Philips-HTS-3155-Service-Manual电路原理图.pdf

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1、71-21-21-31-41-51-61-72345678%7%)PNF5IFBUFS4ZTUFN3139 7853 3100 KC-ET0739ChapterHTS3155/78-0$“5*0/01$#0“3%47fr Reparaturen sind Original-Ersatzteile zu verwenden.Sicherheitsbauteile sind durch das Symbol ! markiert.ILe norme di sicurezza esigono che lapparecchio venga rimessonelle condizioni origina

2、li e che siano utilizzati i pezzi di ricambioidentici a quelli specificati.Componenty di sicurezza sono marcati con ! .GBAfter servicing and before returning set to customer perform a leakagecurrent measurement test from all exposed metal parts to earth groundto assure no shock hazard exist, The lea

3、kage current must notexceed 0.5mA.CLASS 1LASER PRODUCT3122 110 03420GBWarning !Invisible laser radiation when open.Avoid direct exposure to beam.SVarning !Osynlig laserstrlning nr apparaten r ppnad och sprrenr urkopplad. Betrakta ej strlen.SFVaroitus !Avatussa laitteessa ja suojalukituksen ohitettae

4、ssa olet alttiinankymttmlle laseristeilylle. l katso steeseen!GBWARNINGAll ICs and many other semi-conductors aresusceptible to electrostatic discharges (ESD).Careless handling during repair can reduce lifedrastically.When repairing, make sure that you areconnected with the same potential as the mas

5、sof the set via a wrist wrap with resistance.Keep components and tools also at thispotential.FATTENTIONTous les IC et beaucoup dautressemi-conducteurs sont sensibles auxdcharges statiques (ESD).Leur longvit pourrait tre considrablementcourte par le fait quaucune prcaution nestprise leur manipulation

6、.Lors de rparations, sassurer de bien tre reliau mme potentiel que la masse de lappareil etenfiler le bracelet serti dune rsistance descurit.Veiller ce que les composants ainsi que lesoutils que lon utilise soient galement cepotentiel.ESDDWARNUNGAlle ICs und viele andere Halbleiter sindempfindlich g

7、egenber elektrostatischenEntladungen (ESD).Unsorgfltige Behandlung im Reparaturfall kandie Lebensdauer drastisch reduzieren.Veranlassen Sie, dass Sie im Reparaturfall berein Pulsarmband mit Widerstand verbundensind mit dem gleichen Potential wie die Massedes Gertes.Bauteile und Hilfsmittel auch auf

8、dieses gleichePotential halten.DKAdvarse !Usynlig laserstrling ved bning nr sikkerhedsafbrydere erude af funktion. Undg udsaettelse for strling.F“Pour votre scurit, ces documents doivent tre utiliss pardes spcialistes agrs, seuls habilits rparer votreappareil en panne“.GBESD PROTECTION EQUIPMENTComp

9、lete Kit ESD3 (small tablemat, wristband,connection box, estention cable and earth cable.4822 310 10671Wristband tester.4822 344 139991-7Pb(Lead) Free SolderWhen soldering , be sure to use the pb free solder.INDENTIFICATION:Regardless of special logo (not always indicated)one must treat all sets fro

10、m 1 Jan 2005onwards, accordingnext rules:Important note:In fact also products of year 2004 mustbe treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305and the higher temperatures belong to this.Due to lead-free technology some rules have to b

11、erespected by the workshop during a repair:Use only lead-free solder alloy Philips SAC305 withorder code 0622 149 00106. If lead-free solder-pasteis required, please contact the manufacturer of yoursolder-equipment. In general use of solder-pastewithin workshops should be avoided because paste isnot

12、 easy to store and to handle.Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be ableTo reach at least a solder-temperature of 400g36C,To stabilize the adjusted temperature at the solder-tipTo exchange solder-tips for different applications.Adjust your solde

13、r tool so that a temperature around360g36C 380g36C is reached and stabilized at the solderjoint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400g36C otherwisewear-out of tips will rise drastically and flux-fluid willbe destroyed. To avoid wear-out of tips switc

14、h off un-used equipment, or reduce heat.Mix of lead-free solder alloy / parts with leaded solderalloy / parts is possible but PHILIPS recommendsstrongly to avoid mixed solder alloy types (leaded andlead-free).If one cannot avoid or does not know whether productis lead-free, clean carefully the solde

15、r-joint from oldsolder alloy and re-solder with new solder alloy(SAC305).Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities)has to be purchased at external companies.Special information for BGA-ICs:Always use the 12nc-recognizable solderingtemperat

16、ure profile of the specific BGA (for de-soldering always use the lead-free temperature profile,in case of doubt)Lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) toprotect the IC against moisture. After opening,dependent of MSL-level seen on ind

17、icator-label in thebag, the BGA-IC possibly still has to be baked dry.(MSL=Moisture Sensitivity Level). This will becommunicated via AYS-website.Do not re-use BGAs at all.For sets produced before 1.1.2005 (except productsof 2004), containing leaded solder-alloy andcomponents, all needed spare-parts

18、will be availabletill the end of the service-period. For repair of suchsets nothing changes.On our website www.atyourservice.ce.Pyou find more information to:BGA-de-/soldering (+ baking instructions)Heating-profiles of BGAs and other ICs used inPhilips-setsYou will find this and more technical infor

19、mationwithin the “magazine”, chapter “workshop news”.For additional questions please contact your localrepair-helpdesk.CAUTION !This information is con ncial and may notbe distributed. Only a qua d serviceperson should reprogram the Region Code.2 - 22 - 2REPAIR INSTRUSTRATOR3 - 1 3 - 1DISASSEMBLY IN

20、STRUCTIONSDismantling of the Front Panel Assembly1) Open the DVD Tray by using the Open/Close Button while the Set is ON and disconnect the mains supply after removing the Tray Cover.Note: If this is not possible, the DVD Tray has to be open manually.Take a mini screw driver about 2mm diameter and m

21、ake a marking 24mm from the tip as shown in f_i gure 2 . Place the set on its side, insert the mini screw driver till the marking and slide it towards the right as shown in f_i gure 1 until the Tray moves out of the Front Panel.2) Return the set to its upright position and remove the Tray Cover as s

22、hown in Figure 3 and close the tray manually by pushing it back in.3) Loosen 5 screws and remove the Top Cover by lifting the rear portion upwards before sliding it out towards the rear.- 3 screws on the back- 1 screws each on the left & right side4) Loosen 6 screws & lift up the top edge of Front P

23、anel assembly to free some catches before sliding it out towards the front.- 3 screws on the bottom- 1 screw on the inside- 1 screw each on the left & right sideFigure 3Figure 2Dismantling of the Main PCB1) Loosen 4 screw “ A “ on the top of main board as shown in f_i gure 4.2) Loosen 4 screw “B” at the back panel as shown in f_i gure 5.AFigure 4Figure 5pullFigure 1B