002 3139 248 86101 PCBAS CHRY-F05 DVDR7300H 1003 3139 247 11362 MODULE DRIVE D4.3 CLOSED 1004 3139 247 11985 $ MODULE PSU 05H8000 EU 1005 3103 608 51872 PBAS PSCAN HDMI VIE L 1006 2822

44、062 00099 HDD 3.5 250GB 6L250R0 (MAXT)Y 1009 3103 608 51242 PBAS DC 04 N1 1011 2422 549 00107 FERRITE CORE RP 25X5X12 Y 1012 3103 601 00861 FFC FOIL 40P/180/40P BD UL 1013 3139 248 86111 PCBAS IDE HDD DVDR7300H 8001 3103 601 00591 CBLE KR 11P/160/11P KR UL 8002 3103 601 00631 FFC FOIL 10P/315/10P BD

45、 FLD UL 8003 3103 601 00751 FFC FOIL 22P/220/22P BD FLD UL 8004 3103 601 00442 CBLE KR 12P/130/12P UL 8005 3103 601 00611 CBLE IDE 40P/400/40P IDE UL 8006 3103 601 00561 CBLE EHR 4P/430/4P LC UL 8007 3103 601 00721 FFC FOIL 22P/220/22P BD FLD UL 8008 3103 601 00571 CBLE EHR 4P/130/4P LC UL 8009 3139

46、 241 01451 FFC FOIL 40P/280/40P BD 0.5MMP 8010 3139 111 02141 FFC FOIL 07P/100/07P BD 1.0MMP 8011 3103 601 00651 FFC FOIL 13P/600/13P AD UL 8012 3103 601 00311 KR 9POL GESCH 370MM 8013 3103 601 00361 IEEE 1394 CHRYSALIS 350MM 0901092009028622 810 13794 dd 2006-09-1410161701015SDRAM_BA1SDRAM_BA0SDRAM

47、_CSNSDRAM_DQMSDRAM_CLKOUT262510SDRAM_WENSDRAM_RASNSDRAM_CASN242728293031SDRAM_DATA19202122233456789SDRAM_ADDRSDRAM_CLKIN18129876543211121314ENC14171819201615345282726252423221VDD02876VDDQVSSVSSQNCBA2k-10ADDQM1312111098765432109102101CLKCKECSWECASRAS0123313029COMOUTIN67012345670123654B|CB|D1R|CR|CRCB

48、G|Y|Y765432107654321G|Y|Y_OUT_0B|U|PB_OUTR|V|PR_OUT_3G|Y|Y_OUT021345677012345AVDD_PLL_BEVSSAVSS_PLL_BE8765AVDDPLL_FE211234568761011121314PLL_PVDDR_VDD1.8612AVSSPLL_FEAVSSPLL_SDI1R_VDDR_VSS567VDDVDDCORE8789432191516175432123452341PLL_PVSSAVDDPLL_SDIFIELD_ID1_PORT1DEV_ADDR0DEV_ADDR1FIELD_ID_PORT2FIELD

49、_ID2_PORT1CTLOUTTEST_IN123VSYNC_PORT2VSYNC1_PORT1VSYNC2_PORT1XTAL_IN00321SDATACLKOUT01TEST346D1_IN254321IN_SELTEST_OUT0TEST_OUT1SCLKXTAL_OUT4765CLK_PORT2HSYNC_PORT2HSYNC1_PORT1HSYNC2_PORT1IN_CLK1_PORT1IN_CLK2_PORT1OERESET_NRESERVEDTESTDEFGHIA1911 F14not usedBCDE123456789101G15NHDMIABC1056789A12BCDEFGHI0005 I81100 D131101 E13