Philips-HTS-5510-C-Service-Manual电路原理图.pdf

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1、Published by KC-TE 0519 AV Systems Printed in the Netherlands Subject to modifi cation EN 3139 785 31570HTS5510C/75/98DVD PlayerCLASS 1LASER PRODUCT1 Technical Specifi cations and Connection Facilities 2Location of PC Boards 2Technical Specifi cations 3Measurement Setup 4Service Aids 5Lead Free Requ

2、irements 72 Dismantling instructions fr Reparaturen sind Original-Ersatzteile zu verwenden.Sicherheitsbauteile sind durch das Symbol !markiert.ILe norme di sicurezza esigono che lapparecchio venga rimessonelle condizioni originali e che siano utilizzati i pezzi di ricambioidentici a quelli specifica

3、ti.Componenty di sicurezza sono marcati con !GBAfter servicing and before returning set to customer perform a leakagecurrent measurement test from all exposed metal parts to earth ground toassure no shock hazard exist. The leakage current must not exceed0.5mA.Technical Specifi cations and Connection

4、 FacilitiesEN 7HTS5510C/75/98Technical Specifi cations and Connection Facilities 1.Lead Free RequirementsPb(Lead) Free SolderWhen soldering , be sure to use the pb free solder.INDENTIFICATION:Regardless of special logo (not always indicated) one must treat all sets from 1 Jan 2005 onwards, according

5、 next rules:Important note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.Due to lead-free technology some rules have to be respected by the worksho

6、p during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and

7、to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so t

8、hat a temperature around 360C 380C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and fl ux-fl uid will be destroyed. To avoid wear-out of tips switch off un-used

9、equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint

10、from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs:- always use the 12nc-recognizable soldering temperat

11、ure profi le of the specifi c BGA (for de-soldering always use the lead-free temperature profi le, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level se

12、en on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website.Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all need

13、ed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P you fi nd more information to: null BGA-de-/soldering (+ baking instructions)null Heating-profi les of BGAs and other ICs used in Philips-setsYou will f

14、i nd this and more technical information within the “magazine”, chapter “workshop news”.For additional questions please contact your local repair-helpdesk.EN 8 HTS5510C/75/982.2.1 Dismantling of the SD5.5_5dis changer1) The tray can be manually open by inserting a minus screw drive and push the leve

15、r in the direction as shown in Figure 1 to unlock the tray before sliding it out.2) Slide out the tray and remove the Cover Tray (pos 110) as shown in Figure 2. Figure 13) Loosen 7 screws to remove the Front Top.(pos 240)- 2 screw each on the left & right side (pos 272)- 3 screws A behind4) Loosen 6

16、 screws G (see Figure 4a and 4b) to remove the SD5.5_5dis changer.Figure 22. Dismantling InstructionsPush lever in direction shown to open the tray manually2.2 Dismantling of the Tuner Module, AV Board, SD6.3 ,Front Board, PSU Module1) Loosen 2 screw B (see Figure 3a) to remove the Tuner Module (pos

17、 1040). 2) Loosen 4 screws C (see Figure 3b) to remove AV Board 1. 3) Loosen 4 screws D (see Figure 3c) and 2 screws H (see Figure 4a) to remove AV Board 2.4) Loosen 2 screws E (see Figure 4a) to remove the PSU Module.5) Loosen 6 screws I (see Figure 4a) and 4 snap hooks to remove Front Board.- 1 sn

18、ap hook each on the left & right side (pos 161).- 2 snap hooks on the bottom side (pos 161).Figure 3aFigure 3bFigure 3cDABCDismantling Instructions & Service PositionsEN 9HTS5510C/75/98 2.Dismantling Instructions & Service PositionsFigure 4a2.3 Service PositionsFigure 5Figure 7Figure 4bFigure 6Figur

19、e 8IEGHFCatchGInsert Thick Insulation Sheet in between the AV Board 1 and 2.AV Board 2AV Board 1AV Board 1Thick Insulation SheetThick Insulation SheetPSUThick Insulation SheetFront BoardThick Insulation SheetSD6.3AV Board 2EN 10 HTS5510C/75/983. Diagnostic SoftwareService test programTo start servic

20、e test program hold open/close and buttons depressed while plugging in the mains cord Display shows “SERVICE” followed by ROM version “S-Vxx-yy” S refers to Service Mode V refers to Version xx refers to Software version number of BEA (counting up from 01 to 99) yy refers to Software version number o

21、f Front uP (counting up from 01 to 99) Hold open/close and buttons depressed till the Display shown “S-Vxx-yy”TEST Activated with ACTIONEEPROM FORMAT TEST DISC 1 Load default data. Display shows “NEW”. Caution! All presets from the customer will be lost! ROTARY ENCODER TEST Volume KnobDisplay shows

22、value for 2 seconds. Volume values increases or decreases in steps of 1 until 0 (VOL MIN) or 40 (VOL MAX) is reached.LEAVE SERVICETEST PROGRAMDisconnectmains cordMain MenuKey“Display Test”triggered?Display TestnActivate and display“Pattern1”yDisplay TestFollowing display patterns are used to test th

23、e display and its connections to P. Pattern 1:All display control pins are ONAll LEDs are ON.- to check for open-circuitsPattern 2:Alternate display control pins are ON (Test Pattern: 0x55)The following LEDs are ON:DiscAvailable1DiscAvailable3DiscAvailable5DiscActive2DiscActive4- to check for short-circuits(tbd)Key“Display Test”triggered?nyActivate and display“Pattern2”Key“ ”triggered?nyKey“ ”triggered?yn3. Diagnostic Software