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1、ContentsChapterAdjustment ProceduresSchematic Diagrams and CBAsExploded ViewsMechanical and Electrical Parts ListsSec. 1: Survey of versions:Published by FU-KC 0524 Service AV Systems Printed in The Netherlands Subject to modificationVersion 1.0/75 PALDVD + VCR Combi DVP3050V/75cCopyright 2005 Phili
2、ps Consumer Electronics B.V. Eindhoven, The NetherlandsAll rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.CLASS 1 LASE
3、R PRODUCTKLASSE 1 LASER PRODUKTKLASS 1 LASER APPARATCLASSE 1 PRODUIT LASERGB 3139 785 31020Service ManualServiceServiceServiceMAIN SECTIONDVD PLAYER when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6
4、)4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)CAUTION:1. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC.2. Do not supply hot air to the chip parts around the flat pack-IC f
5、or over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2)Fig. S-1-11-3-3 DVDN_PC_SN3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solde
6、r lands under the IC when removing it.With Soldering Iron:1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)2. Lift each lead of the flat pack-IC upward one
7、 by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)3. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iro
8、n to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)With Iron Wire:1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied t
9、o all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)2. Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5.3. While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the
10、 CBA contact pads as shown in Fig. S-1-5.4. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)5. Release the flat pack-IC from the CBA using
11、 tweezers. (Fig. S-1-6)Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied.Hot-airFlat Pack-ICDesolderingMachineCBAFlat Pack-ICTw
12、eezersMasking TapeFig. S-1-2Flat Pack-ICDesoldering BraidSoldering IronFig. S-1-3Fine TipSoldering IronSharpPinFig. S-1-4To Solid Mounting PointSoldering IronIron WireorHot Air BlowerFig. S-1-5Fine TipSoldering IronCBAFlat Pack-ICTweezersFig. S-1-61-3-4 DVDN_PC_SN2. Installation1. Using desoldering
13、braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily.2. The “” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presold
14、er the four corners of the flat pack-IC. (See Fig. S-1-8.)3. Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges.Instructions for Handling Semi-conductorsElectrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electrostatic
15、charge during unpacking or repair work.1. Ground for Human BodyBe sure to wear a grounding band (1 M) that is properly grounded to remove any static electricity that may be charged on the body.2. Ground for WorkbenchBe sure to place a conductive sheet or copper plate with proper grounding (1 M) on t
16、he workbench or other surface, where the semi-conductors are to be placed. Because the static electricity charge on clothing will not escape through the body grounding band, be careful to avoid contacting semi-conductors with your clothing.Example :Pin 1 of the Flat Pack-ICis indicated by a “ “ mark
17、.Fig. S-1-7PresolderCBAFlat Pack-ICFig. S-1-8CBAGrounding BandConductive Sheet orCopper Plate1M1MCBA1-4-1 H9923FISFUNCTION INDICATOR SYMBOLSNote:If a mechanical malfunction occurs, the power is turned off. When the power comes on again after that bypressing STANDBY-ON button, an error message is dis
18、played on the TV screen for 5 seconds.TV screenWhen reel or capstan mechanism is not functioningcorrectlyWhen tape loading mechanism is not functioning cor-rectlyWhen cassette loading mechanism is not functioningcorrectlyWhen the drum is not working properlyP-ON Power safety detectionMODE INDICATOR
19、ACTIVEWhen reel or capstan mechanism is not functioning correctly“A R” is displayed on a TV screen. (Refer to Fig. 1.)When tape loading mechanism is not func-tioning correctly“A T” is displayed on a TV screen. (Refer to Fig. 2.)When cassette loading mechanism is not functioning correctly“A C” is displayed on a TV screen. (Refer to Fig. 3.)When the drum is not working properly“A D” is displayed on a TV screen. (Refer to Fig. 4.)P-ON Power safety detection“A P” is displayed on a TV screen. (Refer to Fig. 5.)ARFig. 1ATFig. 2ACFig. 3Fig. 4ADAPFig. 5
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