Philips-HTS-5530-Service-Manual电路原理图.pdf

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1、HTS5530/12/55/78/94 TABLE OF CONTENTS Page Service Manual . Technical Specifications.1-3 . Safety Instruction, Warning 50 Hz Power consumption: 150 W Standbypowerc onsumption:0. 9W D i m e n s i o n s( W x H x D ) :4 3 5x5 8x 3 5 8 (mm) Weight: 3.56 kg Subwoofer Impedanc e:8ohm Speakerdrivers:1 65mm

2、( 6.5 ”)woofer Frequency response: 40 Hz-150 kHz Dimensions (WxHxD): H T S 5 5 2 0 :1 2 0x 3 0 7x 3 6 9( m m ) H T S 5 5 3 0 :1 9 6x 3 9 5x 3 4 2( m m ) Weight: HTS5520: 3.84 kg HTS5530: 6.3 kg Cable length: Product specifications Note without notice. Region codePlayback media DVD-Video, DVD+R/+RW,

3、DVD-R/-RW, DVD+R DL, CD-R/CD-RW,Audio CD,Video CD/SVCD, Picture CD, MP3-CD,WMA-CD, DivX-CD, USB storage device File Format Audio: .mp3, .wma Video: .divx, .divx ultra, .mpeg, .mpg, Picture: .jpeg, .jpg Total output power: HTS5 5 20:800WRMS(30%THD ) HTS5530: 1000 W RMS (30% THD) Frequency response: 2

4、0 Hz-20 kHz / 3dB Country DVD Europe, United Kingdom Latin America Australia, New Zealand Russia, India China Asia Pacific, Taiwan, Korea Country DVD Europe, United Kingdom Latin America Australia, New Zealand Russia, India China Asia Pacific, Taiwan, Korea 1-5 HTS5530/12:HTS5520: 4.3 m HTS5 5 30:4m

5、 Speakers S ystem:fullrangesatellite Speaker impedance: 3 ohm (center), 4 ohm (Front/Rear) S p e a k e rd r i v e r s :2x 3 ”f u l lr a n g e Frequency response: 150 Hz-20 kHz Dimensions (WxHxD): Center:2 80x9 5x92( mm ) Front/Rear:1 00x2 79x1 0 3( mm ) Weight: Center:0.68kg Front/Rear:0.66kg/ each

6、Cable length: Center:2m Front:4m Rear:1 0m T ype:Semic onductorlaserGaAIAs( CD ) W avelength:645-665nm(D VD ) ,77 0 - 800 nm (CD) Outputpower:6m W(D VD ) ,7m W (VCD/CD) Beam divergence: 60 degrees. 1-6 Product specificationsNote Speci cation and design are subject to change without notice.Region cod

7、eFor information about which region this home theater supports, see the type plate on the back or bottom.Playback mediaDVD-Video, DVD+R/+RW, DVD-R/-RW, DVD+R DL, CD-R/CD-RW, Audio CD, Video CD/SVCD, Picture CD, MP3-CD, WMA-CD, DivX-CD, USB storage deviceFile FormatAudio: .mp3, .wma Video: .divx, .di

8、vx ultra, .mpeg, .mpg, .wmv (simple pro le)Picture: .jpeg, .jpg Country DVD Europe, United Kingdom Latin America Australia, New Zealand Russia, India China Asia Pacific, Taiwan, Korea 1-7 HTS5530/941-8Safety instruction 1. General safety Safety regulations require that during a repair: . Connect the

9、 unit to the mains via an isolation transformer. . Replace safety components indicated by the symbol , only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard. Safety regulations require that

10、after a repair, you must return the unit in its original condition. Pay, in particular, attention to the following points: . Route the wires/cables correctly, and fix them with the mounted cable clamps. . Check the insulation of the mains lead for external damage. . Check the electrical DC resistanc

11、e between the mains plug and the secondary side: 1) Unplug the mains cord, and connect a wire between the two pins of the mains plug. 2) Set the mains switch the “on” position (keep the mains cord unplug). 3) Measure the resistance value between the mains plug and the front panel, controls, and chas

12、sis bottom. 4) Repair or correct unit when the resistance measurement is less than 1M . 5) Verify this, before you return the unit to the customer/user (ref. UL-standard no. 1492). 6) Switch the unit “off”, and remove the wire between the two pins of the mains plug. 2.Laser safety This unit employs

13、a laser. Only qualified service personnel may remove the cover, or attempt to service this device (due to possible eye injury). Laser device unit T ype : Semiconductor laser GaAlAs Wavelength : 650nm (DVD) : 780nm (VCD/CD) Output power : 7mW (DVD) : 10mW (DVD /CD) Beam divergence: 60 degree Note: Us

14、e of controls or adjustments or performance of procedure other than those specified herein, may result in hazardous radiation exposure. Avoid direct exposure to beam. Safety instruction, Warning & Notes 1-9Warning 1.General . All ICs and many other semiconductors are susceptible to electrostatic dis

15、charges (ESD). Careless handing during repair can reduce life drastically. Make sure that, during repair, you are at the same potential as the mass of the set by a wristband with resistance. Keep components and tools at this same potential. Available ESD protection equipment: 1) Complete kit ESD3 (s

16、mall tablemat, wristband, connection box, extension cable and earth cable) 4822 310 10671. 2) Wristband tester 4822 344 13999. . Be careful during measurements in the live voltage section. The primary side of the power supply , including the heat sink, carries live mains voltage when you connect the

17、 player to the mains (even when the player is “off”!). It is possible to touch copper tracks and/or components in this unshielded primary area, when you service the player. Service personnel must take precautions to prevent touching this area or components in this area. A “lighting stroke” and a str

18、ipe-marked printing on the printed wiring board, indicate the primary side of the power supply. . Never replace modules, or components, while the unit is “on”. 2. Laser . The use of optical instruments with this product, will increase eye hazard. . Only qualified service personnel may remove the cov

19、er or attempt to service this device, due to possible eye injury. . Repair handing should take place as much as possible with a disc loaded inside the player. . Text below is placed inside the unit, on the laser cover shield: Notes: Manufactured under licence from Dolby Laboratories. The double-D sy

20、mbol is trademarks of Dolby Laboratories, Inc. All rights reserved. CAUTION: VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN, AVOID EXPOSURE TO BEAM. 1-10 1-11 Solder JointLead-Free requirement for service INDENTIFICATION: Regardless of special logo (not always indicated) One must treat all sets fro

21、m 1.1.2005 onwards, according next rules. Important note: In fact also products a little older can also be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rule

22、s have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided be

23、cause paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different appli

24、cations. Adjust your solder tool so that a temperature around 360C 380C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid w

25、ear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid, clean carefully the solder-joint from old so

26、lder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable soldering temperature profil

27、e of the specific BGA (for de-soldering always use highest lead-free temperature profile, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on ind

28、icator-label in the bag, the BGA-IC possibly still has to be baked dry. This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005, containing leaded soldering-tin and components, all needed spare-parts will be available till the end of the service-period

29、. For repair of such sets nothing changes. On our website: www.atyourservice.ce.P You find more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets You will find this and more technical information within the “magazine”, chapter “workshop news”. For additional questions please contact your local repair-helpdesk. Notes 1-12