Philips-HTS-3500-S-Service-Manual电路原理图.pdf

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1、Published by KC-TE 0519 AV Systems Printed in the Netherlands Subject to modi fi cation EN 3139 785 31191HTS3500S/98/75/51/12/05DVD ReceiverCLASS 1LASER PRODUCT1 Technical Specifi cations and ConnectionFacilities 22 Measurements Setup, Service Aid fr Reparaturen sind Original-Ersatzteile zu verwende

2、n.Sicherheitsbauteile sind durch das Symbol !markiert.ILe norme di sicurezza esigono che lapparecchio venga rimessonelle condizioni originali e che siano utilizzati i pezzi di ricambioidentici a quelli specificati.Componenty di sicurezza sono marcati con !GBAfter servicing and before returning set t

3、o customer perform a leakagecurrent measurement test from all exposed metal parts to earth ground toassure no shock hazard exist. The leakage current must not exceed0.5mA.EN 7HTS3500SMeasurements Setup, Service Aid & Lead Free Requirements 2.2.1 Lead Free RequirementsPb(Lead) Free SolderWhen solderi

4、ng , be sure to use the pb free solder.INDENTIFICATION:Regardless of special logo (not always indicated) one must treat all sets from 1 Jan 2005 onwards, according next rules:Important note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (lea

5、ded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required,

6、please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solde

7、r-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around 360C 380C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 se

8、c. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and fl ux-fl uid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends stro

9、ngly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not list

10、ed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs:- always use the 12nc-recognizable soldering temperature profi le of the specifi c BGA (for de-soldering always use the lead-free temperature profi le, in case of doubt) - lead free BGA-ICs

11、will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communica

12、ted via AYS-website.Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourse

13、rvice.ce.P you fi nd more information to: null BGA-de-/soldering (+ baking instructions)null Heating-profi les of BGAs and other ICs used in Philips-setsYou will fi nd this and more technical information within the “magazine”, chapter “workshop news”.For additional questions please contact your loca

14、l repair-helpdesk.EN 8 HTS3500S3. Dismantling Instructions & Service PositionsB B BFigure 3-3ADFigure 3-4CE3.2 Dismantling of the Tuner Module, MONO Board, Front Board, PSU Module1) Loosen 1 screw A (see Figure 3-3) to remove the Tuner Module (pos 1040).2) Loosen 9 screws B (see Figure 3-3) and 4 sc

15、rews (see Figure 3-4) to remove MONO Board. 3) Release 4 snap hooks to remove Front Board. - 1 snap hook each on the left & right side (pos 161). - 2 snap hooks on the bottom side (pos 161).4) Loosen 4 screws E (see Figure 3-4) to remove the PSU Module.3. Dismantling Instructions3.1 Dismantling of t

16、he DVD Loader1) The tray can be manually open by inserting a minus screw drive and push the lever in the direction as shown in Figure 3-1 to unlock the tray before sliding it out. Figure 3-12) Slide out the tray and remove the Cover Tray (pos 110) as shown in Figure 3-2. Figure 3-23) Loosen 5 screws

17、 to remove the Front Top.(pos 240)- 1 screw each on the left & right side (pos 272)- 3 screws behind 4) Loosen 4 screws C (see Figure 3-4) to remove the DVD Loader.EN 9HTS3500S 3.Dismantling Instructions & Service Positions3.3 Service PositionsMono BoardThick Insulation SheetFront BoardThick Insulat

18、ion SheetPSU BoardDVD LoaderEN 10 HTS3500S4. Service Test Program4. Service Test ProgramTEST Activated with ACTIONEEPROM FORMAT TEST to Exit Load default data. Display shows “NEW”. Caution! All presets from the customer will be lost! ROTARY ENCODER TEST Volume KnobDisplay shows value for 2 seconds.

19、Volume values increases or decreases in steps of 1 until 0 (VOL MIN) or 40 (VOL MAX) is reached.LEAVE SERVICE TEST PROGRAM Disconnect mains cord LX8300SA & LX8320SA & LX8500W_Service Test Program_dd wk0429 To start service test program open the tray with remote control or front panel key, while plug

20、ging in the mains cord press 2, 5 8 on remote control, the tray will close by itself and the set will display shown “S-Vxx-yy”Display shows “SERVICE” followed by ROM version “S-Vxx-yy” S refers to Service Mode V refers to Version xx refers to Software version number of BEA (counting up from 01 to 99

21、) yy refers to Software version number of Front uP (counting up from 01 to 99) 4.1 Display Test Purpose: This test is used to check the driving circuits, the display and whether there are any short-circuits, open-circuits or any other defects.Player: Following display patterns are used to test the d

22、isplay and its connections to P. Pattern 1: Default: All display control pins are ON - to check the open-circuits Pattern 2: Alternate display control pins are on (Test Pattern: 0x55) - to check the short-circuits on Data portReceiver: Following display patterns are used to test the display and its

23、connections to P. Pattern 1: Default: All display control pins are ON - to check the open-circuits Pattern 2: Alternate display control pins are on (Test Pattern: 0x55) - to check the short-circuits on Data port key“DisplayTest“triggered?nyActivate and display “Pattern1“key“DisplayTest“triggered?nyActivate and display “Pattern2“Main MenuDisplay Test key“ “triggered?ny