Philips-MCP-9360-I-Service-Manual电路原理图.pdf

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1、MediaCenter PC ModelMCP9360iService ManualContents Pag e1. About this Manual 2 Contents Page2. Safety Instructions, Warnings and Notes 3 3. System Overview 5 4. Technical Reference 6 5. Required Equipment List 11 6. Diagnosis and Repair Flowchart 12 7. Installation and Initial Checks 13 8. Troublesh

2、ooting - Start-up Failure 16 9. Software Update and Repair 17 10. PC Doctor Diagnostic Tool 21 11. Hardware Tests 23 12. Hardware Repair 39 13. Software Re-installation 62 14. End Test 63 15. Parts Information 64 Copyright 2006 Philips Consumer Electronics B.V. Eindhoven, The Netherlands. All rights

3、 reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without prior permission of Philips. Published by Consumer Electronics Printed in the Netherlands Subject to modifica

4、tion EN 0000 000 00000 EN 2 1. MCP9360i About this Manual 1. About this Manual 1.1. Content of this Manual Note: The MCP9360i will be serviced on a modular level only. Faulty modules will be identified and replaced. Detailed circuit diagrams and technical information on a component level are therefo

5、re not provided in this document. 1.1.1. What is included in this Manual Safety Information System Overview Basic System Block Diagrams Parts / Module Identification Module Functional Descriptions Basic Module Technical Descriptions Basic Measuring Point Information Basic Fault Finding Strategy Modu

6、le Removal & Replacement Procedures Functionality Testing Procedures End Test Sequence / Checklist Parts List / 12NC Numbers 1.2. Additional Documentation The following documentation is supplied by Philips and must be kept with this Service Manual. MCP9360i Quick Install Guide MCP9360i Use Cases RC4

7、370 Remote Control User Manual Safety Instructions, Warnings and Notes MCP9360i 2. EN 3 2. Safety Instructions, Warnings and Notes 2.1. Safety Instructions 2.1.1. Safety components Replace safety components, indicated by the symbol , only by components identical to the original ones. Any other compo

8、nent substitution (other than original type) may increase risk of fire or electrical shock hazard. 2.1.2. After repair Safety regulations require that after a repair, the set must be returned in its original condition. Before returning the MCP9360i to the customer always do a safety check. Pay atten

9、tion to the built-in protective devices, leakage current and insulation resistance. 2.2. Warnings 2.2.1. General Never replace modules or other components while the unit is switched “on”. 2.2.2. ESD Protection All ICs and many other semi-conductors are susceptible to electrostatic discharges (ESD).

10、Careless handling during repair can reduce life drastically. When repairing, make sure that you are connected with the same potential as the mass of the set via a wrist wrap with resistance. Keep components and tools also at this potential. 2.3. Notes 2.3.1. Schematic notes All resistor values are i

11、n ohms, and the value multiplier is often used to indicate the decimal point location (e.g. 2K2 indicates 2.2 kohm). Resistor values with no multiplier may be indicated with either an “E“ or an “R“ (e.g. 220E or 220R indicates 220 ohm). All capacitor values are given in micro-farads ( = x10-6), nano

12、-farads (n = x10-9), or pico-farads (p = x10-12). Capacitor values may also use the value multiplier as the decimal point indication (e.g. 2p2 indicates 2.2 pF). An “asterisk“ (*) indicates component usage varies. Refer to the diversity tables for the correct values. The correct component values are

13、 listed in the Spare Parts List. Therefore, always check this list when there is any doubt. EN 4 2. MCP9360i Safety Instructions, Warnings and Notes 2.3.2. Led-free solder Philips CE is producing lead-free sets (PBF) from 1.1.2005 onwards. Identification: The bottom line of a type plate gives a 14-d

14、igit serial number. Digits 5 and 6 refer to the production year, digits 7 and 8 refer to production week (in example below it is 1991 week 18). Figure 2.1-1 Regardless of the special lead-free logo (which is not always indicated), one must treat all sets from this date onwards according to the rules

15、 as described below. Figure 2.1-2 Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free soldering tin Philips SAC305 with order code 0622 149 00106. If lead-free solder paste is required, please contact the manufacturer of your soldering equi

16、pment. In general, use of solder paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free soldering tin. The solder tool must be able: - To reach a solder-tip temperature of at least 400 C. - To stabilize the a

17、djusted temperature at the solder-tip. - To exchange solder-tips for different applications. Adjust your solder tool so that a temperature of around 360 C 380 C is reached and stabilized at the solder joint. Heating time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400 C, ot

18、herwise wear-out of tips will increase drastically and flux-fluid will be destroyed. To avoid wear-out of tips, switch “off” unused equipment or reduce heat. Mix of lead-free soldering tin/parts with leaded soldering tin/parts is possible but PHILIPS recommends strongly to avoid mixed regimes. If th

19、is cannot be avoided, carefully clean the solder-joint from old tin and re-solder with new tin. Use only original spare-parts listed in the Service-Manuals. Not listed standard material (commodities) has to be purchased at external companies. Special information for lead-free BGA ICs: these ICs will

20、 be delivered in so-called “dry-packaging“ to protect the IC against moisture. This packaging may only be opened shortly before it is used (soldered). Otherwise the body of the IC gets “wet“ inside and during the heating time the structure of the IC will be destroyed due to high (steam-) pressure in

21、side the body. If the packaging was opened before usage, the IC has to be heated up for some hours (around 90 C) for drying (think of ESD-protection!). Do not re-use BGAs at all! For sets produced before 1.1.2005, containing leaded soldering tin and components, all needed spare parts will be availab

22、le till the end of the service period. For the repair of such sets nothing changes. In case of doubt whether the board is lead-free or not (or with mixed technologies), you can use the following method: - Always use the highest temperature to solder, when using SAC305 (see also instructions below).

23、- De-solder thoroughly (clean solder joints to avoid mix of two alloys). Caution: For BGA-ICs, you must use the correct temperature profile, which is coupled to the 12NC. For an overview of these profiles, visit the website (needs subscription, but is not available for all regions) You will find th

24、is and more technical information within the “Magazine“, chapter “Repair downloads“. For additional questions please contact your local repair help desk. System Overview MCP9360i 3. EN 5 3. System Overview 3.1. Technical Specification System - General Connection rear CPU: Intel Pentium D 945 Dual co

25、re, 3.4 GHz Video outputs: DVI-D single link Memory: 1024 MB VGA HDD: 250 GB SATA S-video (Y/C) SCART (CVBS + RGB) Optical disc recording: DVD: +RW, +R, -R, -RW, +R DL Video Inputs: S-video (Y/C) CD: -R, -RW CVBS Wireless LAN: IEEE802.11 b/g Audio outputs: 2 x stereo Cinch L/R Optical digital out So

26、ftware installed: Coax digital out Windows XP Media Center Edition LikeMusic Audio inputs: 2 x stereo Cinch L/R Norton Internet Suite Ethernet: 1 x (100 Mb) Cyberlink: Make DVD, CaptureDV, PowerDVD USB: 2 x USB 2.0 Picture improvement: Trimension MCE IEEE1394: 2 x 6 pins Philips Media Manager IR bla

27、ster: 2 x to support up to 3 IR blaster eyes Others: TV in Picture Improvement algorithms: FM radio in Digital Natural Motion Motion adaptive de-interlacing Film mode detector Tuner card: AVerMedia TV system: PAL/SECAM Accessories DVB-T DVI to DVI cable DVI to HDMI cable Connection front SCART cable

28、 Card reader: MS/MS pro (Memory Stick) Digital audio coax cable CF I/II Microdrive (Compact Flash) Power cable Smart Media FM antenna cable MMC/SD (Multi Media Card/Secure Digital) S-video (Y/C) USB 2 x USB 2.0 Stereo audio cable IEEE1394 1x 4 pins (i.LINK) Ethernet cable Microphone 6.3 mm jack 2 x

29、IR blaster with 1 IR transmitter Headphone 6.3 mm jack TV antenna splitter Antenna cable 10 cm Antenna cable 1 m SCART adapter (SCART to CVBS/S-video (Y/C) Audio L/R Cinch Universal remote control with batteries Wireless keyboard with batteries EN 6 4. MCP9360i Technical Reference 4. Technical Refer

30、ence 4.1. System Block Diagram Figure 4.1-1 Technical Reference MCP9360i 4. EN 7 4.2. System Cable Definition 4.2.1. System Cable Schematic J8H1 FP_AUDIO J5A2 J8A2 JAUDIO1FP_1394 FP_USB Cable 1 Cable 2 Cable 3 FP I/O Board PCI Riser TV Tuner Card PCI BusPCI BusJFP1JJFP2 VFD Board JUSB1 J2 J9H1 J6A1

31、J9C2 J7A2 SATAEIDEPCI-E Riser ADD2 Board PCI-EBusPCI-EBusSCART Daughter Card - - Cable 10 SW Board Card Reader JRF1 Cable 4 Cable 5 JFP1- JRF2 Cable 6 RF Board Cable 7 HDD SATAODD EIDECable 8 Cable 9 MOTHERBOARDFront panelFront panelFront panelRear panel Rear panel Rear panel Figure 4.2-1 EN 8 4. MC

32、P9360i Technical Reference 4.2.2. System Cable Definition Table Cable Number Cable Name Start End(s) 1 FP_AUDIO_CABLE MB J8H1 FP BOARD JAUDIO1 2 FP_1394_CABLE MB J5A2 FP BOARD JFP1 3 FP_USB_CABLE MB J8A2 FP BOARD JFP2 4 VFD_USB_CABLE MB J6A1 VFD Board JUSB1 5 IR_BLASTER_INTERNAL_CABLE MB J9C2 VFD BO

33、ARD J2 6 SW_RF_CABLE VFD Board JRF1 SW BOARD JRF2 7 V-TYPE_CABLE MB J7A2 (1) SW BOARD JFP1 (2) CARD READER 8 SATA_HDD_CABLE MB J7F1 HDD 9 ATA33_ODD_CABLE MB EIDE ODD 10 ADD2_SCART_CABLE MB J9H1 (1) ADD2 SCART DAUGHTER CARD (2) GRAPHICS CARD (ADD2 BOARD) Technical Reference MCP9360i 4. EN 9 4.3. PSU

34、Cables and Connectors Definition 4.3.1. PSU Cable Schematic HDD ODD 2x12-pinMain2x2-pin 100-240 VAC 50/60 Hz 4-pinSATAMOTHERBOARDPSU Figure 4.3-1 EN 10 4. MCP9360i Technical Reference 4.3.2. PSU Connector Pin Definition Main Power Connector, 2x12-pin Figure 4.3-2 +12V Power Connector, 2x2-pin Figure 4.3-3 Peripheral Power Connector, 4-pin Figure 4.3-4 Serial ATA (SATA) Power Connector Figure 4.3-5