Technics-SLC-700-E-Service-Manual电路原理图.pdf

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1、 Panasonic Corporation 2015. All rights reserved. Unauthorized copying and distribution is a violation of law. ORDER NO.PSG1502003CE Compact Disc Player Model No.SL-C700E Product Colour: (S) . Silver Type RadioFans.CN 收音机爱 好者资料库 2 TABLE OF CONTENTS PAGEPAGE 1 Safety Precautions -3 1.1. General guide

2、lines-3 2 Warning -4 2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive (ES) Devices-4 2.2. Service caution based on legal restrictions-5 2.3. Precaution of Laser Diode -6 2.4. Handling Precaution for CD DRIVE UINT(Optical Pickup)-7 3 Specifications-8 4 Location of Controls

3、and Components-9 5 Troubleshooting Guide- 11 5.1. Check the problem is reproduced- 11 5.2. No power-12 5.3. LED does not illuminate -17 5.4. No buzzer -17 5.5. Remote control does not operate -17 5.6. No Display -18 5.7. No CD operation-19 5.8. Connector pin configuration -20 5.9. Blocks related to

4、each function-21 6 Disassembly and Assembly Instructions-22 6.1. PCB layout drawing-23 6.2. Removing the disc when the disc cannot be removed using the opening-closing button -25 6.3. Disassembly flow chart -26 6.4. SET LEG UNIT -27 6.5. TOP AL PANEL-27 6.6. TOP CABINET BLOCK-27 6.7. SIDE PANEL (R),

5、 SIDE PANEL (L), TOP PANEL -27 6.8. FRONT PANEL UNIT -28 6.9. TOUCH SENSOR PCB, PICT LIGHTING WINDOW-28 6.10. DISPLAY PCB, OLED ASSY-28 6.11. IR PCB, MAIN SWITCH PCB-29 6.12. FRONT PANEL ASSY -29 6.13. BELT LOADING -29 6.14. CD MECHA BLOCK, DOOR -29 6.15. SPRING, CD LOADING UNIT -30 6.16. INSULATOR,

6、 CD DRIVE UNIT-30 6.17. REAR PANEL-30 6.18. MAIN PCB -31 6.19. SOFTWARE IN 1 PCB, SOFTWARE IN 2 PCB-31 6.20. CD MECHA DRIVE PCB-31 6.21. PS PCB-32 6.22. AC INLET PCB -32 7 Dimensions -33 8 Block Diagram -34 9 Wiring Connection Diagram-35 RadioFans.CN 收音机爱 好者资料库 3 1Safety Precautions 1.1.General guid

7、elines 1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit. 2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly inst

8、alled. 3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards. 1.1.1.Leakage current cold check 1. Unplug the AC cord and connect a jumper between the two prongs on the plug. 2. Measure the resistance value, with an ohmmeter, between

9、 the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1M and 5.2M. When the exposed metal does not have a return path to the cha

10、ssis, the reading must be . 1.1.2.Leakage current hot check (See Figure 1.) 1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check. 2. Connect a 1.5k, 10 watts resistor, in parallel with a 0.15F capacitors, between each exposed metallic part on the set an

11、d a good earth ground such as a water pipe, as shown in Figure 1. 3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor. 4. Check each exposed metallic part, and measure the voltage at each point. 5. Reverse the AC plug in the AC outlet and rep

12、eat each of the above measurements. 6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliampere. In case a measurement is outside of the limits specified

13、, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer. Figure 1 4 2Warning 2.1.Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive (ES) Devices Some semiconductor (solid state) devices can be damaged ea

14、sily by static electricity. Such components commonly are called Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand semiconductor chip components. The following techniques should be used to help reduce the incidence of co

15、mponent damage caused by electrostatic discharge (ESD). 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

16、 which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembl

17、y. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static (ESD protected) can generate electrical charge sufficient to damage ES devices. 5. Do not use freon-propelled che

18、micals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive f

19、oam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. Caution Be sure no power is applied to th

20、e chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricit

21、y sufficient to damage an ES device). 5 2.2.Service caution based on legal restrictions 2.2.1.General description about Lead Free Solder (PbF) The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this equipment in considering

22、the globally environmental conservation. The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86F) more tha

23、n that of the normal solder. Definition of PCB Lead Free Solder being used Service caution for repair work using Lead Free Solder (PbF) The lead free solder has to be used when repairing the equipment for which the lead free solder is used. (Definition: The letter of PbF is printed on the PCB using

24、the lead free solder.) To put lead free solder, it should be well molten and mixed with the original lead free solder. Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC. Since the melting point of the lead free solder is higher than that of the normal lead solder,

25、it takes the longer time to melt the lead free solder. Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 35030 degrees C (66286F). Recommended Lead Free Solder (Service Parts Route.) The following 3 types of lead free solder are available t

26、hrough the service parts route. SVKZ000001-(0.3mm 100g Reel) SVKZ000002-(0.6mm 100g Reel) SVKZ000003-(1.0mm 100g Reel) Note: * Ingredient: Tin (Sn) 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%. (Flex cored) The letter of PbF is printed either foil side or components side on the PCB using the lead free

27、solder. (See right figure) 6 2.3.Precaution of Laser Diode Caution: This product utilizes a laser diode with the unit turned on, invisible laser radiation is emitted from the pickup lens. Wavelength: 790 nm (CD) Maximum output radiation power from pickup: 100 W/VDE Laser radiation from the pickup un

28、it is safety level, but be sure the followings: 1. Do not disassemble the pickup unit, since radiation from exposed laser diode is dangerous. 2. Do not adjust the variable resistor on the pickup unit. It was already adjusted. 3. Do not look at the focus lens using optical instruments. 4. Recommend n

29、ot to look at pickup lens for a long time. ACHTUNG: Dieses Produkt enthlt eine Laserdiode. Im eingeschalteten Zustand wird unsichtbare Laserstrahlung von der Lasereinheitadgestrahit. Wellenlnge : 790nm (CD) Maximale Strahlungsleistung der Lasereinheit :100 W/VDE Die Strahlung an der Lasereinheit ist

30、 ungefhrlich, wenn folgende Punkte beachtet werden: 1. Die Lasereinheit nicht zerlegen, da die Strahlung an der freigelegten Laserdiode gefhrlich ist. 2. Den werkseitig justierten Einstellregler der Lasereinhit nicht verstellen. 3. Nicht mit optischen Instrumenten in die Fokussierlinse blicken. 4. N

31、icht ber lngere Zeit in die Fokussierlinse blicken. CAUTION! THIS PRODUCT UTILIZES A LASER. USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT IN HAZARDOUS RADIATION EXPOSURE. 7 2.4.Handling Precaution for CD DRIVE UINT(Optical Pickup) The laser

32、diode in the CD DRIVE UINT(Optical Pickup) may break down due to static electricity of clothes or human body. Special care must be taken avoid caution to electrostatic breakdown when servicing and handling the laser diode in the Traverse Unit. 2.4.1.Cautions to Be Taken in Handling the CD DRIVE UINT

33、(Optical Pickup) The laser diode in the CD DRIVE UINT(Optical Pickup) may be damaged due to electrostatic discharge generating from clothes or human body. Special care must be taken avoid caution to electrostatic discharge damage when servicing the laser diode. 1. Do not give a considerable shock to

34、 the CD DRIVE UINT(Optical Pickup) as it has an extremely high-precise structure. 2. To prevent the laser diode from the electrostatic discharge damage, the flexible cable of the CD DRIVE UINT(Optical Pickup) removed should be short-circuited with a short pin or a clip. 3. The flexible cable may be

35、cut off if an excessive force is applied to it. Use caution when handling the flexible cable. 4. The antistatic FFC is connected to the new CD DRIVE UINT(Optical Pickup). After replacing the CD DRIVE UINT(Optical Pickup) and connecting the flexible cable, cut off the antistatic FFC. 2.4.2.Grounding

36、for electrostatic breakdown prevention Some devices such as the CD player use the optical pickup (laser diode) and the optical pickup will be damaged by static electricity in the working environment. Proceed servicing works under the working environment where grounding works is completed. 2.4.2.1.Wo

37、rktable grounding 1. Put a conductive material (sheet) or iron sheet on the area where the CD DRIVE UINT(Optical Pickup) is placed, and ground the sheet. 2.4.2.2.Human body grounding 1. Use the anti-static wrist strap to discharge the static electricity form your body. 8 3Specifications 9 4Location

38、of Controls and Components 10 11 5Troubleshooting Guide 5.1.Check the problem is reproduced 5.2 No power 12 13 14 15 16 17 5.3.LED does not illuminate 5.4.No buzzer 5.5.Remote control does not operate 18 5.6.No Display 19 5.7.No CD operation 20 5.8.Connector pin configuration 21 5.9.Blocks related t

39、o each function 22 6Disassembly and Assembly Instructions 23 6.1.PCB layout drawing 6.1.1.Inside the main unit 24 6.1.2.Front part 25 6.2.Removing the disc when the disc cannot be removed using the opening-closing button 1. Turn OFF the main unit, and remove the AC cord. 2. Place the main unit in th

40、e way that its bottom can be seen. 3. Using a flathead screwdriver (small), slide the cam slide seen from the slit at the bottom of the deck in the arrow direction, then slightly eject the tray. 4. The tray appears in front by approx. 1 cm. Holding the front part of the drive, pull it in the arrow d

41、irection lightly, and move the tray. 26 6.3.Disassembly flow chart The following flow chart shows the procedure to disassemble exterior and interior parts for internal inspection. Assembly is done in reverse order of the flow chart. 27 6.4.SET LEG UNIT 1. Remove the screws for removal. Screw: 4 6.5.

42、TOP AL PANEL 1. Remove the screws for removal. Screw: 4 6.6.TOP CABINET BLOCK 1. Remove the TOP AL PANEL. (See 6.5. TOP AL PANEL, step 1.) 2. Remove the screws for removal. Screw: 9 6.7.SIDE PANEL (R), SIDE PANEL (L), TOP PANEL 1. Remove the TOP AL PANEL. (See 6.5. TOP AL PANEL, step 1.) 2. Remove t

43、he TOP CABINET BLOCK. (See 6.6. TOP CABINET BLOCK, step 2.) 3. Turn it over, and remove the screws for removal. Screw: 4 28 6.8.FRONT PANEL UNIT 1. Remove the couplers. Coupler: P805A, P806A, P813A 2. Remove the screws for removal. Screw: 8 6.9.TOUCH SENSOR PCB, PICT LIGHTING WINDOW 1. Remove the FR

44、ONT PANEL UNIT. (See 6.8. FRONT PANEL UNIT, step 1 and 2.) 2. Remove the coupler, screws and F brackets for removal. Coupler: P805B Screw: 2 3. Remove. 6.10.DISPLAY PCB, OLED ASSY 1. Remove the FRONT PANEL UNIT. (See 6.8. FRONT PANEL UNIT, step 1 and 2.) 2. Remove the couplers and screws for removal. *Remove binding wires as necessary. Coupler: P813B, P8881B Screw: 4 3. Remove. 29 6.11.IR PCB, MAIN SWITCH PCB 1. Remov