Philips-DVP-3880-K-Mk1-Service-Manual电路原理图.pdf

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1、 TABLE OF CONTENTS PageVersion 1.3 Service Manual PHILIPS GB All rights reserved. No part of this publication may be reproduced, stored in aretrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips. CLASS

2、1 LASER PRODUCT Service DVD Player Copyright 2011 Philips Consumer Electronics B.V. Eindhoven, The Netherlands Published by LLL - 1203 BU AVM Printed in The Netherlands Subject to modification 3141 785 35753 DVP3880K(X) DVP3880K/55 First Generation This service manual is for DVP3880K first generatio

3、n model, which is different from the second generation DVP3880K model. For first generation model, the serial number begins with KX 1AxxxxxxxxxxSpecification.1-2 Safety Instruction,Warning 50- 60Hz Power consumption: 10 W Power consumption in standby mode: 0.4 W Accessories supplied Remote control a

4、nd one battery Audio/Video cables User Manual Type: Semiconductor laser InGaAIP (DVD), AIGaAs (CD) W avelength:658nm(D VD ) ,790nm( CD ) OutputP ower:7 .0m W(D VD ) ,1 0.0m W(V CD/ CD ) Beam divergence: 60 degrees 1-5Specifications Note Speci cations are subject to change without notice DVD region c

5、ode Countries China Playable media Disc DVD, DVD-Video, VCD, SVCD, Audio CD DVD+R/+RW, DVD-R/-RW, DVD+R/-R DL (Dual Layer), CD-R/-RW (Maximum number of es: 648) File Video: .avi, .divx, .mp4, .xvid Audio: .mp3, .wma Picture: .jpg, .jpeg USB storage device Compatibility: Hi-Speed USB (2.0) Class supp

6、ort: MSC (Mass Storage Class) File system: FAT16, FAT32 Maximum number of albums/folders: 300 Maximum number of tracks/titles: 648 Video Signal system: PAL, NTSC Composite video output: 1 Vp-p (75 ohm) Component video output: 0.7 Vp-p( 7 5 o h m ) HDMI output: 480i, 480p, 576i, 576p, 720p, 1080i, 10

7、80p For DVP3880K/93 1-6Audio 2-channel analog output AUDIO OUT L 50- 60Hz Power consumption: 10 W Power consumption in standby mode: 0.4 W Accessories supplied Remote control and one battery Audio/Video cables User Manual Type: Semiconductor laser InGaAIP (DVD), AIGaAs (CD) W avelength:658nm(D VD )

8、,790nm( CD ) OutputP ower:7 .0m W(D VD ) ,1 0.0m W(V CD/ CD ) Beam divergence: 60 degrees 1-7Safety instruction 1. General safety Safety regulations require that during a repair: . Connect the unit to the mains via an isolation transformer. . Replace safety components indicated by the symbol , only

9、by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard. Safety regulations require that after a repair, you must return the unit in its original condition. Pay, in particular, attention to the fol

10、lowing points: . Route the wires/cables correctly, and fix them with the mounted cable clamps. . Check the insulation of the mains lead for external damage. . Check the electrical DC resistance between the mains plug and the secondary side: 1) Unplug the mains cord, and connect a wire between the tw

11、o pins of the mains plug. 2) Set the mains switch the “on” position (keep the mains cord unplug). 3) Measure the resistance value between the mains plug and the front panel, controls, and chassis bottom. 4) Repair or correct unit when the resistance measurement is less than 1M . 5) Verify this, befo

12、re you return the unit to the customer/user (ref. UL-standard no. 1492). 6) Switch the unit “off”, and remove the wire between the two pins of the mains plug. 2.Laser safety This unit employs a laser. Only qualified service personnel may remove the cover, or attempt to service this device (due to po

13、ssible eye injury). Laser device unit T ype : Semiconductor laser GaAlAs Wavelength : 650nm (DVD) : 780nm (VCD/CD) Output power : 7mW (DVD) : 10mW (DVD /CD) Beam divergence: 60 degree Note: Use of controls or adjustments or performance of procedure other than those specified herein, may result in ha

14、zardous radiation exposure. Avoid direct exposure to beam. Safety instruction, Warning & Notes 1-8Warning 1.General . All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD). Careless handing during repair can reduce life drastically. Make sure that, during repair, yo

15、u are at the same potential as the mass of the set by a wristband with resistance. Keep components and tools at this same potential. Available ESD protection equipment: 1) Complete kit ESD3 (small tablemat, wristband, connection box, extension cable and earth cable) 4822 310 10671. 2) Wristband test

16、er 4822 344 13999. . Be careful during measurements in the live voltage section. The primary side of the power supply , including the heat sink, carries live mains voltage when you connect the player to the mains (even when the player is “off”!). It is possible to touch copper tracks and/or componen

17、ts in this unshielded primary area, when you service the player. Service personnel must take precautions to prevent touching this area or components in this area. A “lighting stroke” and a stripe-marked printing on the printed wiring board, indicate the primary side of the power supply. . Never repl

18、ace modules, or components, while the unit is “on”. 2. Laser . The use of optical instruments with this product, will increase eye hazard. . Only qualified service personnel may remove the cover or attempt to service this device, due to possible eye injury. . Repair handing should take place as much

19、 as possible with a disc loaded inside the player. . Text below is placed inside the unit, on the laser cover shield: Notes: Manufactured under licence from Dolby Laboratories. The double-D symbol is trademarks of Dolby Laboratories, Inc. All rights reserved. CAUTION: VISIBLE AND INVISIBLE LASER RAD

20、IATION WHEN OPEN, AVOID EXPOSURE TO BEAM. 1-9 Solder Joint 1-10Lead-Free requirement for service INDENTIFICATION: Regardless of special logo (not always indicated) One must treat all sets from 1.1.2005 onwards, according next rules. Important note: In fact also products a little older can also be tr

21、eated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with o

22、rder code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solde

23、r alloy. The solder tool must be able o To reach at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around 360C 380C is reached and stabilized at the sold

24、er joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with lead

25、ed solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-

26、Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de-soldering always use highest lead-free temperature profile, in case of doubt) -

27、 lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. This will be communicated via AYS-web

28、site. Do not re-use BGAs at all. For sets produced before 1.1.2005, containing leaded soldering-tin and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website: www.atyourservice.ce.P You find more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets You will find this and more technical information within the “magazine”, chapter “workshop news”. For additional questions please contact your local repair-helpdesk. Notes 1-11